TELECHIPS


Associated tags: SOC, MCU, Telechips, Mobile phone, Original equipment manufacturer, IVI, Safety, Software, OEM, Android Automotive, Automotive

Locations: UNITED STATES, NORTH AMERICA, ASIA PACIFIC, SOUTH KOREA, EUROPE, GERMANY, MASSACHUSETTS, AD, USA

Telechips Invests in Boston-Based Radar Company, Aura Intelligent Systems to Set Sights on Autonomous Driving Market

Retrieved on: 
Tuesday, March 19, 2024

Telechips (KOSDAQ:054450), led by CEO Jangkyu Lee, is looking to increase its presence in the advanced driver-assistance system (ADAS) and autonomous driving (AD) semiconductor market through investment in a digital imaging radar (RADAR) company.

Key Points: 
  • Telechips (KOSDAQ:054450), led by CEO Jangkyu Lee, is looking to increase its presence in the advanced driver-assistance system (ADAS) and autonomous driving (AD) semiconductor market through investment in a digital imaging radar (RADAR) company.
  • (Graphic: Telechips)
    On March 19th, 2024, Telechips announced its agreement to invest an undisclosed amount in Aura Intelligent Systems (“AURA”), a radar technology solution development firm based in Boston, USA.
  • Telechips joins existing investors including a semiconductor legend Ray Stata (Founder of ADI), Activate Global, and GigaScale Capital.
  • AURA specializes in next-generation radar technologies for Autonomous Driving.

Telechips Earns TISAX Certification for Enhanced Mobility Competitiveness

Retrieved on: 
Tuesday, October 31, 2023

Key Points: 
  • View the full release here: https://www.businesswire.com/news/home/20231031505560/en/
    Telechips obtained TISAX certification for Enhanced Mobility Competitiveness (Graphic: Telechips)
    In the evolving automotive industry, security is increasingly important due to advances in autonomous driving and connectivity.
  • TISAX® (Trusted Information Security Assessment Exchange), a global security certification, was created by the German Association of the Automotive Industry to standardize security assessments based on ISO/IEC 27001 standards.
  • TISAX® certification is a rigorous process that requires a comprehensive review of a company's internal security management system over an extended period.
  • In recent times, Telechips has obtained various international standard certifications, including ASPICE (Automotive SPICE), ISO 27001, and TISAX.

Telechips, a Gamechanger of E/E Architecture with Its New Silicon Line-up for Future Mobility

Retrieved on: 
Monday, September 4, 2023

Telechips (KOSDAQ:054450) is gearing up to make its debut at IAA Mobility 2023, the annual global mobility show set to take place in Germany.

Key Points: 
  • Telechips (KOSDAQ:054450) is gearing up to make its debut at IAA Mobility 2023, the annual global mobility show set to take place in Germany.
  • This move signifies Telechips' endeavor to expand its business and align with the growing demand in the future mobility market shifting towards the Software Defined Vehicles (SDV) trend.
  • Telechips, a comprehensive semiconductor design specialist for automotive applications, was founded in 1999 and became publicly listed on the KOSDAQ market in December 2004.
  • Especially, as the first product in a new silicon line-up, the "N-Dolphin" is slated to be ready for mass production in Q3 2023.

RT-RK integrates mARTini Android container solution on Telechips Dolphin 3

Retrieved on: 
Monday, January 23, 2023

SEOUL, South Korea and NOVI SAD, Serbia, Jan. 23, 2023 /PRNewswire/ -- RT-RK, a leading embedded software development house and Telechips, a world class SoC provider for the automotive industry announce integration of RT-RK's containerized Android solution on Telechips' Dolphin 3 SoC.

Key Points: 
  • SEOUL, South Korea and NOVI SAD, Serbia, Jan. 23, 2023 /PRNewswire/ -- RT-RK, a leading embedded software development house and Telechips, a world class SoC provider for the automotive industry announce integration of RT-RK's containerized Android solution on Telechips' Dolphin 3 SoC.
  • Over the second half of 2022, RT-RK and Telechips have been investing in partnership to deliver joint state-of-the-art solutions for IVI.
  • Driven by the Android Automotive adoption trend by major OEMs worldwide, the key focus of RT-RK and Telechips cooperation is Android Automotive enablement for different market requirements.
  • As announced today, RT-RK's mARTini product, currently the most advanced solution for supporting Android apps within Linux based IVI systems is fully integrated and tested on Telechips' Dolphin 3 SoC, targeting a Yocto based IVI solution.

RT-RK integrates mARTini Android container solution on Telechips Dolphin 3

Retrieved on: 
Monday, January 23, 2023

SEOUL, South Korea and NOVI SAD, Serbia, Jan. 23, 2023 /PRNewswire/ -- RT-RK, a leading embedded software development house and Telechips, a world class SoC provider for the automotive industry announce integration of RT-RK's containerized Android solution on Telechips' Dolphin 3 SoC.

Key Points: 
  • SEOUL, South Korea and NOVI SAD, Serbia, Jan. 23, 2023 /PRNewswire/ -- RT-RK, a leading embedded software development house and Telechips, a world class SoC provider for the automotive industry announce integration of RT-RK's containerized Android solution on Telechips' Dolphin 3 SoC.
  • Over the second half of 2022, RT-RK and Telechips have been investing in partnership to deliver joint state-of-the-art solutions for IVI.
  • Driven by the Android Automotive adoption trend by major OEMs worldwide, the key focus of RT-RK and Telechips cooperation is Android Automotive enablement for different market requirements.
  • As announced today, RT-RK's mARTini product, currently the most advanced solution for supporting Android apps within Linux based IVI systems is fully integrated and tested on Telechips' Dolphin 3 SoC, targeting a Yocto based IVI solution.

Cinemo Galvanizes On-the-move Infotainment at CES 2023

Retrieved on: 
Thursday, January 5, 2023

Cinemo, a global leader in high-performance and automotive-grade multimedia playback, streaming, media management, connectivity, and cloud middleware, will be presenting the latest innovations for its all-encompassing infotainment solutions at CES 2023.

Key Points: 
  • Cinemo, a global leader in high-performance and automotive-grade multimedia playback, streaming, media management, connectivity, and cloud middleware, will be presenting the latest innovations for its all-encompassing infotainment solutions at CES 2023.
  • As Cinemo becomes a prime enabler in placing media control firmly with the user, all passengers can be in the media driving seat.
  • At CES 2023, Cinemo presents its embedded, application- and cloud-based solutions that meet any implementation requirement, for any industry that wants to create great media experiences on any screen:
    - Cinemo CORE™ with a hyper-accelerated browser engine, online content provider support for any OS and SoC, and multi-seat streaming.
  • - Cinemo Air™ Infotainment, the latest, award-winning addition to the Cinemo portfolio, allowing you to take your infotainment system with you wherever you go.

Arteris FlexNoC Interconnect Licensed by Telechips for Use in Advanced Automotive Applications

Retrieved on: 
Tuesday, December 6, 2022

Arteris interconnect IP capabilities enable Telechips SoCs to achieve the low power, scalability and security necessary to create the next level of automotive designs.

Key Points: 
  • Arteris interconnect IP capabilities enable Telechips SoCs to achieve the low power, scalability and security necessary to create the next level of automotive designs.
  • “Telechips excels at building SoCs that offer a solution for various automotive applications with superior performance, low power and security, especially for functional safety,” said Moon Soo Kim, SoC group leader and VP of Telechips.
  • Telechips automotive SoCs are expanding applications, especially in Infotainment and ADAS areas, with advanced performance, security and power efficiency.
  • Arteris, Arteris IP, the Arteris IP logo and other Arteris marks are trademarks of Arteris Inc. or its subsidiaries.

DGAP-News: ​​​​​​​Dialog Semiconductor Selected by Telechips as Preferred Power Management Partner for Next Generation Automotive Platforms

Retrieved on: 
Tuesday, September 15, 2020

Dialog's "Exact Fit" power solution is comprised of the DA9062-A system PMIC, and the recently announced DA9130-A and DA9131-A sub PMICs.

Key Points: 
  • Dialog's "Exact Fit" power solution is comprised of the DA9062-A system PMIC, and the recently announced DA9130-A and DA9131-A sub PMICs.
  • These AEC-Q100 Grade 2 qualified, highly integrated devices deliver a combined 21.5 amps of current, enabling the new Telechips platforms to deliver maximum performance.
  • In addition, the Dolphin 3 platforms use Dynamic Voltage Scaling (DVS) to reduce SoC power dissipation and thermal footprint.
  • This feature, as well as other power savings features including programmable sleep modes, are easily supported by the Dialog Power solution.