OTC-PINK:HXSCL

SK hynix to Showcase Energy-Efficient, High-Performance Memory Products at CES 2023

Retrieved on: 
Monday, December 26, 2022

Attention on energy-efficient memory chips has been on the rise as global tech companies pursue products that process data faster, while consuming less energy.

Key Points: 
  • Attention on energy-efficient memory chips has been on the rise as global tech companies pursue products that process data faster, while consuming less energy.
  • SK hynix is confident that its products to be displayed at the CES 2023 will meet customers' such needs with outstanding performance per watt* and performance.
  • *HBM (High Bandwidth Memory): High-value, high-performance memory that vertically interconnects multiple DRAM chips and dramatically increases data processing speed in comparison to traditional DRAM products.
  • SK hynix will also present the immersion cooling* technology of SK enmove, which specializes in energy efficiency.

SK hynix Develops MCR DIMM - World's Fastest Server Memory Module


MCR DIMM is an achievement coming from out-of-the-box thinking with an aim to improve the operation speed of DDR5.

Key Points: 
  • MCR DIMM is an achievement coming from out-of-the-box thinking with an aim to improve the operation speed of DDR5.
  • SK hynix designed the product in a way that enables simultaneous operation of two ranks by utilizing the data buffer* installed onto the MCR DIMM based on Intel's MCR technology.
  • "SK hynix delivered another technological evolution for DDR5 by developing the world's fastest MCR DIMM," Ryu said.
  • SK hynix expects the market for the MCR DIMM to expand driven by high performance computing that will take advantage of the increased memory bandwidth.