SK hynix to Showcase Energy-Efficient, High-Performance Memory Products at CES 2023
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Monday, December 26, 2022
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Attention on energy-efficient memory chips has been on the rise as global tech companies pursue products that process data faster, while consuming less energy.
Key Points:
- Attention on energy-efficient memory chips has been on the rise as global tech companies pursue products that process data faster, while consuming less energy.
- SK hynix is confident that its products to be displayed at the CES 2023 will meet customers' such needs with outstanding performance per watt* and performance.
- *HBM (High Bandwidth Memory): High-value, high-performance memory that vertically interconnects multiple DRAM chips and dramatically increases data processing speed in comparison to traditional DRAM products.
- SK hynix will also present the immersion cooling* technology of SK enmove, which specializes in energy efficiency.