Gracemont, Oklahoma

ADLINK releases Intel® Amston-Lake-powered modules with up to 8 cores at 12W TDP suiting ruggedized edge solutions

Retrieved on: 
Tuesday, April 9, 2024
Temperature, COM Express, TSN, Intel, Communication, Time-Sensitive Networking, MIPI, Internet of things, LAN, LPDDR5, Transport, AI, PCI Express, Intel Atom, TCC, Robotics, USB, SMARC, Gracemont, Oklahoma, USB 3.2, HMI, TDP, Type 6, CPU, Computer data storage

SAN JOSE, Calif., April 8, 2024 /PRNewswire-PRWeb/ -- Summary:

Key Points: 
  • "Built for highly responsive on-device AI execution and at the same time can withstand ruggedized use scenarios, these new ADLINK COMs allow developers to realize various IoT edge innovations moving forward."
  • Utilizing Intel's Gracemont architecture, with broadened cache and memory bandwidth, responsive coding footprint, combined with soldered-down memory and extreme temperature option, the modules deliver superior performance with great efficiency for wide-ranging ruggedized IoT solutions at the edge.
  • For more information about ADLINK COMs, visit the product pages for: cExpress-ASL (COM Express Type 6) and LEC-ASL (SMARC) modules.
  • Stay tuned, as ADLINK is working to offer another COM Express Type 10 module based on Intel Atom X7000RE & X7000C series processors (Amston Lake).

CES: Intel Extends Performance Leadership with World's Fastest Mobile Processor

Retrieved on: 
Tuesday, January 3, 2023
Apps, Applications, Mobile, Wireless, Technology, Software, Audio, Video, Networks, Internet, Hardware, IOT (Internet of Things), Consumer Electronics, Acceleration, Central processing unit, Microsoft, Mouse, Movidius, Engineering, Thunderbolt (interface), Samsung, Multimedia, HK, IPU, Celeron, Education, Razer, Health, HX, Memory, CES, Client, IOS, LP, Temperature, PCI Express, GPU, DDR4, Stock, Media, Gracemont, Oklahoma, MIPI, VPU, Asus, Intel, IOT, HP, Office automation, Chrome OS, Deep learning, Credit, U series, Data-rate units, Intel Core, MSI, AI, Dell, Safety, PPW, LPDDR5, Sale, CPU, Republic, L2, City, DDR5, Pentium, Microsoft Windows, Computer data storage, Video game, Video game console, Internet service provider, Cassette tape, Semiconductor, Lenovo, Acer

Today at CES, Intel announced its 13th Gen Intel® Core™ mobile processors that bring superior performance and experiences to mobile platforms.

Key Points: 
  • Today at CES, Intel announced its 13th Gen Intel® Core™ mobile processors that bring superior performance and experiences to mobile platforms.
  • View the full release here: https://www.businesswire.com/news/home/20230103005133/en/
    At CES 2023, Intel introduces the 13th Gen Intel Core mobile processor family, powered by Intel’s performance hybrid architecture.
  • (Credit: Intel Corporation)
    “The 13th Gen Intel Core mobile processor family delivers unrivaled, scalable performance for leadership platforms across all laptop segments,” said Michelle Johnston Holthaus, executive vice president and general manager of the Client Computing Group at Intel.
  • More on Intel Processor N-series: New Intel N-series Processors (Media Presentation) | Intel N-series Processors (Product Brief)
    For IoT edge native applications , the Intel Atom® processors x7000E Series, Intel Processor N-series and Intel Core i3 N-series bring deep learning inference, graphics and media processing from our most-power-efficient processors.