SMARC

ADLINK releases Intel® Amston-Lake-powered modules with up to 8 cores at 12W TDP suiting ruggedized edge solutions

Retrieved on: 
Tuesday, April 9, 2024
Temperature, COM Express, TSN, Intel, Communication, Time-Sensitive Networking, MIPI, Internet of things, LAN, LPDDR5, Transport, AI, PCI Express, Intel Atom, TCC, Robotics, USB, SMARC, Gracemont, Oklahoma, USB 3.2, HMI, TDP, Type 6, CPU, Computer data storage

SAN JOSE, Calif., April 8, 2024 /PRNewswire-PRWeb/ -- Summary:

Key Points: 
  • "Built for highly responsive on-device AI execution and at the same time can withstand ruggedized use scenarios, these new ADLINK COMs allow developers to realize various IoT edge innovations moving forward."
  • Utilizing Intel's Gracemont architecture, with broadened cache and memory bandwidth, responsive coding footprint, combined with soldered-down memory and extreme temperature option, the modules deliver superior performance with great efficiency for wide-ranging ruggedized IoT solutions at the edge.
  • For more information about ADLINK COMs, visit the product pages for: cExpress-ASL (COM Express Type 6) and LEC-ASL (SMARC) modules.
  • Stay tuned, as ADLINK is working to offer another COM Express Type 10 module based on Intel Atom X7000RE & X7000C series processors (Amston Lake).

Ezurio Announces the Sona™ MT320: The First Industrial Grade Wi-Fi 6 + Bluetooth Module Powered by MediaTek Filogic 320 Technology

Retrieved on: 
Thursday, April 4, 2024
Sona, OS, FCC, Certification, MediaTek, CE, Bed, SDIO, Wi-Fi, Partnership, Internet of things, Tungsten, UKCA, Linux, SMARC, SMT, Wi-Fi 6, WPA3, HD, Pump, Bluetooth Special Interest Group, Bluetooth, Mobile phone

AKRON, Ohio, April 4, 2024 /PRNewswire/ -- Ezurio, a global leader in connectivity, today announces the upcoming Sona™ MT320 , the latest addition to their growing Wi-Fi 6 module portfolio.

Key Points: 
  • AKRON, Ohio, April 4, 2024 /PRNewswire/ -- Ezurio, a global leader in connectivity, today announces the upcoming Sona™ MT320 , the latest addition to their growing Wi-Fi 6 module portfolio.
  • The Sona MT320 is the first industrial grade Wi-Fi + Bluetooth module based on the segment leading MediaTek Filogic 320 (MT7921) Wi-Fi 6 chipset.
  • This embedded module series has been designed to work seamlessly with the MediaTek Genio processor family targeted at the industrial IoT sector.
  • The Sona MT320 provides a rugged, compact, and globally certified solution that ensures reliable connectivity and easy integration.

Tungsten510 SMARC® System-On-Module from Ezurio Combines Superior Edge Processing with Wi-Fi 6 and Bluetooth 5.3 Connectivity

Retrieved on: 
Thursday, March 28, 2024
Cortex, POS, DSP, MediaTek, Memory, Partnership, Internet of things, Physics, Tablet, HDR, Radio, USB, SMARC, SBC, Hertz, SOM, Projection, Android, ARM Cortex-A55, AVP, Mobile phone

AKRON, Ohio, March 28, 2024 /PRNewswire/ -- Ezurio, a global leader in connectivity, today announces the upcoming Tungsten510 system-on-modules (SOM), in a smart mobility architecture (SMARC) form factor, developed in partnership with MediaTek.

Key Points: 
  • The Tungsten510 SMARC is powered by the MediaTek Genio 510 processor and Ezurio's upcoming Sona™ MT320 Wi-Fi 6/Bluetooth 5.3 module, based on the MediaTek Filogic 320 Wi-Fi/Bluetooth combo radio.
  • Together these solutions provide a comprehensive compute and connectivity platform.
  • This high-performance SOM, when used with the SMARC carrier , also serves as a single board computer (SBC) that can significantly speed customer products to market.
  • The Tungsten510 conforms to the SMARC 2.1.1 standard form factor (82mm x 50mm), with a SMARC edge connector, on board ethernet PHYs, and a USB hub controller.

Laird Connectivity Marks a New Phase of Growth with Strategic Rebrand and Name Change

Retrieved on: 
Tuesday, March 12, 2024
UWB, Internet of things, SBCS, City, SMARC, Wireless, EMC, Engineering, Mobile phone

AKRON, Ohio, March 12, 2024 /PRNewswire/ -- Laird Connectivity, a global leader in wireless technology, today announces it has rebranded as Ezurio, marking a new era of innovation and customer-focused solutions. Ezurio's new name honors the company's heritage of connectivity excellence and forward-looking approach to solving the complex challenges their customers face around the world.

Key Points: 
  • Ezurio's new name honors the company's heritage of connectivity excellence and forward-looking approach to solving the complex challenges their customers face around the world.
  • Ezurio combines Laird Connectivity and Boundary Devices, which together represents decades of experience supporting complex connectivity needs in the medical, industrial, and commercial sectors.
  • Customers, partners, and the industry will see Ezurio's new brand identity roll out across all platforms and materials from today.
  • To learn more about Ezurio, your connectivity expert, and how we are helping to build the connected future, visit ezurio.com/laird-connectivity .

Tungsten700 SMARC® System-On-Module from Laird Connectivity Combines Superior Edge Processing with Wi-Fi 6 and Bluetooth 5.3 Connectivity

Retrieved on: 
Wednesday, July 19, 2023
Cortex, Hertz, Partnership, Projection, ARM Cortex-A55, ARM Cortex-A78, SMARC, Smartphone, DSP, Internet of things, USB, POS, Wireless, Android, HDR, Physics, Tablet, SOM, SBC, Radio, MediaTek, Som, Memory, Mobile phone, Video game

AKRON, Ohio , July 19, 2023 /PRNewswire/ -- Laird Connectivity, a global leader in wireless technology and System-on-Modules (SOMs), announce the Tungsten700 SOM in a smart mobility architecture (SMARC) form factor, developed in partnership with MediaTek.

Key Points: 
  • The Tungsten700 SMARC is powered by the MediaTek Genio 700 processor and Laird Connectivity's upcoming Sona™ MT320 Wi-Fi 6/Bluetooth 5.3 module, based on  the MediaTek Filogic 320 Wi-Fi/Bluetooth combo radio.
  • Together these solutions provide a comprehensive compute and connectivity platform.
  • This high-performance SOM, when used with the new SMARC carrier , also serves as a single board computer (SBC) that can significantly speed customer products to market.
  • The Tungsten700 conforms to the SMARC 2.1.1 standard form factor (82mm x 50mm), with a SMARC edge connector, on board ethernet PHYs, and a USB hub controller.

Nitrogen93 SMARC® System-On-Module from Laird Connectivity Delivers Next-Generation Secure, Smart, Standardized, and Connected IoT

Retrieved on: 
Monday, July 10, 2023
Cortex, Acceleration, NXP Semiconductors, Partnership, Projection, Hertz, ARM Cortex-A55, MX, SMARC, Internet of things, Arm, Bluetooth, Wireless, Physics, Zephyr, SOM, Sona, Gold, Machine learning, SBC, Linux, Radio, Silicon, NXP, Environment, Family, Memory, Mobile phone, Video game, Online shopping

AKRON, Ohio, July 10, 2023 /PRNewswire/ -- Laird Connectivity, a global leader in wireless technology, today announces the Nitrogen93 in a smart mobility architecture (SMARC) form factor, expanding the SOM portfolio conforming to the SMARC industry standard and offering a solution that utilizes both processor and wireless silicon from NXP.

Key Points: 
  • "The Nitrogen93 SMARC delivers on our continuing partnership with NXP by delivering NXP's next generation i.MX 93 processing with optional NXP Wi-Fi 6 and Bluetooth 5.3 wireless connectivity onboard," Said Dan Kephart, senior product manager, Laird Connectivity.
  • "Available in the SMARC 2.1.1 form factor, this product provides a secure, smart, standardized, and connected IoT solution that easily scales with customer's applications."
  • The Nitrogen93 SMARC is ideal for a broad range of applications, including industrial IoT, IoT vision systems, commercial food and beverage equipment, smart building control, and healthcare devices.
  • Laird Connectivity products are specifically designed to meet the needs of the industrial and medical markets, which typically require a 10+ year product lifecycle.

Nitrogen8M Plus SMARC® System-On-Module Combining Powerful NXP Edge Processing with Wi-Fi 5 and Bluetooth 5.2 Connectivity

Retrieved on: 
Thursday, March 30, 2023
Cortex, Acceleration, Projection, Hertz, MX, SMARC, Internet of things, USB, Wireless, Android, ARM Cortex-M, Physics, Zephyr, SOM, Machine learning, SBC, Linux, Radio, ARM Cortex-A53, Silicon, NXP, Som, Environment, Memory, Infineon Technologies, Mobile phone, Video game

The Nitrogen8M Plus SMARC is powered by NXP's innovative i.MX 8M Plus applications processor , NXP PMIC PCA9450, and Laird Connectivity's Sterling™-LWB5+ Wi-Fi 5 & Bluetooth 5.2 combo radio module based on Infineon's CYW4373E silicon.

Key Points: 
  • The Nitrogen8M Plus SMARC is powered by NXP's innovative i.MX 8M Plus applications processor , NXP PMIC PCA9450, and Laird Connectivity's Sterling™-LWB5+ Wi-Fi 5 & Bluetooth 5.2 combo radio module based on Infineon's CYW4373E silicon.
  • "The Nitrogen8M Plus SMARC is our first integrated product that delivers Boundary Devices' SOM and NXP i.MX processor expertise with Laird Connectivity's wireless capabilities," said Dan Kephart, Senior Product Manager, Laird Connectivity.
  • Customers can leverage hardware acceleration with high-performance edge machine learning via an integrated neural processing unit, delivering up to 2.3 TOPS.
  • For more information about the Nitrogen8M Plus SMARC, visit: www.boundarydevices.com/product/nitrogen8m-plus-smarc

Renesas Unveils Powerful 1GHz RZ/A3UL 64-Bit MPUs with RTOS Support That Enable High-Definition HMI and Quick Startup

Retrieved on: 
Thursday, August 4, 2022
Hardware, Semiconductor, Automotive Manufacturing, Electronic Design Automation, Data Management, Manufacturing, Consumer Electronics, Photography, Technology, Audio, Video, Apps, Applications, General Automotive, Telecommunications, Automotive, Software, Engineering, Cortex, AI, Winning Combinations: Deep Purple and Rainbow, Samsung Galaxy Note (original), Combination, HAL, Family, OPI, Hardware abstraction, Lightwave Electronics Corporation, HD, General manager, HMI, Multimedia, RTOS, Renesas Electronics, TSE, LinkedIn, FreeRTOS, Arm Ltd., Technology, IOT, ARM Cortex-A55, Time, POS, MPU, Instagram, DRAM, GitHub, Twitter, IC, ThreadX, Microsoft, Linux, ReMarkable, Office automation, SMARC, MPU-401, YouTube, Video game console, EU, Facebook

View the full release here: https://www.businesswire.com/news/home/20220804005377/en/

Key Points: 
  • View the full release here: https://www.businesswire.com/news/home/20220804005377/en/
    The new RZ/A3UL MPUs integrates an Octal-SPI memory interface*1 that facilitates simpler and more compact board designs.
  • In addition, the new devices include versions that support a DDR3L/DDR4 memory interface to enable connection of high-speed DRAM.
  • Since Renesas is a license provider of Azure RTOS for the RZ Family, users can simply download the high-performance Azure RTOS from GitHub and get started immediately.
  • Renesas has designed an HMI solution, RTOS Based RZ/A3UL HMI SMARC SOM that uses the RZ/A3UL and other compatible devices from Renesas and its partners portfolios.

ADLINK Releases New AIoT SMARC module, a First Based on MediaTek® SoC, featuring Genio 1200 with an 8-core CPU + 5-core GPU

Retrieved on: 
Thursday, June 16, 2022
Cortex, ROS, Industry, SAS, Robotics, Technology, Artificial intelligence, Temperature, ARM, Efficiency, NN, IOT, Health, LinkedIn, Telecommunication, APU, Quidgest, CPU, Acceleration, 3D, MIPI, IO, ADLINK, SMARC, Twitter, COM, Facebook, Transport, Deep learning, MediaTek, GPU, AWS, Align Technology, AI, Intel, Carbon footprint, Video game console, Mobile phone, Renewable energy, NVIDIA

SAN JOSE, Calif., June 15, 2022 /PRNewswire-PRWeb/ -- Summary:

Key Points: 
  • Utilizing the MediaTek Genio 1200 processor, this ADLINK SMARC COM features high-performance AI and graphics-centric capabilities, ideal for various AIoT use cases at the edge.
  • Its spate of functionalities includes support for multiple 4K displays, up to three MIPI camera inputs, and extended IO connectivity.
  • Its features include:
    ADLINK's MediaTek Genio 1200 SMARC Module is part of ADLINK's portfolio of SMARC form factors that support both ARM and x86 designs.
  • Visit ADLINK Technology to learn more about the MediaTek Genio 1200-powered module or ADLINK's prototyping-dedicated I-Pi wiki for its development kit I-Pi SMARC 1200.

Renesas Pioneers RISC-V Technology With RZ/Five General-Purpose MPUs Based on 64-Bit RISC-V CPU Core

Retrieved on: 
Tuesday, March 1, 2022
Electronic Design Automation, Data Management, Semiconductor, Automotive, General Automotive, Technology, Hardware, ECC, Cortex, TSE, Renesas Electronics, Head, Winning Combinations: Deep Purple and Rainbow, Combination, Twitter, Infrastructure, MPU-401, SMARC, Linux, Linux Foundation, CPU, VLP, ISA, Arm, CTI Electronics Corporation, Environment, CIP, Adoption, MPU, LinkedIn, Arm Ltd., Multimedia, Senior, USB, DDR, IOT, Instagram, Maintenance, YouTube, SOC, ReMarkable, Solution, CEO, Gigabit, Video game console, Facebook, EU

Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced the RZ/Five general-purpose microprocessor units (MPUs) built around a 64-bit RISC-V CPU core.

Key Points: 
  • Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced the RZ/Five general-purpose microprocessor units (MPUs) built around a 64-bit RISC-V CPU core.
  • The RZ/Five employs the Andes AX45MP , based on the RISC-V CPU instruction set architecture (ISA).
  • The RZ-Five augments Renesas previously available Arm CPU corebased MPUs, expanding customer options and providing more flexibility in the product development process.
  • With the introduction of the RZ/Five MPUs along with ecosystem support, Renesas is taking the lead in providing RISC-V solutions ahead of the market.