Siemens EDA

Brightly Expands Leadership Team

Retrieved on: 
Friday, March 29, 2024
Software, Professional Services, Internet, Data Management, IOT (Internet of Things), Technology, Digital Cash Management, Digital Assets, Asset Management, Data Analytics, Other Professional Services, Human Resources, Other Technology, Consulting, Culture, Organization, Siemens EDA, Growth, Acquisition, Siemens Digital Industries Software, Hughes, City, Harvard University, Engle, Workplace, Engineering

“Nigel and Christine bring years of strong experience at the global level to their respective fields, and we’re pleased to welcome them to Brightly as we continue our growth,” said Kevin Kemmerer, chief executive officer at Brightly.

Key Points: 
  • “Nigel and Christine bring years of strong experience at the global level to their respective fields, and we’re pleased to welcome them to Brightly as we continue our growth,” said Kevin Kemmerer, chief executive officer at Brightly.
  • She joins Brightly from Maersk, Inc. where she served in many different functions, most recently as the global head of business performance for M&A.
  • “I’m thrilled to join Brightly and look forward to continuing to build on the company’s strong culture,” said Christine Engle, senior vice president, P&O.
  • “Since the acquisition by Siemens Smart Infrastructure in 2022, I’ve seen firsthand how Brightly puts their clients at the center of product innovation and I look forward to continuing this mission,” said Nigel Hughes, head of product at Brightly.

FPT and Siemens Ink MOU, Accelerating Multifaceted Cooperation Globally

Retrieved on: 
Wednesday, February 28, 2024
Other Manufacturing, Technology, Semiconductor, Automotive, Vehicle Technology, Manufacturing, Software, Internet, Data Management, Cloud, MindSphere, USD, Multimedia, AI, Siemens EDA, Memorandum of understanding, Partnership, Growth, FPT Corporation, Digital, FPT, Xcelerator, Workforce, Artificial intelligence, NVIDIA

Harnessing FPT's robust expertise and high-quality workforce, FPT aspires to become the Global SI Partner for Siemens’ low-code platform - Mendix, and Engineering Services Provider for Siemens EDA, focusing on AUTOSAR projects.

Key Points: 
  • Harnessing FPT's robust expertise and high-quality workforce, FPT aspires to become the Global SI Partner for Siemens’ low-code platform - Mendix, and Engineering Services Provider for Siemens EDA, focusing on AUTOSAR projects.
  • Siemens also invites FPT to join its Xcelerator ecosystem to accelerate digital transformation with Siemens' solutions and applications.
  • As a leading chipmaking company in Vietnam, FPT also aims to supply semiconductor chips to Siemens.
  • I believe these will be the stepping stones to enhance cooperation between FPT and Siemens.”
    Mr. Roland Busch, Chairman and CEO of Siemens AG, affirmed that FPT and Siemens have many commonalities: “Siemens has extensive experience in the semiconductor industry, and we are confident in our capability to provide FPT with technological support.

FPT and Siemens Ink MOU, Accelerating Multifaceted Cooperation Globally

Retrieved on: 
Wednesday, February 28, 2024
Vehicle Technology, Data Management, Environment, Technology, Manufacturing, Mobile, Wireless, Semiconductor, Human Resources, Green Technology, Other Education, Consulting, Artificial Intelligence, Professional Services, Education, Automotive, IOT (Internet of Things), Other Technology, Telecommunications, Software, Other Manufacturing, Networks, Hardware, Cloud, MindSphere, USD, Multimedia, AI, Siemens EDA, Memorandum of understanding, Partnership, Growth, FPT Corporation, Digital, FPT, Xcelerator, Workforce, Artificial intelligence, NVIDIA

Harnessing FPT's robust expertise and high-quality workforce, FPT aspires to become the Global SI Partner for Siemens’ low-code platform - Mendix, and Engineering Services Provider for Siemens EDA, focusing on AUTOSAR projects.

Key Points: 
  • Harnessing FPT's robust expertise and high-quality workforce, FPT aspires to become the Global SI Partner for Siemens’ low-code platform - Mendix, and Engineering Services Provider for Siemens EDA, focusing on AUTOSAR projects.
  • Siemens also invites FPT to join its Xcelerator ecosystem to accelerate digital transformation with Siemens' solutions and applications.
  • As a leading chipmaking company in Vietnam, FPT also aims to supply semiconductor chips to Siemens.
  • I believe these will be the stepping stones to enhance cooperation between FPT and Siemens.”
    Mr. Roland Busch, Chairman and CEO of Siemens AG, affirmed that FPT and Siemens have many commonalities: “Siemens has extensive experience in the semiconductor industry, and we are confident in our capability to provide FPT with technological support.

DVCon U.S. 2024 Announces Keynote Speakers & Panel Focused on Generative AI

Retrieved on: 
Thursday, February 15, 2024
Shift, Automotive industry, Siemens EDA, ARM, Ford Motor Company, FSS, PWG, Texas Instruments, Conference, Accellera, Best, Hilton Hotels & Resorts, Ford, Sasuke (TV series), DoubleTree, Chair, Working Group, Cadence Design Systems, Artificial intelligence, NVIDIA, Cryptocurrency

GAINESVILLE, Fla., Feb. 15, 2024 (GLOBE NEWSWIRE) -- The 2024 Design and Verification Conference and Exhibition United States (DVCon U.S.), sponsored by Accellera Systems Initiative, announced today that there will be two keynote speakers for attendees this year as well as a panel focused on generative Artificial Intelligence (AI).

Key Points: 
  • GAINESVILLE, Fla., Feb. 15, 2024 (GLOBE NEWSWIRE) -- The 2024 Design and Verification Conference and Exhibition United States (DVCon U.S.), sponsored by Accellera Systems Initiative, announced today that there will be two keynote speakers for attendees this year as well as a panel focused on generative Artificial Intelligence (AI).
  • DVCon U.S. 2024 will be held March 4-7 at the DoubleTree by Hilton Hotel in San Jose, California.
  • The first keynote, “ Addressing the Evolving Landscape of Automotive SoCs ,” will be held on Tuesday, March 5 at 1:30 pm.
  • ’” This panel invites participants to share and discuss their perspectives, experiences, insights, and apprehensions regarding the role of generative AI in verification.

Pre-Registration Opens for Chiplet Summit

Retrieved on: 
Monday, January 15, 2024
Software, Networks, Internet, Hardware, Technology, Apps, Applications, Semiconductor, Mobile, Wireless, OCP, Santa Clara Convention Center, Siemens EDA, Beer, Summit, Arm, AI, Micrometre, Applied Materials, Video game

Chiplet Summit opens pre-registration today for its second annual event on February 6-8 at the Santa Clara Convention Center.

Key Points: 
  • Chiplet Summit opens pre-registration today for its second annual event on February 6-8 at the Santa Clara Convention Center.
  • Hundreds of registrants and many key exhibitors will be at the premier showcase for chiplet technology.
  • Pre-conference seminars will focus on chiplet basics, packaging methods, interfaces, design methods, working with foundries, AI in chiplet design, and the Open Chiplet Economy.
  • Chiplet Summit will help designers make the right decisions for current projects and future needs.”
    Chiplet Summit also features innovative products from industry leaders such as Applied Materials, Synopsys, Alphawave Semi, Open Compute Project, Achronix, Arm, Cadence, and Siemens EDA.

Electronic Design Automation Market to grow by USD 7.50 billion from 2022 to 2027; Growth Driven by the growing significance of EDA in the electronic design process- Technavio

Retrieved on: 
Tuesday, January 16, 2024
Integrated circuit, PCB, Siemens EDA, EDA, Synopsys, SOC, Computer-aided design, IC, Integrated circuit design, ANSYS, Chip on board, Growth, Digital, Risk, Cadence Design Systems, USD, Key, Keysight, Machine learning, Electronic, Video game

NEW YORK, Jan. 15, 2024 /PRNewswire/ -- The global electronic design automation market size is estimated to grow by USD 7.50 billion from 2023 to 2027, according to Technavio.

Key Points: 
  • NEW YORK, Jan. 15, 2024 /PRNewswire/ -- The global electronic design automation market size is estimated to grow by USD 7.50 billion from 2023 to 2027, according to Technavio.
  • The growing significance of EDA in the electronic design process drives market growth.
  • This evolution is witnessed across Electronic Design Tools, Analog Design Software, Digital Design Solutions, Chip Design Automation, PCB Layout, Electronic System Design, Design Verification, Hardware Design Tools, Electronic Circuit Simulation, ASIC Design, and System-on-Chip (SoC) Design.
  • This challenge pervades Semiconductor Design Software, VLSI Design, PCB Design Tools, FPGA Design, IC Design Solutions, Computer-Aided Design, Integrated Circuit Design, and Electronic Design Innovation.

Siemens acquires Insight EDA to expand Calibre integrated circuit reliability verification offering

Retrieved on: 
Wednesday, November 15, 2023
Acquisition, DI, Engineering, Digital Enterprise Research Institute, Siemens Healthineers, Multimedia, AG, Automation, IC, Siemens Digital Industries Software, Software, Insight, EDA, Caliber, Transport, Printed circuit board, Instrumentation, Siemens EDA, Siemens Energy

Insight EDA has been a pioneer in the use of EDA automation to address design specific circuit reliability, bringing in new and more efficient circuit reliability analysis use models to the industry.

Key Points: 
  • Insight EDA has been a pioneer in the use of EDA automation to address design specific circuit reliability, bringing in new and more efficient circuit reliability analysis use models to the industry.
  • The addition of the Insight EDA technology to Siemens' Calibre PERC product portfolio is anticipated to empower chip designers with an end-to-end circuit reliability solution.
  • "The acquisition of Insight EDA accelerates our circuit reliability verification roadmap and underscores Siemens' continued commitment to delivering world-class EDA solutions," said Michael Garcia-Buehler, vice president, product management, Calibre Design Solutions, Siemens Digital Industries Software.
  • "The addition of Insight EDA to Siemens' Calibre PERC product line further enables design engineers to create design specific reliability checks and analysis."

Stantec to launch 2024 Strategic Plan and host Investor Day on December 5, 2023

Retrieved on: 
Tuesday, October 3, 2023
TSX, Mountain Time Zone, STN, BEAT, Siemens EDA, NYSE, Engineering, Stantec, Eastern Time Zone

EDMONTON, Alberta, Oct. 03, 2023 (GLOBE NEWSWIRE) -- TSX, NYSE:STN

Key Points: 
  • EDMONTON, Alberta, Oct. 03, 2023 (GLOBE NEWSWIRE) -- TSX, NYSE:STN
    Stantec , a global leader in sustainable design and engineering, will launch its new three-year strategic plan and host an Investor Day on Tuesday, December 5, 2023, at the Boston Exchange for Accelerated Technology (the BEAT) in Boston, Massachusetts.
  • The event will feature presentations from Stantec’s executive leadership team.
  • The webcast will also be recorded and archived on the Events and Presentations page.
  • Due to limited capacity, in-person attendance in Boston will be by invitation only (details to follow).

CEE2023 Shenzhen will be held from August 23rd to 25th, marking the powerful opening of the fusion field for the consumer electronics industry in Shenzhen

Retrieved on: 
Monday, August 28, 2023
Information technology, NIO, Foton Motor, Internet, Entrepreneurship, Dongfeng Motor Corporation, BYD Auto, Sesame, BOE, Hyundai Mobis, Electronics, Shenzhen Convention and Exhibition Center, FAW Group, HarmonyOS, Exhibition, Convention center, Knowledge, TCL, COVID-19, Multimedia, Chiplet, Siemens EDA, CEE, Schaeffler Group, Netac Technology, AMD, China Mobile, GDP, Guangdong–Hong Kong–Macao Greater Bay Area, Artificial intelligence, Ecosystem, AI, Consumer electronics, Xiaoice, Lenovo, Infineon Technologies, Digi-Key, AMEC

SHENZHEN, China, Aug. 28, 2023 /PRNewswire/ -- CEE2023 Shenzhen, hosted by Shenzhen Informa Markets Creativity Exhibition Company Limited, will be held from August 23rd to 25th.

Key Points: 
  • SHENZHEN, China, Aug. 28, 2023 /PRNewswire/ -- CEE2023 Shenzhen, hosted by Shenzhen Informa Markets Creativity Exhibition Company Limited, will be held from August 23rd to 25th.
  • CEE, the Shenzhen International Consumer Electronics Expo, is a fusion field that represents the epitome of power in the Shenzhen consumer electronics industry.
  • CEE will select iconic venues within the consumer electronics field: Shenzhen innoX, Lenovo Future Center, and HQ-mart.
  • We welcome professionals from the electronics industry to visit and exchange ideas at the Shenzhen Convention and Exhibition Center (Futian) from August 23rd to 25th.

OpenHW Group Announces Tape Out of RISC-V-based CORE-V MCU Development Kit for IoT Built with Open-Source Hardware & Software

Retrieved on: 
Wednesday, August 16, 2023
Apps, Applications, Technology, Semiconductor, Other Technology, Software, Internet, Hardware, Electronic Design Automation, IOT (Internet of Things), Artificial Intelligence, Eclipse, Heart, MCU, Amazon Web Services, University, AI, ETH, GCC, Internet of things, ETH Zurich, Energy, Multimedia, IIS, Siemens EDA, PCB, Artificial intelligence, University of Bologna, Digital, Architecture, IDE, AWS, SDK, Silab, Video game, Computer data storage, Impera

OpenHW Group today announced that the industry’s most comprehensive Development Kit for an open-source RISC-V MCU is now available to be ordered.

Key Points: 
  • OpenHW Group today announced that the industry’s most comprehensive Development Kit for an open-source RISC-V MCU is now available to be ordered.
  • View the full release here: https://www.businesswire.com/news/home/20230816053099/en/
    The comprehensive open-source CORE-V MCU DevKit enables software development for embedded, internet-of-things (IoT), and artificial intelligence (AI)-driven applications.
  • This project highlights the open-source collaborative development of industry-grade CORE-V processor IP with supporting hardware and software by a wide spectrum of members within the OpenHW community.
  • Espressif Systems – a leading IoT connectivity solution provider, supplied AWS IoT ExpressLink modules for the CORE-V DevKit PCB to provide AWS IoT connectivity.