HBM

Key Figures 15.12.2023

Retrieved on: 
Saturday, December 30, 2023
Investment, Fund, HBM, News, Mail

This message may contain confidential or privileged Information and is intended only for the use of the addressee named above.

Key Points: 
  • This message may contain confidential or privileged Information and is intended only for the use of the addressee named above.
  • If you have received this message by error, please advise the sender immediately and delete this message.
  • The publication is for information purposes only and does not constitute an offer to sell or a solicitation to buy securities.
  • Performance data does not take into account any commissions and costs charged when units of the Fund are issued and redeemed.

High-Voltage, Automotive-Compliant, Hall-Effect Latches from Diodes Incorporated Provide Improved Resistance to Physical Stress

Retrieved on: 
Tuesday, December 19, 2023
Technology, Semiconductor, Automotive, General Automotive, Engineering, Automotive Manufacturing, Manufacturing, Tires & Rubber, Hardware, Documentation, DIOD, PPAP, SWP, AEC, BOP, Type, Magnet, IATF, ESD, Temperature, BRP, BLDC, HBM

Diodes Incorporated (Diodes) (Nasdaq: DIOD) adds the AH371xQ series of high-voltage Hall-effect latches to its product portfolio.

Key Points: 
  • Diodes Incorporated (Diodes) (Nasdaq: DIOD) adds the AH371xQ series of high-voltage Hall-effect latches to its product portfolio.
  • They are used for brushless DC (BLDC) motor control, valve operation, linear and incremental rotary encoders, and position-sensing functions.
  • These Hall-effect latches have an operating voltage range from 3V to 27V, with 40V load dump protection.
  • These new automotive-compliant Hall-effect latches from Diodes are AEC-Q100 Grade 0 qualified, manufactured in IATF 16949 certified facilities, and support PPAP documentation.

DEEPX Making High-Performance, Low-Power AI Servers A Reality with DX-H1 Launch at CES 2024

Retrieved on: 
Wednesday, December 20, 2023
Ecosystem, Attention, Computer, Booth, Component, Computer hardware, DX, AI, Internet, GPU, PCI Express, Carbon, CES, LPDDR, Graphics processing unit, HBM, Medical device

LAS VEGAS, Dec. 20, 2023 /PRNewswire/ -- DEEPX (CEO, Lokwon Kim), an original AI semiconductor technology company, is set to make waves at CES 2024 by introducing the DX-H1 — a cutting-edge PCIe card designed to accelerate AI server performance while reducing energy consumption. Honored with the CES 2024 Innovation Award in the Computer Hardware and Components category, DX-H1 is widely anticipated to attract significant attention as it leaves a notable impact on the high-performance AI server market during this global launch.

Key Points: 
  • To explore DX-H1's industry-leading power-to-performance efficiency, join DEEPX at Booth #8953, North Hall during CES 2024.
  • As an advanced AI inferential solution, DEEPX's DX-H1 prioritizes performance, power efficiency, and cost-effectiveness.
  • The AI server market relies on power-intensive GPUs, whose high energy consumption leads to substantial carbon emissions.
  • DEEPX: Advancing AI with high performance, low energy solutions
    DEEPX leads the market for low-power AI solutions, achieving the world's highest power-to-performance ratio through proprietary advancements in model efficiency.

Key Figures 15.11.2023

Retrieved on: 
Thursday, December 21, 2023
Investment, HBM, News, Fund, Mail

This message may contain confidential or privileged Information and is intended only for the use of the addressee named above.

Key Points: 
  • This message may contain confidential or privileged Information and is intended only for the use of the addressee named above.
  • If you have received this message by error, please advise the sender immediately and delete this message.
  • The publication is for information purposes only and does not constitute an offer to sell or a solicitation to buy securities.
  • Performance data does not take into account any commissions and costs charged when units of the Fund are issued and redeemed.

Hudbay Further Enhances Financial Flexibility with Redemption of Remaining Copper Mountain Bonds

Retrieved on: 
Wednesday, November 15, 2023
NYSE, Risk, Mining, Uncertainty, Deleveraging, HBM, TSX, News, Legislation, Risk management

TORONTO, Nov. 15, 2023 (GLOBE NEWSWIRE) -- Hudbay Minerals Inc. (“Hudbay”) (TSX, NYSE: HBM) today announced that its wholly owned subsidiary, Copper Mountain Mining ULC (“Copper Mountain”), has exercised the redemption option on its senior secured 8% notes (the “Copper Mountain Bonds”).

Key Points: 
  • TORONTO, Nov. 15, 2023 (GLOBE NEWSWIRE) -- Hudbay Minerals Inc. (“Hudbay”) (TSX, NYSE: HBM) today announced that its wholly owned subsidiary, Copper Mountain Mining ULC (“Copper Mountain”), has exercised the redemption option on its senior secured 8% notes (the “Copper Mountain Bonds”).
  • Copper Mountain will redeem the remaining $54.7 million principal amount outstanding of Copper Mountain Bonds on or about November 30, 2023 at a call price equal to 104% of the principal amount being redeemed, plus accrued and unpaid interest to the date of redemption, as prescribed by the bond terms governing the Copper Mountain Bonds.
  • Hudbay intends to utilize its senior secured revolving credit facility to fund the redemption of the Copper Mountain Bonds.
  • Forward-looking information includes, but is not limited to, Hudbay’s expectations with respect to the redemption of the Copper Mountain bonds, the financing of the redemption of the Copper Mountain Bonds and the financial flexibility and deleveraging that such redemption is expected to afford.

Odyssey Therapeutics Announces $101 Million Series C Financing

Retrieved on: 
Tuesday, December 5, 2023
FDA, Other Health, Finance, Pharmaceutical, Business, Oncology, General Health, Professional Services, Infectious Diseases, Genetics, Clinical Trials, Biotechnology, Science, Other Science, Research, Health, Foresite Capital, Therapy, Ideation, Patient, Investment, Goldman Sachs, Messenger, SVB Securities, OrbiMed, Drug discovery, HBM, Drug development, Pharmaceutical industry, Boston, Odyssey

This Series C financing brings the total capital raised since founding in late 2021 to $487 million.

Key Points: 
  • This Series C financing brings the total capital raised since founding in late 2021 to $487 million.
  • Proceeds will support the advancement of multiple programs into clinical studies and the continuation of investment in discovery to build a sustainable model for therapeutic innovation.
  • This unique set of tools enables Odyssey to identify drug targets with the highest clinical potential in a modality-agnostic fashion.
  • “Odyssey continues to accelerate multiple pre-clinical programs in immunology and oncology,” said Jeff Leiden, M.D., Ph.D., Chairman of the Odyssey board.

New Supplyframe Intelligence Reveals Electronics Supply Chain is in the Goldilocks Zone

Retrieved on: 
Thursday, November 30, 2023
Software, Supply Chain Management, Hardware, Electronic Design Automation, Data Management, Technology, Artificial Intelligence, Semiconductor, Retail, Engineering, Transport, Logistics, Manufacturing, DDR4, Empowerment, DRAM, Organization, DSI, SK Hynix, Metal, DDR5, Personal computer, Climate, Risk, Electronics, Commodity, Circumstellar habitable zone, Intelligence, Index, IC, WSTS, Software as a service, Memory, HBM, Growth, EV, AI, Car, Network, Environment, Rare-earth element, Cryptocurrency, Lithium, Video game, Computer data storage

New market intelligence from Supplyframe Commodity IQ indicates that the electronics supply chain has entered the Goldilocks Zone for buyers.

Key Points: 
  • New market intelligence from Supplyframe Commodity IQ indicates that the electronics supply chain has entered the Goldilocks Zone for buyers.
  • Following 29 consecutive months of expansion, the Commodity IQ Lead Time Index for electronic components fell below the index baseline, indicating contraction and stabilization.
  • Just 10% of components will experience lead time increases in Q4 and 63% will be stable.
  • Through H1 2024, nearly 80% of all component lead time dimensions are projected to be stable.

Avicena will showcase the world’s smallest 1Tbps optical transceiver at the SuperComputing Conference 2023 in Denver, CO

Retrieved on: 
Tuesday, November 14, 2023
Semiconductor, Data Management, Technology, Software, Artificial Intelligence, Hardware, Cerberus, Artificial intelligence, LLM, ACM/IEEE Supercomputing Conference, Multimedia, MicroLED, LED, Silicon photonics, Samsung Catalyst Fund, Graphics processing unit, Cerberus Capital Management, Conference, ChatGPT, Memory, HBM, CMOS, AI, Exascale computing, Temperature, Samsung, Processor (computing), Video game, Avicenna

Avicena, a privately held company headquartered in Sunnyvale, CA, is demonstrating the world’s smallest 1Tbps optical transceiver as part its LightBundleTM multi-Tbps chip-to-chip interconnect technology at the SuperComputing Conference (SC23) in Denver, CO ( https://sc23.supercomputing.org/ ).

Key Points: 
  • Avicena, a privately held company headquartered in Sunnyvale, CA, is demonstrating the world’s smallest 1Tbps optical transceiver as part its LightBundleTM multi-Tbps chip-to-chip interconnect technology at the SuperComputing Conference (SC23) in Denver, CO ( https://sc23.supercomputing.org/ ).
  • Avicena’s microLED-based LightBundle architecture supports unprecedented throughput, shoreline density and low power, unlocking the performance of processors, memory, and sensors.
  • “At Avicena we are excited to showcase the world’s most compact 1Tbps transceiver in the shape of a 3mm x 4mm CMOS ASIC using our patented microLED optical interface,” says Bardia Pezeshki, Founder and CEO of Avicena.
  • “Optical interconnect technology has the potential to improve chip-to-chip and inter-rack performance,” says Marco Chisari, head of the Samsung Semiconductor Innovation Center.

Global Total Semiconductor Equipment Sales Forecast to Reach Record $124 Billion in 2025, SEMI Reports

Retrieved on: 
Monday, December 11, 2023
SEMI, DRAM, Investment, EMDS, NAND, Data collection, Total, HBM, Growth, Renewable energy

TOKYO, Dec. 11, 2023 /PRNewswire/ -- Global sales of total semiconductor manufacturing equipment by original equipment manufacturers are forecast to reach $100 billion in 2023, a contraction of 6.1% from the industry record of $107.4 billion posted in 2022, SEMI announced today in its Year-End Total Semiconductor Equipment Forecast – OEM Perspective at SEMICON Japan 2023 .

Key Points: 
  • TOKYO, Dec. 11, 2023 /PRNewswire/ -- Global sales of total semiconductor manufacturing equipment by original equipment manufacturers are forecast to reach $100 billion in 2023, a contraction of 6.1% from the industry record of $107.4 billion posted in 2022, SEMI announced today in its Year-End Total Semiconductor Equipment Forecast – OEM Perspective at SEMICON Japan 2023 .
  • This contraction marks a significant improvement from the 18.8% decline forecast by SEMI in its Mid-Year Total Semiconductor Equipment Forecast – OEM Perspective.
  • The Equipment Market Data Subscription (EMDS) from SEMI provides comprehensive market data for the global semiconductor equipment market.
  • A subscription includes three reports:
    Monthly SEMI North American Billings Report, an early perspective of equipment market trends
    Bi-annual Total Semiconductor Equipment Forecast – OEM Perspective, an outlook for the semiconductor equipment market

Global Total Semiconductor Equipment Sales Forecast to Reach Record $124 Billion in 2025, SEMI Reports

Retrieved on: 
Monday, December 11, 2023
SEMI, DRAM, Investment, EMDS, NAND, Data collection, Total, HBM, Growth, Renewable energy

TOKYO, Dec. 11, 2023 /PRNewswire/ -- Global sales of total semiconductor manufacturing equipment by original equipment manufacturers are forecast to reach $100 billion in 2023, a contraction of 6.1% from the industry record of $107.4 billion posted in 2022, SEMI announced today in its Year-End Total Semiconductor Equipment Forecast – OEM Perspective at SEMICON Japan 2023 .

Key Points: 
  • TOKYO, Dec. 11, 2023 /PRNewswire/ -- Global sales of total semiconductor manufacturing equipment by original equipment manufacturers are forecast to reach $100 billion in 2023, a contraction of 6.1% from the industry record of $107.4 billion posted in 2022, SEMI announced today in its Year-End Total Semiconductor Equipment Forecast – OEM Perspective at SEMICON Japan 2023 .
  • This contraction marks a significant improvement from the 18.8% decline forecast by SEMI in its Mid-Year Total Semiconductor Equipment Forecast – OEM Perspective.
  • The Equipment Market Data Subscription (EMDS) from SEMI provides comprehensive market data for the global semiconductor equipment market.
  • A subscription includes three reports:
    Monthly SEMI North American Billings Report, an early perspective of equipment market trends
    Bi-annual Total Semiconductor Equipment Forecast – OEM Perspective, an outlook for the semiconductor equipment market