HBM

Global Automotive Memory Chip and Storage Industry Report 2024: Evolution of Automotive DRAM - In the Era of Transformer Model, GDDR6 and HBM Develop Rapidly, and Storage Cost Shoots Up

Retrieved on: 
Friday, March 15, 2024
Cloud, UFS, Micrometre, Intel, HBM, Flash memory, SOC, GPU, LPDDR4, SSD, Universal Flash Storage, BGA, SerDes, NVM Express, Research, CXL, AI, PCI Express, JEDEC, Memory, Samsung, PCB, GDDR6, FSD, UFS 4.0, PHY, Compute Express Link, Cloud computing, European, CPU, FPGA, SK Hynix, IPS, Rambus, Video game

DUBLIN, March 15, 2024 /PRNewswire/ -- The "Global Automotive Memory Chip and Storage Industry Report, 2024" report has been added to ResearchAndMarkets.com's offering.

Key Points: 
  • DUBLIN, March 15, 2024 /PRNewswire/ -- The "Global Automotive Memory Chip and Storage Industry Report, 2024" report has been added to ResearchAndMarkets.com's offering.
  • It is conceivable that by 2025, UFS 4.0 will become one of automotive storage standards, and will be applicable to different automotive EEAs.
  • Evolution of automotive DRAM: In the era of Transformer model, GDDR6 and HBM develop rapidly, and storage cost shoots up.
  • 4.2 Memory Chip Application Scenario: Autonomous Driving
    4.3 Memory Chip Application Scenario: Cockpit
    4.4 Application Scenario of Memory Chips: Central Computing Units + Zonal Controllers
    4.5 Memory Chip Application Scenario: Driving Data Recording
    4.6 Memory Chip Application Scenarios: Cloud Computing and Storage

Key Figures 29.02.2024

Retrieved on: 
Wednesday, March 13, 2024
News, Fund, HBM, Investment, Mail

This message may contain confidential or privileged Information and is intended only for the use of the addressee named above.

Key Points: 
  • This message may contain confidential or privileged Information and is intended only for the use of the addressee named above.
  • If you have received this message by error, please advise the sender immediately and delete this message.
  • The publication is for information purposes only and does not constitute an offer to sell or a solicitation to buy securities.
  • Performance data does not take into account any commissions and costs charged when units of the Fund are issued and redeemed.

Alumis Announces Upsized $259M Series C Financing to Advance Clinical-stage Pipeline of Oral Therapies Designed to Address Immune Dysfunction

Retrieved on: 
Wednesday, March 6, 2024
Foresite Capital, DSM-IV codes, Psoriasis, Uveitis, HBM, Growth, Data science, Safety, Eli Lilly and Company, Genetics, Patient, TYK2, SLE, Partnership, Vaccine

SOUTH SAN FRANCISCO, Calif., March 06, 2024 (GLOBE NEWSWIRE) -- Alumis Inc., a clinical-stage biopharmaceutical company developing oral therapies using a precision approach to transform the lives of patients with immune-mediated diseases, today announced an upsized $259M Series C financing. Alumis plans to use the proceeds of the financing to initiate pivotal Phase 3 clinical trials for its lead candidate ESK-001, a highly selective and potentially best-in-class allosteric tyrosine kinase 2 (TYK2) inhibitor, in moderate to severe plaque psoriasis in the second half of 2024, as well as support the two ongoing Phase 2 clinical trials for ESK-001 in systemic lupus erythematosus (SLE), and non-infectious uveitis. The financing will also support the further advancement of Alumis’ precision data analytics and multi-platform approach to explore ESK-001’s potential application in other autoimmune indications, as well as A-005, a TYK2 inhibitor for the treatment of neuroinflammatory and neurodegenerative diseases, and its earlier-stage internal pipeline programs.

Key Points: 
  • Srinivas Akkaraju, M.D., Ph.D., Founder and Managing General Partner of Samsara BioCapital, and Richard Gaster, M.D., Ph.D., Managing Partner at venBio Partners, will join Alumis’ Board of Directors.
  • “This investment will support the continued clinical development of ESK-001, building on promising data that have demonstrated full, sustained target inhibition leading to a potentially best-in-class oral TYK2 inhibitor profile.
  • We are now starting to see how this will translate into outcomes for patients.
  • We are proud of the company’s progress and happy to continue to support and work with the Alumis team and Board of Directors in this next stage of the company’s growth.”

BE Semiconductor Industries N.V. Announces Q4-23 and Full Year 2023 Results

Retrieved on: 
Thursday, February 22, 2024
Silicon photonics, EVP, AI, Silicon, HBM, ASML, Service, Share repurchase, Growth, ESG, Weakness, Business, TSMC, Corporate development, IDMS, Logic, Development, Research

DUIVEN, the Netherlands, Feb. 22, 2024 (GLOBE NEWSWIRE) -- BE Semiconductor Industries N.V. (the “Company" or "Besi") (Euronext Amsterdam: BESI; OTC markets: BESIY), a leading manufacturer of assembly equipment for the semiconductor industry, today announced its results for the fourth quarter and year ended December 31, 2023.

Key Points: 
  • Shareholders also benefitted from a 141.2% increase in our share price and the capital allocation of € 435.5 million in the form of dividends and share repurchases.
  • We also continue to formulate and execute strategic initiatives to position Besi for solid profitability and sustainable growth over the next decade.
  • In addition, we formed a Technology Advisory Board to advance our core technology, competitive position and growth prospects.
  • The slope of the recovery this year is uncertain given restrained demand for mainstream applications and weakness in automotive end-user markets currently.

Shape Memory Medical Completes $38 Million in Financing to Advance Endovascular Embolization

Retrieved on: 
Monday, March 4, 2024
Biotechnology, General Health, Medical Devices, Health, Cardiology, HBM, Blood, FDA, Food, IDE, Rupture, Death, Cayman, Safety, Abdominal aortic aneurysm, Memory, AAA, Ruppel, EVAR, Aneurysm, Research, Pharmaceutical industry

Shape Memory Medical Inc., developer of custom shape memory polymers for endovascular markets, announced today that it has completed $38 million in Series C financing led by Earlybird Venture Capital and with the participation of new and existing investors, including HBM Healthcare Investments (Cayman) Ltd., WexMed II LLC, HBM-Medfocus LLC, and Emergent Medical Partners II, L.P..

Key Points: 
  • Shape Memory Medical Inc., developer of custom shape memory polymers for endovascular markets, announced today that it has completed $38 million in Series C financing led by Earlybird Venture Capital and with the participation of new and existing investors, including HBM Healthcare Investments (Cayman) Ltd., WexMed II LLC, HBM-Medfocus LLC, and Emergent Medical Partners II, L.P..
    “With this financing, we are well positioned to accelerate the clinical and market development of shape memory polymer technology for aortic and peripheral vascular markets,” said Ted Ruppel, president and CEO of Shape Memory Medical.
  • “The funds will support the execution of the AAA-SHAPE Pivotal Trial, a randomized controlled study comparing EVAR plus sac management with IMPEDE-FX RapidFill to stand-alone EVAR.
  • The Company’s proprietary shape memory polymer is a low-density, porous embolic material that is crimped for catheter delivery and self-expands upon contact with blood for rapid conversion to organized thrombus.
  • Thom Rasche, Partner at Earlybird Venture Capital and the newest addition to the Shape Memory Medical Board commented, “Shape Memory Medical’s approach to embolization is highly differentiated.

Access Vascular Supports Updated Standards of Care Emphasizing New Materials to Reduce Catheter Complications

Retrieved on: 
Wednesday, February 28, 2024
Nursing, Medical Supplies, Health, Medical Devices, Hospitals, Other Health, Managed Care, Bloodstream infections, Thrombosis, Occlusion, INS, PICC, Phlebitis, Catheter, AVI, Patient, HBM, Risk

Access Vascular, Inc. (AVI), a company addressing the most common and costly vascular access complications with its novel hydrophilic biomaterial platform, today announced that the Infusion Nurses Society (INS) has updated its standard of care to include innovative catheter materials, to reduce the risk of vascular access complications.

Key Points: 
  • Access Vascular, Inc. (AVI), a company addressing the most common and costly vascular access complications with its novel hydrophilic biomaterial platform, today announced that the Infusion Nurses Society (INS) has updated its standard of care to include innovative catheter materials, to reduce the risk of vascular access complications.
  • The new INS guidelines cite improvements in catheter materials as having the potential to reduce complications such as phlebitis, occlusion, and thrombosis.1 The guidelines also advise healthcare providers to consider using devices made of novel materials in populations with high rates of occlusion or thrombosis.
  • Studies have shown that peripherally inserted central catheters (PICC) and midline catheters made using AVI’s MIMIX™ hydrophilic biomaterial (HBM) offer lower rates of failure,2 occlusion,3 bacterial adhesion and thrombus accumulation,4 compared with catheters made from conventional polyurethane materials.
  • “Rates of bloodstream infections have soared, at great cost to the U.S. healthcare system and, most importantly, leading to a myriad of patient complications,” said James Biggins, Founder and CEO of Access Vascular.

Samsung Develops Industry-First 36GB HBM3E 12H DRAM

Retrieved on: 
Tuesday, February 27, 2024
Semiconductor, Hardware, Consumer Electronics, Technology, Artificial Intelligence, Data-rate units, TCO, Multimedia, NCF, AI, HBM, Samsung Electronics, Samsung, HBM3, Memory, Electronics, TC, Mobile phone

Samsung Electronics Co., Ltd., a world leader in advanced memory technology, today announced that it has developed HBM3E 12H, the industry’s first 12-stack HBM3E DRAM and the highest-capacity HBM product to date.

Key Points: 
  • Samsung Electronics Co., Ltd., a world leader in advanced memory technology, today announced that it has developed HBM3E 12H, the industry’s first 12-stack HBM3E DRAM and the highest-capacity HBM product to date.
  • View the full release here: https://www.businesswire.com/news/home/20240226986259/en/
    Samsung Develops Industry-First 36GB HBM3E 12H DRAM (Photo: Business Wire)
    Samsung’s HBM3E 12H provides an all-time high bandwidth of up to 1,280 gigabytes per second (GB/s) and an industry-leading capacity of 36 gigabytes (GB).
  • “The industry’s AI service providers are increasingly requiring HBM with higher capacity, and our new HBM3E 12H product has been designed to answer that need,” said Yongcheol Bae, Executive Vice President of Memory Product Planning at Samsung Electronics.
  • As AI applications grow exponentially, the HBM3E 12H is expected to be an optimal solution for future systems that require more memory.

Nona Biosciences Enters into Collaboration Agreement with Boostimmune in Antibody-Drug Conjugate Development

Retrieved on: 
Tuesday, February 27, 2024
Complex conjugate, Knowledge, Cancer, ITM, Patient, Spacecraft, IND, Doctor of Philosophy, Harbor, MD, HBM, ADC, Pharmaceutical industry

The collaboration aims to leverage Nona's proprietary Harbour Mice® H2L2 (two light and two heavy chain) platform to accelerate the development of Antibody-Drug Conjugates (ADCs) against novel targets.

Key Points: 
  • The collaboration aims to leverage Nona's proprietary Harbour Mice® H2L2 (two light and two heavy chain) platform to accelerate the development of Antibody-Drug Conjugates (ADCs) against novel targets.
  • Jingsong Wang, MD, PhD, Chairman of Nona Biosciences, expressed, "By leveraging our accumulated knowledge of ADC discovery and utilizing our advanced therapeutic antibody platforms validated by partners worldwide, this collaboration will expedite the development of first-in-class ADCs targeting cancer.
  • Gwanghee Lee, Founder and CEO of Boostimmune, stated, "We are excited to collaborate with Nona Biosciences.
  • Through this collaboration, we are confident in making significant strides in addressing the unmet needs of cancer patients."

IDTechEx Discusses Advanced Semiconductor Packaging Trends in AI and HPC

Retrieved on: 
Friday, February 23, 2024
HPC, Natural language processing, Transmission loss, SRAM, Silicon, NVLink, Forecasting, HBM, 3D, Language, CPU, Growth, HyperTransport, LLM, GPT, Memory, Translation, GPU, TSMC, AMD, DRAM, Graphics processing unit, NLP, Logic, Instinct, OpenAI, Central processing unit, NVIDIA, Computer data storage

The " Advanced Semiconductor Packaging 2024-2034: Forecasts, Technologies, Applications " report recently published by IDTechEx explores the evolving landscape of semiconductor packaging, with a focus on 2.5D and 3D hybrid bonding packaging.

Key Points: 
  • The " Advanced Semiconductor Packaging 2024-2034: Forecasts, Technologies, Applications " report recently published by IDTechEx explores the evolving landscape of semiconductor packaging, with a focus on 2.5D and 3D hybrid bonding packaging.
  • It covers technology trends, industry challenges, and the advancements made by key players while forecasting market trends in the semiconductor packaging sector.
  • IDTechEx's new report, " Advanced Semiconductor Packaging 2024-2034: Forecasts, Technologies, Applications ", delves into the dynamic landscape of 2.5D and 3D packaging, analyzing technology trends, industry barriers, key player's technology roadmap, and market forecasts.
  • Gain invaluable insights into not just AI and HPC applications but also 5G/6G, autonomous vehicles, and consumer electronics sectors, understanding how advanced packaging shapes their trajectory.

IDTechEx Discusses Advanced Semiconductor Packaging Trends in AI and HPC

Retrieved on: 
Friday, February 23, 2024
HPC, Natural language processing, Transmission loss, SRAM, Silicon, NVLink, Forecasting, HBM, 3D, Language, CPU, Growth, HyperTransport, LLM, GPT, Memory, Translation, GPU, TSMC, AMD, DRAM, Graphics processing unit, NLP, Logic, Instinct, OpenAI, Central processing unit, NVIDIA, Computer data storage

The " Advanced Semiconductor Packaging 2024-2034: Forecasts, Technologies, Applications " report recently published by IDTechEx explores the evolving landscape of semiconductor packaging, with a focus on 2.5D and 3D hybrid bonding packaging.

Key Points: 
  • The " Advanced Semiconductor Packaging 2024-2034: Forecasts, Technologies, Applications " report recently published by IDTechEx explores the evolving landscape of semiconductor packaging, with a focus on 2.5D and 3D hybrid bonding packaging.
  • It covers technology trends, industry challenges, and the advancements made by key players while forecasting market trends in the semiconductor packaging sector.
  • IDTechEx's new report, " Advanced Semiconductor Packaging 2024-2034: Forecasts, Technologies, Applications ", delves into the dynamic landscape of 2.5D and 3D packaging, analyzing technology trends, industry barriers, key player's technology roadmap, and market forecasts.
  • Gain invaluable insights into not just AI and HPC applications but also 5G/6G, autonomous vehicles, and consumer electronics sectors, understanding how advanced packaging shapes their trajectory.