Fraunhofer

Airgain Announces Collaboration With Fraunhofer Heinrich Hertz Institute to Enhance 5G C-Band and mmWave User Experience

Retrieved on: 
Tuesday, August 30, 2022

This collaboration focuses on developing the critical building blocks of wireless systems and intelligent networks to improve the user experience for both operators and customers.

Key Points: 
  • This collaboration focuses on developing the critical building blocks of wireless systems and intelligent networks to improve the user experience for both operators and customers.
  • Fraunhofer HHI participates in the standardization of information and communication technologies and creates new applications together with industrial partners.
  • We are excited to partner in the development of these innovative new technologies and the disruptive products that this collaboration with Airgain can produce.
  • Innovations for the digital society of the future are the focus of research and development work at the Fraunhofer Institute for Telecommunications, Heinrich Hertz Institute, HHI.

MediaTek Adds Fraunhofer’s MPEG-H Audio to its Pentonic Series of Smart TV Chips and Boosts TV 3.0 Access for Brazilian TV Sets

Retrieved on: 
Thursday, August 18, 2022

As a licensed decoder provider in the MPEG-H Audio System trademark program and licensee of MPEG-H software from Fraunhofer IIS, MediaTek has now integrated MPEG-H Audio into its Pentonic series.

Key Points: 
  • As a licensed decoder provider in the MPEG-H Audio System trademark program and licensee of MPEG-H software from Fraunhofer IIS, MediaTek has now integrated MPEG-H Audio into its Pentonic series.
  • The range of high-end chips are designed to meet the demands of todays most sophisticated (Smart) TV applications and include the latest audio and video technologies.
  • With its Pentonic series, MediaTek provides a platform for receiving over-the-air (OTA) broadcasts, over-the-top (OTT) services, and web streaming.
  • Including MPEG-H Audio will enable TV manufacturers to equip their flagship products with immersive and personalized sound for broadcast and streaming applications, making the MPEG-H Audio experience ready for global markets.

Innovation in 3D Printing - Fraunhofer IGD Develops New Process for the Avoidance of Stair-Step Artifacts

Retrieved on: 
Thursday, July 28, 2022

Stair-step artifacts are unavoidable in conventional 3D printing processes.

Key Points: 
  • Stair-step artifacts are unavoidable in conventional 3D printing processes.
  • To generate more accurate surfaces, researchers at the Fraunhofer Institute for Computer Graphics Research IGD have developed a new process for polyjet printers.
  • It minimizes quantization errors so that stair-step artifacts are no longer noticeable in actual printing and are at a level far below the physical effects of the printing process.
  • The solution presented in the research paper is used with the Cuttlefish 3D printer driver developed by Fraunhofer IGD.

United States Climate Change Mitigation & Adaptation Markets 2022-2030: Coverage of 16 Sectors, 60 Technology and 5 Revenue Source Markets, Detailing 77 Markets

Retrieved on: 
Monday, July 25, 2022

The 376-page report contains a thorough analysis of 16 sectors, 60 technology and 5 revenue source markets, detailing 77 markets.

Key Points: 
  • The 376-page report contains a thorough analysis of 16 sectors, 60 technology and 5 revenue source markets, detailing 77 markets.
  • Climate change is expected to boost the frequency of whether related calamities across the US in the coming years.
  • The report provides you with exhaustive bottom-up research of 297 climate change mitigation and adaptation related markets.
  • The European Warming Mitigation & Adaptation market data is analyzed via 4 independent perspectives:
    By 60 Technologies and Services:

United States Climate Change Mitigation & Adaptation Market & Technologies Report 2022-2030 - ResearchAndMarkets.com

Retrieved on: 
Friday, July 22, 2022

The American Market is driven by the following factors:

Key Points: 
  • The American Market is driven by the following factors:
    From 2012 to 2021, the United States faced its warmest decade on record.
  • The report provides you with exhaustive bottom-up research of 297 climate change mitigation and adaptation related markets.
  • What does the "The US Warming Mitigation & Adaptation Market & Technologies - 2022-2030 - With Corona & COP26 Impacts" report give you?
  • The European Warming Mitigation & Adaptation market data is analyzed via 4 independent perspectives:
    By 60 Technologies and Services:

DGAP-News: Veganz Group AG: Research partnership between Veganz and Fraunhofer Institute for Molecular Biology and Applied Ecology

Retrieved on: 
Thursday, June 23, 2022

Fraunhofer IME is part of Fraunhofer Gesellschaft, the largest organisation for application-oriented research in Europe, and is the developer of the OrbiLoop-/ OrbiPlant system, a novel vertical farming platform technology.

Key Points: 
  • Fraunhofer IME is part of Fraunhofer Gesellschaft, the largest organisation for application-oriented research in Europe, and is the developer of the OrbiLoop-/ OrbiPlant system, a novel vertical farming platform technology.
  • In this partnership, peas will be grown as a source of protein and processed directly into alternatives to meat.
  • The Fraunhofer Institute for Molecular Biology and Applied Ecology IME ( www.ime.fraunhofer.de/en.html ) comprises the divisions Molecular biotechnology, Applied Ecology, and Bioresources and has more than 430 employees working at the locations Schmallenberg, Aachen, Mnster, and Gieen.
  • Fraunhofer IME is a strong partner for contract research in the fields of agriculture, bioecocnomy, chemistry, and environmental and consumer protection.

Jinan Innovation Zone: Establish platforms for fast-tracked development in China-Germany cooperation

Retrieved on: 
Wednesday, June 22, 2022

The first Sino-German cooperation zone north of the Yangtze River in China is located in the Jinan Innovation Zone.

Key Points: 
  • The first Sino-German cooperation zone north of the Yangtze River in China is located in the Jinan Innovation Zone.
  • According to Jinan Innovation Zone Administration Committee, in the future, it will be transformed into a world-class Sino-German cooperation zone and a new center of industry clusters.
  • In 2013, the Jinan Innovation Zone established the Dresden - Jinan Contact Office (Dresden - Jinan Industry Cooperation Office) in Dresden, also known as the Silicon Valley of Europe; and in November, its Jinan counterpart was established.
  • This dynamic and modern city is committed to building a bridge of mutual exchange and cooperation, intensifying the role of the Jinan Innovation Zone in China-Germany cooperation..

DGAP-News: Vitesco Technologies Group AG: Pioneer in Automation of Life Cycle Assessments: Vitesco Technologies rolls out Life Cycle Engineering

Retrieved on: 
Tuesday, June 21, 2022

Vitesco Technologies Group AG: Pioneer in Automation of Life Cycle Assessments: Vitesco Technologies rolls out Life Cycle Engineering

Key Points: 
  • Vitesco Technologies Group AG: Pioneer in Automation of Life Cycle Assessments: Vitesco Technologies rolls out Life Cycle Engineering
    The issuer is solely responsible for the content of this announcement.
  • Pioneer in Automation of Life Cycle Assessments: Vitesco Technologies rolls out Life Cycle Engineering
    Sustainability established as a key criterion in product development.
  • University of Erlangen, Germany confirms Vitesco Technologies pioneering role in automating life cycle assessments.
  • We can take advantage from years of experience, extensive databases and highly specialized tools, explains Khosrau Heidary, head of Life Cycle Engineering at Vitesco Technologies.

Fraunhofer IISB and Park Systems Last Call for Abstracts for the 2nd International SPM Symposium on Failure Analysis and Material Testing

Retrieved on: 
Wednesday, June 8, 2022

MANNHEIM, Germany, June 8, 2022 /PRNewswire/ --Fraunhofer Institute for Integrated Systems and Device Technology IISB and Park Systems invite professionals from the electronic industry to submit abstract for the 2nd International SPM Symposium on Failure Analysis and Material Testing 2022 (FAMT) July 22, 2022.

Key Points: 
  • MANNHEIM, Germany, June 8, 2022 /PRNewswire/ --Fraunhofer Institute for Integrated Systems and Device Technology IISB and Park Systems invite professionals from the electronic industry to submit abstract for the 2nd International SPM Symposium on Failure Analysis and Material Testing 2022 (FAMT) July 22, 2022.
  • New-engineered products need to secure a high level of reliability, sustainability, and longevity to meet the international quality standards.
  • The rapid evolution and short development cycles of these technologies already impose tremendous challenges on process control and even more on failure analysis for today's semiconductor research and industry.
  • To learn more about Park Systems, please visit http://www.parksystems.com
    View original content to download multimedia: https://www.prnewswire.com/news-releases/fraunhofer-iisb-and-park-system...

ClassOne Technology and Fraunhofer ENAS to Collaborate on Hybrid Bonding for Advanced Imaging Devices

Retrieved on: 
Thursday, June 2, 2022

The two partners will collaborate to develop, optimize, and integrate individual unit process steps involved in hybrid bonding of high-density pixel arrays and CMOS devices, enabling creation of thin, compact final devices for advanced imaging or sensing end products.

Key Points: 
  • The two partners will collaborate to develop, optimize, and integrate individual unit process steps involved in hybrid bonding of high-density pixel arrays and CMOS devices, enabling creation of thin, compact final devices for advanced imaging or sensing end products.
  • Fraunhofer ENAS will lend its expertise in pixel array development, hybrid bonding and the entire device integration scheme.
  • ClassOne Technology will optimize its industry-leading plating technology with CMP to mitigate associated process challenges, resulting in a final wafer optimally conditioned for high-yield bonding.
  • ClassOne Technology is a leading provider of advanced electroplating and wet processing systems for semiconductor and microelectronic device manufacturing around the world.