Dynamic random-access memory

With Market Size Valued at $173.6 Billion by 2026, It`s a Healthy Outlook for the Global Dynamic Random Access Memory (DRAM) Market

Retrieved on: 
Friday, October 8, 2021
Dynamic random-access memory, Electronics, Winbond, Formosa Plastics Group, Geography, GIA, CAGR, COVID-19, Computer, DRAM, Marketing, Growth, Device file, Players, Forecasting, SK Hynix, Intelligence, Research, Pet, Renewable energy

San Francisco, Oct. 8, 2021 /PRNewswire/ -- A new market study published by Global Industry Analysts Inc., (GIA) the premier market research company, today released its report titled "Dynamic Random Access Memory (DRAM) - Global Market Trajectory & Analytics" .

Key Points: 
  • San Francisco, Oct. 8, 2021 /PRNewswire/ -- A new market study published by Global Industry Analysts Inc., (GIA) the premier market research company, today released its report titled "Dynamic Random Access Memory (DRAM) - Global Market Trajectory & Analytics" .
  • Previews provide deep insider access to business trends; competitive brands; domain expert profiles; and market data templates and much more.
  • The U.S. Market is Estimated at $31 Billion in 2021, While China is Forecast to Reach $39.1 Billion by 2026
    The Dynamic Random Access Memory (DRAM) market in the U.S. is estimated at US$31 Billion in the year 2021.
  • Global Industry Analysts, Inc., ( www.strategyr.com ) is a renowned market research publisher the world`s only influencer driven market research company.

ACM Research Enters Bevel Etch Market to Support Emerging Process Steps in 3D NAND, DRAM and Advanced Logic Manufacturing

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Thursday, August 5, 2021
Chief executive officer, Â, Dynamic random-access memory, Silicon, Risk, Flash memory, Research, Nand, Electroplating, ACM, Ownership, Nasdaq, GLOBE, Printed circuit board, 3D printing

This approach minimizes the impact of edge contamination for subsequent process steps, and improves chip manufacturing yield.

Key Points: 
  • This approach minimizes the impact of edge contamination for subsequent process steps, and improves chip manufacturing yield.
  • During the chip manufacturing process, wafer edge peeling, particles and residue result in wafer edge yield loss, especially for 3D NAND, DRAM and advanced logic processes, said David Wang, CEO of ACM Research.
  • We developed the ACM Bevel Etch product to reduce yield loss at the edge, which is becoming increasingly important to optimize overall process yields.
  • ACMs Bevel Etch product supports a range of device types and process steps for 3D NAND etch, DRAM and advanced logic processes.

Alliance Memory 8Gb LPDDR4X SDRAM Offers ~50% Reduction in Power Consumption Compared to LPDDR4 Devices

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Wednesday, July 14, 2021
Computer memory, SDRAM, Computing, Science and technology, Technology, ARM architecture, Synchronous dynamic random-access memory, LPDDR, Dynamic random-access memory, Random-access memory, Raspberry Pi

Offering an extension to the companys fourth-generation LPDDR4 SDRAMs, the 8Gb AS4C256M32MD4V-062BAN offers ~50% lower power ratings in the 200-ball FBGA package for higher power efficiency.

Key Points: 
  • Offering an extension to the companys fourth-generation LPDDR4 SDRAMs, the 8Gb AS4C256M32MD4V-062BAN offers ~50% lower power ratings in the 200-ball FBGA package for higher power efficiency.
  • Alliance Memorys LPDDR4X SDRAM provides a reliable drop-in, pin-for-pin-compatible replacement for numerous similar solutions in high-bandwidth, high-performance memory system applications eliminating the need for costly redesigns and part requalification.
  • Alliance Memory is a worldwide provider of critical and hard-to-find memory ICs for the communications, computing, consumer electronics, medical, automotive, and industrial markets.
  • Privately held, Alliance Memory maintains headquarters in Kirkland, Washington, and regional offices in Europe, Asia, Canada, and South America.

SK hynix Starts Mass Production of 1anm DRAM Using EUV Equipment

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Monday, July 12, 2021
Computer memory, Anti-competitive practices, Economy of South Korea, SK Hynix, Dynamic random-access memory, Companies

SK hynix plans to provide the latest mobile DRAM products to smartphone manufacturers from the second half of 2021.

Key Points: 
  • SK hynix plans to provide the latest mobile DRAM products to smartphone manufacturers from the second half of 2021.
  • This is the first time that SK hynix adopted the *EUV equipment for mass production after proving the stability of the cutting edge lithography technology through partial adoption for its 1ynm DRAM production.
  • SK hynix plans to use the EUV technology for production of all its 1anm DRAM products going forward as it has proved the stability of the process.
  • SK hynix anticipates that the 1anm DRAM will also likely help alleviate the supply and demand conditions of the global markets following an increase in DRAM demand globally.

Innodisk Releases Industrial-Grade DDR5 DRAM Modules

Retrieved on: 
Thursday, July 1, 2021
Computer memory, SDRAM, Computing, Inventions, DDR5 SDRAM, Technology, Synchronous dynamic random-access memory, Dynamic random-access memory, Random-access memory, Flash memory, DDR SDRAM

TAIPEI, July 1, 2021 /PRNewswire/ -- Innodisk has officially announced the release of its industrial-grade DDR5 DRAM modules.

Key Points: 
  • TAIPEI, July 1, 2021 /PRNewswire/ -- Innodisk has officially announced the release of its industrial-grade DDR5 DRAM modules.
  • The JESD79-5 DDR5 SDRAM specification signaled the transition to DDR5, with significant improvements in capacity, speed, voltage, and ECC functions.
  • "Our customers are excited about the potential DDR5 has to invigorate their application developments," said Samson Chang, Corporate VP & GM of global embedded and server DRAM business unit, at Innodisk.
  • Innodisk is a service-driven provider of flash memory, DRAM modules, and embedded peripheral products for industrial and enterprise applications.

Innodisk Releases Industrial-Grade DDR5 DRAM Modules

Retrieved on: 
Thursday, July 1, 2021
Computer memory, SDRAM, Computing, Inventions, DDR5 SDRAM, Technology, Synchronous dynamic random-access memory, Dynamic random-access memory, Random-access memory, Flash memory, DDR SDRAM

TAIPEI, July 1, 2021 /PRNewswire/ -- Innodisk has officially announced the release of its industrial-grade DDR5 DRAM modules.

Key Points: 
  • TAIPEI, July 1, 2021 /PRNewswire/ -- Innodisk has officially announced the release of its industrial-grade DDR5 DRAM modules.
  • The JESD79-5 DDR5 SDRAM specification signaled the transition to DDR5, with significant improvements in capacity, speed, voltage, and ECC functions.
  • "Our customers are excited about the potential DDR5 has to invigorate their application developments," said Samson Chang, Corporate VP & GM of global embedded and server DRAM business unit, at Innodisk.
  • Innodisk is a service-driven provider of flash memory, DRAM modules, and embedded peripheral products for industrial and enterprise applications.

MemVerge and Hazelcast to Co-Develop Big Memory Solutions for Financial Services

Retrieved on: 
Friday, June 25, 2021
Free software, Hazelcast, Transaction processing, Computing, Memory virtualization, Dynamic random-access memory, Technology, Computer data

The Hazelcast platform, featuring real-time streaming and memory-first database technologies, is being integrated with MemVerge memory virtualization and in-memory snapshot technologies to unlock Big Memory capacity and fault-tolerance.

Key Points: 
  • The Hazelcast platform, featuring real-time streaming and memory-first database technologies, is being integrated with MemVerge memory virtualization and in-memory snapshot technologies to unlock Big Memory capacity and fault-tolerance.
  • The technologies and software will be shaped into Big Memory reference architectures for Financial Services starting with Basel III Compliance solutions that will be introduced in the second half of 2021.
  • The combined power of Hazelcast and MemVerge will deliver superior performance and reliability to our joint customers in financial services."
  • Memory Machine software from MemVerge makes this possible by virtualizing DRAM and persistent memory to form a platform for enterprise-class in-memory data services.

Infinidat Expands its InfiniBox Line with New Solid-State Array to Deliver the Industry’s Highest Performance for the Most Demanding Enterprise Applications

Retrieved on: 
Wednesday, June 16, 2021
Computer memory, Computer architecture, Dynamic random-access memory, Cache, Random-access memory, Low latency, Technology, Science and technology, Inventions

The innovation of our new solid-state array is squarely focused on demanding enterprise applications requiring the highest levels of performance with consistent, predictable low latency for virtually every I/O, said Phil Bullinger, CEO at Infinidat.

Key Points: 
  • The innovation of our new solid-state array is squarely focused on demanding enterprise applications requiring the highest levels of performance with consistent, predictable low latency for virtually every I/O, said Phil Bullinger, CEO at Infinidat.
  • The InfiniBox SSA now extends our capabilities to meet the most intensive enterprise storage requirements.
  • The InfiniBox SSA for profiles requiring consistent ultra-low latency is complementary to the standard InfiniBox system for general-purpose applications, which are the vast majority of enterprise applications.
  • InfiniBox SSA derives its faster-than-AFA performance through the extensive use of DRAM cache enabled by Infinidats patented Neural Cache software.

Micron Accelerates Breakthrough Platform Innovation With Advancements Across Industry’s First 176-Layer NAND and 1-Alpha DRAM

Retrieved on: 
Wednesday, June 2, 2021
Computer storage devices, Computer data storage, Computer memory, Non-volatile memory, Computer data, SDRAM, Solid-state drive, Micron Technology, LPDDR, Dynamic random-access memory, DDR4 SDRAM, Open NAND Flash Interface Working Group

Micron announced volume delivery of its first PCIe Gen4 solid-state drives (SSDs) built with the worlds first 176-layer NAND .

Key Points: 
  • Micron announced volume delivery of its first PCIe Gen4 solid-state drives (SSDs) built with the worlds first 176-layer NAND .
  • LPDDR4x is the latest JEDEC specification for fourth-generation low-power DRAM with improved input/output voltage for substantially lower power, making it ideal for mobile computing devices.
  • Together, these latest releases reinforce Microns leadership position in both DRAM and NAND technology, established this year.
  • We look forward to working with Micron Technology to optimize its leading storage and memory solutions for use across our automotive platforms.

Global Next-Generation Memory Market to 2026 - by Technology, Application and Geography - ResearchAndMarkets.com

Retrieved on: 
Thursday, May 27, 2021
Technology, Other Technology, Computer memory, Computing, Technology, Computers, Random-access memory, Dynamic random-access memory, Smartphone

The "Next-Generation Memory Market by Technology, Application and Geography - Global Forecast up to 2026" report has been added to ResearchAndMarkets.com's offering.

Key Points: 
  • The "Next-Generation Memory Market by Technology, Application and Geography - Global Forecast up to 2026" report has been added to ResearchAndMarkets.com's offering.
  • The Next-Generation Memory Market is expected to grow at the rate of 29.3% CAGR by 2026.
  • Few factors driving the global market for next-generation memory are the increasing demand for quick, cost-effective, and efficient memory solutions that have raised the requirement for next-generation memory worldwide.
  • The proliferating global market for tablets and smartphones is fueling the mobile dynamic random access memory (RAM) market.