IDTechEx Explores the Role of 3D Cu-Cu Hybrid Bonding in Powering Future HPC and AI Products
This article shares some of the research from the IDTechEx report, " Advanced Semiconductor Packaging 2024-2034: Forecasts, Technologies, Applications ."
- This article shares some of the research from the IDTechEx report, " Advanced Semiconductor Packaging 2024-2034: Forecasts, Technologies, Applications ."
- Microbump technology, a well-established technology in semiconductor packaging, relies on the Thermal Compression Bonding (TCB) process and has a widespread application across various products.
- Despite these drawbacks, wafer-to-wafer bonding remains the most commonly employed approach for Cu-Cu hybrid bonding in current commercial applications.
- Hybrid bonding is poised to revolutionize the landscape of future HPC and AI products, offering a host of advantages that will shape the industry's path forward.