ASE Group

Global 3D TSV Devices Strategic Market Report 2023-2030: Ongoing Proliferation of Cloud-Based Applications to Encourage Adoption of 3D TSV Devices

Retrieved on: 
Monday, October 9, 2023
Cloud, COVID-19, Information Communications Technology education in the Philippines, MEMS, Real, Communication, Developed country, Comparison, DRAM, Osat, Transformation, ASE Group, Development, Defense, Broadcom Inc., TSV, Growth, Disruption, IO, Consumer electronics, Information and communications technology, Amkor Technology, Mems, VS, Access, Memory, Total cost, Industrial internet of things, IDMS, Information, Tablet, Electronic, Global Investment in American Jobs Act of 2013, Mobile phone, Pet industry, Video game, Cryptocurrency, Semiconductor, Geography, Electronics

DUBLIN, Oct. 9, 2023 /PRNewswire/ -- The "3D TSV Devices - Global Strategic Business Report" report has been added to ResearchAndMarkets.com's offering.

Key Points: 
  • DUBLIN, Oct. 9, 2023 /PRNewswire/ -- The "3D TSV Devices - Global Strategic Business Report" report has been added to ResearchAndMarkets.com's offering.
  • The global market for 3D TSV Devices estimated at US$5.9 Billion in the year 2022, is projected to reach a revised size of US$27.7 Billion by 2030, growing at a CAGR of 21.3% over the analysis period 2022-2030.
  • Memory, one of the segments analyzed in the report, is projected to record 20.7% CAGR and reach US$8 Billion by the end of the analysis period.
  • The 3D TSV Devices market in the U.S. is estimated at US$954.3 Million in the year 2022.

GaN and SiC Technologies on Spotlight at PowerUP Asia Conference

Retrieved on: 
Monday, April 24, 2023
NXP Semiconductors, Exhibition, UTAC Group, Electronics, Infineon Technologies, EPC, Arrow Electronics, EVS, Rohde & Schwarz, Silicon carbide, WBG, Traction, STMicroelectronics, Silicon, ASE Group, Analog Devices, Gallium nitride, News, Video game, Consumer electronics, Yole

WBG is one of the key focus topics at the upcoming PowerUP Asia conference and virtual exhibition on May 24-26, 2023.

Key Points: 
  • WBG is one of the key focus topics at the upcoming PowerUP Asia conference and virtual exhibition on May 24-26, 2023.
  • Organized by AspenCore, the publisher of EETimes Asia, EETimes India, and EDN Asia, PowerUP Asia puts the spotlight on the key players and the latest technologies and trends in the power electronics industry in Asia.
  • PowerUP Asia builds on the success of the established PowerUP Expo, a virtual conference and exhibition being held by Power Electronics News, a sister publication under AspenCore.
  • With fairgrounds, an exhibition hall, and a conference space, PowerUP Asia functions similarly to a live exhibition and conference.

Inaugural PowerUP Asia Conference Highlights Latest Innovations in Asia's Power Electronics Industry

Retrieved on: 
Friday, April 21, 2023
NXP Semiconductors, EV, Exhibition, UTAC Group, Electronics, Infineon Technologies, EPC, GMI, Research, Carbon, Arrow Electronics, EVS, TW, WBG, STMicroelectronics, Growth, ASE Group, Analog Devices, News, Video game, Consumer electronics

To put the spotlight on the key players and the latest technologies and trends in the power electronics industry in Asia, AspenCore, the publisher of EETimes Asia, EETimes India, and EDN Asia, will hold the inaugural PowerUP Asia conference and virtual exhibition on May 24-26, 2023.

Key Points: 
  • To put the spotlight on the key players and the latest technologies and trends in the power electronics industry in Asia, AspenCore, the publisher of EETimes Asia, EETimes India, and EDN Asia, will hold the inaugural PowerUP Asia conference and virtual exhibition on May 24-26, 2023.
  • PowerUP Asia builds on the success of the established PowerUP Expo, a virtual conference and exhibition being held by Power Electronics News, a sister publication under AspenCore.
  • Focusing on this region, PowerUP Asia is a three-day virtual conference and exhibition highlighting the latest technology developments and trends in power electronics, including wide-bandgap (WBG) devices, power semiconductors, and related technologies.
  • With fairgrounds, an exhibition hall, and a conference space, PowerUP Asia functions similarly to a live exhibition and conference.

Advantest Announces Speaker Lineup and Program for VOICE 2023 Developer Conference, May 8-10

Retrieved on: 
Tuesday, April 11, 2023
Qualcomm, Meta, Gartner, SAN, VOICE, Producers Guild of America Visionary Award, Research, Synopsys, VR, Expo, Coelho, ACS, Machine learning, Engineering, Artificial intelligence, AI, ASE Group, Robotics, Conference, RF, Economics, TSE, Mobile phone, Tourism, Advantest

On Tuesday, May 9, VOICE will feature keynote addresses from two dynamic speakers with diverse technical backgrounds and areas of expertise.

Key Points: 
  • On Tuesday, May 9, VOICE will feature keynote addresses from two dynamic speakers with diverse technical backgrounds and areas of expertise.
  • On Wednesday, May 10, the first featured speaker will be Claudionor Coelho, chief AI officer and senior VP of engineering for Advantest.
  • VOICE 2023 will close Wednesday afternoon with an award ceremony recognizing the event’s best papers and honorable mentions.
  • Endowed in 2020, this award honors an Advantest customer who has made significant, sustained contributions to VOICE over the years.

$11.2 Billion Worldwide Wafer Level Packaging Industry to 2027: Players Include Amkor Technology, China Wafer Level CSP, Chipbond Technology and Deca Technologies

Retrieved on: 
Thursday, December 29, 2022
Miniaturization, Amkor Technology, Internet of things, Infineon Technologies, IOT, Toshiba, Fujitsu, COVID-19, IQE, R, WLP, Electronics, ICS, Research, ASE Group, Video game console, Retail, Potash, Growth

The global wafer level packaging market reached a value of US$ 4.0 Billion in 2021.

Key Points: 
  • The global wafer level packaging market reached a value of US$ 4.0 Billion in 2021.
  • The wafer-level packaging (WLP) refers to a packaging solution used for adding a protective layer of electronic connections and integrated circuits (ICs).
  • These solutions are used at the wafer-level of the device, instead of dicing the wafer into the individual die and packaging them.
  • What is the structure of the global wafer level packaging market and who are the key players?

Asteelflash to Showcase Integrated Supply Chain Solution for Car Interior Lighting at Electronica

Retrieved on: 
Thursday, November 17, 2022
Gilbert Strang, USI, APIX, Automotive pixel link, Technology, LED, Digital, Timmerman, Automotive industry, Maintenance, TWSE, Partnership, SIP, YouTube, SSE, NYSE, Electronics, CEO, DICE, Electronica, Communication, ASE, ICS, Wireless sensor network, EMS, Data-rate units, Inova Health System, ASE Group, Solution, Mobile phone, Miniaturization

"We are excited to participate in the Electronica to present our latest solutions in supply chain management and EMS.

Key Points: 
  • "We are excited to participate in the Electronica to present our latest solutions in supply chain management and EMS.
  • The successful launch of the module is the result of an optimized supply chain as it involves three parties together to deliver the best EMS, according to Timmerman.
  • The final offering, an in-car ambiance lighting system, made up of driver ICs, LED and passive components, is assembled using technology fromUSI/Asteelflashand ASE Group.
  • Carmakers are increasingly looking for integrators that can simplify supply chains in interior lighting system and in-car display drivers.

Bishop-McCann Named to 2022 MeetingsNet CMI 25 List; Recognized as One of North America’s Largest Meetings, Incentive Programs, and Events Agencies

Retrieved on: 
Tuesday, September 13, 2022
Professional Services, Other Professional Services, Other Travel, Transportation, Lodging, Travel, MPI, Association, Industry, Travel, ASE Group, Meeting, Bishop, Board, Education, View, Trustee

MeetingsNet, a digital magazine and website dedicated to the meetings and incentives industry, has named Kansas City-based Bishop-McCann to its 2022 CMI 25 list, which highlights the largest and most influential corporate full-service meeting and incentive travel management companies in North America.

Key Points: 
  • MeetingsNet, a digital magazine and website dedicated to the meetings and incentives industry, has named Kansas City-based Bishop-McCann to its 2022 CMI 25 list, which highlights the largest and most influential corporate full-service meeting and incentive travel management companies in North America.
  • This is the 15th year that Bishop-McCanna worldwide leader in the meetings, incentives, and events industryhas been included on this list.
  • We continue to create JOY for our clients by delivering the absolute best experiences, and were humbled to once again be named to this impressive industry list.
  • Adams serves on the Meetings Professional International (MPI) Board of Trustees, the worlds largest meetings and events industry association, and he was named one of the top 25 influencers in the meetings and events industry in 2019.

Outlook on the Semiconductor Equipment Global Market to 2026 - Increased use of Semiconductors in Medical Devices is Driving Growth - ResearchAndMarkets.com

Retrieved on: 
Friday, July 8, 2022
Technology, Semiconductor, IDM, Integrated circuit, Semiconductor, Silicon, Supply, ASE Group, DRAM, Supply chain, R, COVID-19, Foundry, Logic, Segment, ASE, CAGR, MEMS, Dimension, Time, OSAT, Acceleration, Assembly, Amkor Technology, Test, Light-emitting diode

The global semiconductor equipment market, was valued at US$104.65 billion in 2021, and is probable to reach US$167.78 billion by 2026.

Key Points: 
  • The global semiconductor equipment market, was valued at US$104.65 billion in 2021, and is probable to reach US$167.78 billion by 2026.
  • The semiconductor equipment market is projected to grow at a CAGR of 9.90%, during the forecast period of 2022-2026.
  • By Segment: The report splits the global semiconductor equipment market into three different segments: Wafer equipment, Assembly and packaging equipment and Test equipment.
  • The wafer equipment segment accounted for majority of approximately 86% of the semiconductor equipment market in 2021.

Global Semiconductor Equipment Market Report to 2026 - Featuring ASML Holding Semiconductor, Tokyo Electron and Lam Research Among Others

Retrieved on: 
Wednesday, July 6, 2022
IDM, Integrated circuit, Semiconductor, Silicon, Supply, ASE Group, Supply chain, DRAM, R, Intelligence, COVID-19, Growth, Urbanization, Foundry, Segment, Logic, Robotics, ASE, CAGR, Technology, MEMS, Dimension, Time, OSAT, Acceleration, Assembly, Amkor Technology, Renewable energy, Electronics, Consumer electronics, Test, Light-emitting diode

The global semiconductor equipment market, was valued at US$104.65 billion in 2021, and is probable to reach US$167.78 billion by 2026.

Key Points: 
  • The global semiconductor equipment market, was valued at US$104.65 billion in 2021, and is probable to reach US$167.78 billion by 2026.
  • By Segment: The report splits the global semiconductor equipment market into three different segments: Wafer equipment, Assembly and packaging equipment and Test equipment.
  • By Dimensions: The semiconductor equipment market report has categorized the global market into three segments on the basis of dimensions: 2D, 2.5D and 3D.
  • Global Semiconductor Equipment Market Dynamics:
    Growth Drivers: Semiconductor Equipment industry is mounting due to the cumulative consumption of electronics industry.

Cogobuy Announces 2021 Annual Results

Retrieved on: 
Friday, April 1, 2022
Cloud, Company, EVS, CAGR, Align Technology, 3D, FPGA, Growth, EV, Board, Investor, Smart manufacturing, Bank of China, Cogobuy, Platinum, CEO, Lidar, Intelligence, Communication, Integration platform, Government, Robotics, Artificial intelligence, Bank, Industry, Technology, Safety, Intention, Improper integral, Ecosystem, Time, IOT, IC, US, Yoy, Income, Acceleration, Policy, ASE Group, Solution, Endoscopy, WIFI, Semiconductor Industry Association, R, Efficiency, SIA, Internet, AI, Hong Kong Stock Exchange, Security (finance), Video game console, Group, V2X, Huawei

HONG KONG, March 31, 2022 /PRNewswire/ --Cogobuy Group ("Cogobuy" or the "Company", stock code: 400.HK; with its subsidiaries (the ''Group'')), a technology services company focusing on serving the global chip industry and artificial intelligence ("AI") and internet of things ("IoT", together "AIoT") ecosystem, is pleased to announce its unaudited consolidated results for the Year ended December 31, 2021 ("2021" or the "Year").

Key Points: 
  • HONG KONG, March 31, 2022 /PRNewswire/ --Cogobuy Group ("Cogobuy" or the "Company", stock code: 400.HK; with its subsidiaries (the ''Group'')), a technology services company focusing on serving the global chip industry and artificial intelligence ("AI") and internet of things ("IoT", together "AIoT") ecosystem, is pleased to announce its unaudited consolidated results for the Year ended December 31, 2021 ("2021" or the "Year").
  • In 2021 global chip sales volume was 1.15 trillion pieces, with a YoY increase of 26.2% to US$555.9 billion.
  • Moreover, in order to give investors a clearer understanding of the main business of "Comtech" and "Cogobuy Group", the Company plans to change its name from "Cogobuy Group" to "Ingdan Inc.".
  • Mr. Jeffrey Kang, CEO of Cogobuy Group, said, "2021 was the first year of China's '14th Five-Year Plan', and the national policy strongly supported and continues to support the development of technology.