Silicon Integration Initiative

Si2 Reorganizes, Promotes Two Technologists to Bolster Semiconductor Interoperability Programs

Retrieved on: 
Thursday, February 10, 2022
Data Management, Technology, Semiconductor, Security, Other Technology, Software, Nanotechnology, Networks, Internet, Hardware, Electronic Design Automation, Algorithm, Pace University, IC, CEO, Clevenger, API, VLSI, Data science, Database, Compact Model Coalition, Marshall, Silicon Integration Initiative, Data lake, UPM, Bureau of Agricultural and Fisheries Product Standards, Silicon, Unified Power Format, National Cooperative Research and Production Act, Motorola, IBM, Tiner, Defense Production Act of 1950, Computer, OpenAccess, Machine learning, Research, Intelligence, Industry, Big data, Management, Medical device, Technology, Si2

John Ellis, president and CEO, said, Experts throughout the industry consider interoperability in semiconductor design a primary strategy to accelerate innovation and achieve faster time-to-results and time-to-market.

Key Points: 
  • John Ellis, president and CEO, said, Experts throughout the industry consider interoperability in semiconductor design a primary strategy to accelerate innovation and achieve faster time-to-results and time-to-market.
  • With this reorganization, Si2 positions itself to advance its current interoperability activities and identify new opportunities.
  • She will continue driving work in AI/ML and UPM in this new role while developing additional Si2 technical activities in interoperability through the new Si2 TITAN council.
  • In his new position, Tiner oversees the development of OpenAccess, the Si2 flagship product and the semiconductor industrys most widely used database and API for semiconductor design.

Anant Adke of Siemens EDA Joins Si2 Board of Directors

Retrieved on: 
Wednesday, February 2, 2022
Technology, Semiconductor, Telecommunications, Nanotechnology, Software, Internet, Hardware, Electronic Design Automation, Data Management, Silicon Integration Initiative, CEO, IC, EDA, Institute, National Cooperative Research and Production Act, Silicon, University, Technology, Research, University of Michigan, OpenAccess, IIT Bombay, Industry, Mentor Graphics, Multimedia, Defense Production Act of 1950, Solution, Management, Engineering, A. S. Adke, Si2

Anant Adke, vice president of Engineering, Siemens EDA, has been elected to the Silicon Integration Initiative board of directors.

Key Points: 
  • Anant Adke, vice president of Engineering, Siemens EDA, has been elected to the Silicon Integration Initiative board of directors.
  • View the full release here: https://www.businesswire.com/news/home/20220202005675/en/
    Anant Adke, vice president of Engineering, Siemens EDA, has been elected to the Silicon Integration Initiative board of directors.
  • The addition of Anant continues the strong support Siemens EDA has provided Si2 over the years, said John Ellis, Si2 president and CEO.
  • As a longstanding board member, Siemens EDA strongly supports tool interoperability and the value and cost-savings it provides for the industry.

Rahul Goyal of Intel Re-Elected Board Chair of Silicon Integration Initiative

Retrieved on: 
Thursday, November 18, 2021
Software, Mobile, Wireless, Networks, Internet, Hardware, Electronic Design Automation, Data Management, Technology, Semiconductor, Security, Nanotechnology, Telecommunications, Electrical engineering, CEO, IBM, Ansys, Intel, Ecosystem, Technology, Electronics, Computer, Samsung, Texas Instruments, Engineering, Silicon, National Cooperative Research and Production Act, Leadership, Syracuse University, Solution, Silicon Integration Initiative, Computer engineering, Software, SK, Machine learning, Research, Artificial intelligence, Defense Production Act of 1950, GlobalFoundries, Birla Institute of Technology and Science, Pilani, Qualcomm, Management

Rahul Goyal, vice president and general manager of Product and Design Ecosystem Enablement at Intel Corporation, has been re-elected to a one-year term as chairman of the board of directors of Silicon Integration Initiative, a leading research and development joint venture that provides design interoperability standards and solutions from silicon to systems.

Key Points: 
  • Rahul Goyal, vice president and general manager of Product and Design Ecosystem Enablement at Intel Corporation, has been re-elected to a one-year term as chairman of the board of directors of Silicon Integration Initiative, a leading research and development joint venture that provides design interoperability standards and solutions from silicon to systems.
  • Other companies represented on the Si2 board of directors are: Ansys, Cadence, GlobalFoundries, Google, IBM, Siemens EDA, Qualcomm Technologies, Samsung, SK hynix, Synopsys, and Texas Instruments.
  • Goyal has global responsibility at Intel for strategic sourcing, supply chain strategy, strategic collaborations, ecosystem enablement, data analytics, and capacity management related to product development lifecycle across Intels broad product portfolio.
  • Goyal joined Intel in 1989 and has held various technical and management positions in software engineering and technology development.

Si2 Launches TITAN Initiative Advancing Silicon-to-System Technology Interoperability

Retrieved on: 
Tuesday, November 16, 2021
Research, Technology, Semiconductor, Security, Nanotechnology, Software, Hardware, Electronic Design Automation, Data Management, Science, EDA, OpenAccess, CEO, Arm, Silicon Integration Initiative, Cadence Design Systems, Technology, IC, IOT, Compact Model Coalition, Special interest group, Research, SPEED, AI, Decision-making, Silicon, SK, TITAN, ML, Computer scientist, National Cooperative Research and Production Act, Intel, Qualcomm, API, Defense Production Act of 1950, IBM, Ansys, Microsoft, Samsung Electronics, Ceramic, Risk management

TITAN will work with Si2 member companies to explore a spectrum of technology interoperability gaps between electronic design automation suppliers, cloud providers, foundries, semiconductor and emerging silicon-to-system companies.

Key Points: 
  • TITAN will work with Si2 member companies to explore a spectrum of technology interoperability gaps between electronic design automation suppliers, cloud providers, foundries, semiconductor and emerging silicon-to-system companies.
  • TITAN will generate consensus on technology interoperability in workflows and advise the Si2 board of directors on high-level trends and realizable solutions.
  • In addition, TITAN will bridge established Si2 programs such as the OpenAccess, Compact Model and OpenStandards Coalitions, and Special Interest Groups.
  • TITAN will serve as the trusted technology advisor to the Si2 board of directors, which evaluates and forwards proposals to Si2 technology teams for prioritization and action plans.

The 2021 RISC-V Summit to Co-Locate with the 58th Design Automation Conference (DAC) in San Francisco

Retrieved on: 
Wednesday, July 28, 2021
Technology, Mobile, Wireless, Semiconductor, Security, Other Technology, Telecommunications, Software, Hardware, Electronic design automation, IEEE conferences, Events, Design Automation Conference, Conferences, DAC, Electronic design automation, Education, Silicon Integration Initiative, Asia and South Pacific Design Automation Conference, RISC-V International, Design Automation Conference (DAC), RISC-V INTERNATIONAL, DESIGN AUTOMATION CONFERENCE (DAC)

RISC-V International and the Design Automation Conference (DAC) today announced the co-location of the 2021 RISC-V Summit with the 58th DAC at Moscone West in San Francisco in December 2021.

Key Points: 
  • RISC-V International and the Design Automation Conference (DAC) today announced the co-location of the 2021 RISC-V Summit with the 58th DAC at Moscone West in San Francisco in December 2021.
  • DAC is the industrys essential hub for technical information, insights and networking that drives the future of electronics design, said Harry Foster, General Chair, 58th Design Automation Conference.
  • The Design Automation Conference (DAC) is recognized as the premier event for the design of electronic circuits and systems, and for electronic design automation (EDA) and silicon solutions.
  • Design Automation Conference acknowledges trademarks or registered trademarks of other organizations for their respective products and services.

Authors of AI/ML White Paper Win Annual Si2 Power of Partnerships Award

Retrieved on: 
Wednesday, July 28, 2021
Technology, Electronic design automation, Semiconductor, Other Technology, Silicon Integration Initiative, Electronic engineering, Technology, Si2, SEMI, Science and technology, Electronic design automation, Automation, Articles, Common Power Format

Authors of a groundbreaking Silicon Integration Initiative white paper identifying a common data model as the most critical need to accelerate artificial intelligence and machine learning in semiconductor electronic design automation are winners of the 2021 Si2 Power of Partnerships Award.

Key Points: 
  • Authors of a groundbreaking Silicon Integration Initiative white paper identifying a common data model as the most critical need to accelerate artificial intelligence and machine learning in semiconductor electronic design automation are winners of the 2021 Si2 Power of Partnerships Award.
  • The annual awards recognize the Si2 volunteer team that has made the most significant contributions to EDA innovation and efficiency.
  • Si2 will present the awards at the Si2 Annual Technology Forum , Friday, August 6, 8:00 a.m. 10:00 a.m. Pacific Standard Time.
  • The white paper also identified a common reference flow, online AI/ML courses and organized training data as industry needs.

Executives from Cadence, SK hynix Join Si2 Board of Directors

Retrieved on: 
Wednesday, July 7, 2021
Semiconductor, Electronic design automation, Other Technology, Technology, Software, Semiconductor device fabrication, Technology, Silicon Integration Initiative, Organizations, Industry economics), Synopsys, Semiconductor industry, SEMI, Fabless manufacturing, Si2, Cadence Design Systems, OpenAccess

Silicon Integration Initiative , a leading research and development joint venture providing standard interoperability solutions for semiconductor design tools, announced today the election of its board of directors for 2021-2022.

Key Points: 
  • Silicon Integration Initiative , a leading research and development joint venture providing standard interoperability solutions for semiconductor design tools, announced today the election of its board of directors for 2021-2022.
  • Joining the Si2 board for their first full terms are:
    Aparna Dey, Senior Product Marketing Group Director, Cadence Design Systems
    David DeMaria, corporate vice president, Strategic Initiatives and Market Intelligence, Synopsys
    Keith Green, distinguished member of the technical staff, Texas Instruments
    The board elected prior board member, John Lee, general manager and vice-president, Ansys, as an ex-officio board member.
  • Lee will advise the board with regards to Si2's long-term strategy for design-in-the-cloud, as well as for artificial intelligence and machine learning-enabled design.
  • The Si2 board represents leading semiconductor manufacturers and foundries, fabless companies, and EDA software providers.

Si2 Annual Technical Forum Focuses on Semiconductor Design in the Cloud

Retrieved on: 
Tuesday, July 6, 2021
Software, Mobile, Wireless, Networks, Internet, Hardware, Electronic design automation, Data management, Technology, Semiconductor, Security, Nanotechnology, Other Technology, Software, Electronic design automation, Technology, OpenAccess, Proprietary software, Compact Model Coalition, Semiconductor devices, Silicon Integration Initiative, Integrated circuit, Spice

The growing impact and productivity gains of designing semiconductors in the cloud comprise the focus the Si2 Annual Technology Forum, an online event scheduled for Friday, August 6, from 8:00 a.m. - to 10:00 a.m. Pacific Standard Time.

Key Points: 
  • The growing impact and productivity gains of designing semiconductors in the cloud comprise the focus the Si2 Annual Technology Forum, an online event scheduled for Friday, August 6, from 8:00 a.m. - to 10:00 a.m. Pacific Standard Time.
  • Silicon Integration Initiative is an R&D joint venture providing standard interoperability solutions for semiconductor design tools.
  • Si2s key programs include OpenAccess, a standard application programming interface and reference source code for the design database used by all major chip design software suppliers, and the Compact Model Coalition, which selects and supports industry-standard SPICE simulation models.

Peter Lee of Micron Tapped for Si2 Pinnacle Award

Retrieved on: 
Tuesday, May 11, 2021
Software, Mobile, Wireless, Networks, Internet, Hardware, Electronic design automation, Data management, Technology, Semiconductor, Nanotechnology, Other Technology, Telecommunications, Silicon Integration Initiative, Si2, Micron Technology, Dynamic random-access memory, Technology, Computing, Science and technology

b'Peter Lee, director of a global team responsible for the DRAM design environment at Micron Technology, will receive the quarterly Silicon Integration Initiative Pinnacle Award.

Key Points: 
  • b'Peter Lee, director of a global team responsible for the DRAM design environment at Micron Technology, will receive the quarterly Silicon Integration Initiative Pinnacle Award.
  • This award recognizes volunteers for their exceptional contributions to Si2\xe2\x80\x99s success as a leading semiconductor R&D joint venture.\nThis press release features multimedia.
  • View the full release here: https://www.businesswire.com/news/home/20210511005032/en/\nPeter Lee, director of a global team responsible for the DRAM design environment at Micron Technology, will receive the quarterly Silicon Integration Initiative Pinnacle Award.
  • This award recognizes volunteers for their exceptional contributions to Si2\xe2\x80\x99s success as a leading semiconductor R&D joint venture.

John Lee of Ansys Joins Si2 Board of Directors

Retrieved on: 
Thursday, April 8, 2021
Mobile, Wireless, Technology, Semiconductor, Telecommunications, Nanotechnology, Networks, Internet, Hardware, Electronic design automation, Data management, Ansys, Canonsburg, Pennsylvania, Silicon Integration Initiative, SEMI, Technology, Computer companies, Software industry

John Lee, general manager and vice president of the Ansys Electronics and Semiconductor Division, has been elected to the Silicon Integration Initiative board of directors.

Key Points: 
  • John Lee, general manager and vice president of the Ansys Electronics and Semiconductor Division, has been elected to the Silicon Integration Initiative board of directors.
  • View the full release here: https://www.businesswire.com/news/home/20210408005147/en/
    John Lee, general manager and vice president of the Ansys Electronics and Semiconductor Division, Canonsburg, Penn.
  • (Photo: Business Wire)
    Lee co-founded and served as CEO of Gear Design Solutions, which was acquired by Ansys in 2015.
  • John Ellis, Si2 president and CEO, said, Johns experience as a successful serial entrepreneur brings unique insights to the board of directors.