Applied Materials’ Innovative Pattern-Shaping Technology Reduces the Cost, Complexity and Environmental Impact of Advanced Chip Manufacturing
Customers increasingly use EUV double patterning to print chip features smaller than the resolution limits of EUV to optimize chip area and cost.
- Customers increasingly use EUV double patterning to print chip features smaller than the resolution limits of EUV to optimize chip area and cost.
- Using EUV double patterning, chipmakers split a high-density pattern in half and produce two masks that adhere to the resolution limits of EUV.
- Both halves of the pattern are combined on intermediate patterning films and then etched into the wafer.
- Additional information about Applied’s Sculpta system will be discussed at the company’s “ New Ways to Shrink: Advanced Patterning Products Launch ” event being held today.