EUV

Former Intel executive Thomas Lantzsch joins Canatu’s Board of Directors

Retrieved on: 
Tuesday, April 16, 2024
EUV, Internet, Executive, Miniaturization, Internet of things, Arm, CNTS, Membrane, ARM, Semiconductor, Carbon, Intel, CNT, Marketing, Arm (company), Growth, Management

VANTAA, FINLAND, April 16, 2024 (GLOBE NEWSWIRE) -- Canatu, the global leader in developing advanced carbon nanotubes (Canatu CNTs) and manufacturing equipment for the semiconductor and automotive industries, today announced the appointment of former Intel executive Thomas Lantzsch to Canatu’s Board of Directors.

Key Points: 
  • VANTAA, FINLAND, April 16, 2024 (GLOBE NEWSWIRE) -- Canatu, the global leader in developing advanced carbon nanotubes (Canatu CNTs) and manufacturing equipment for the semiconductor and automotive industries, today announced the appointment of former Intel executive Thomas Lantzsch to Canatu’s Board of Directors.
  • Prior to Intel, Lantzsch worked at ARM Holdings PLC for ten years, where he held various roles in strategy, corporate development, and marketing, serving most recently as the Executive Vice President of Strategy.
  • This clearly showcases the significant advantages of Canatu CNTs over traditional materials," said Tom Lantzsch, Board of Directors, Canatu.
  • "I’m honored to join the Board of Directors to continue to drive innovation and advance the field with Canatu's unparalleled technology."

Intel Takes Next Step Toward Building Scalable Silicon-Based Quantum Processors

Retrieved on: 
Wednesday, May 1, 2024
Science, Nanotechnology, Research, Hardware, Engineering, Technology, Semiconductor, Manufacturing, CMOS, Quantum, Multimedia, EUV, Silicon, Nature, Computer, Credit, Intel, Computer data storage

The industry-leading research opens the door for the mass production and continued scaling of silicon-based quantum processors, all of which are requirements for building a fault-tolerant quantum computer.

Key Points: 
  • The industry-leading research opens the door for the mass production and continued scaling of silicon-based quantum processors, all of which are requirements for building a fault-tolerant quantum computer.
  • View the full release here: https://www.businesswire.com/news/home/20240501215284/en/
    A photo shows a 300-millimeter Intel silicon spin qubit wafer.
  • In May 2024, Nature published an Intel research paper, “Probing single electrons across 300-mm spin qubit wafers,” demonstrating state-of-the-art uniformity, fidelity and measurement statistics of spin qubits.
  • However, the main priority will continue to be scaling quantum devices and improving performance with its next generation quantum chip.

Lithography Equipment Market Projected to Reach $50.98 billion by 2030 - Exclusive Report by 360iResearch

Retrieved on: 
Saturday, April 6, 2024
MEMS, ASML Holding, Nikon, ICS, EUV, DUV, Growth, Intelligence, Laser ablation, Lithography, Electronics, Research, Computer, Lam Research, Investment, Miniaturization, Table, Health, Carl Zeiss AG, Printed circuit board

The industry is forging ahead with innovations such as nanoimprint lithography to meet the demands for finer microchip features affordably.

Key Points: 
  • The industry is forging ahead with innovations such as nanoimprint lithography to meet the demands for finer microchip features affordably.
  • Strategic collaborations between lithography machinery suppliers and semiconductor firms are crucial in pioneering next-gen lithography solutions.
  • We proudly unveil ThinkMi, a cutting-edge AI product designed to transform how businesses interact with the Lithography Equipment Market.
  • "Dive into the Lithography Equipment Market Landscape: Explore 193 Pages of Insights, 588 Tables, and 26 Figures"

Lithography Equipment Market Projected to Reach $50.98 billion by 2030 - Exclusive Report by 360iResearch

Retrieved on: 
Saturday, April 6, 2024
MEMS, ASML Holding, Nikon, ICS, EUV, DUV, Growth, Intelligence, Laser ablation, Lithography, Electronics, Research, Computer, Lam Research, Investment, Miniaturization, Table, Health, Carl Zeiss AG, Printed circuit board

The industry is forging ahead with innovations such as nanoimprint lithography to meet the demands for finer microchip features affordably.

Key Points: 
  • The industry is forging ahead with innovations such as nanoimprint lithography to meet the demands for finer microchip features affordably.
  • Strategic collaborations between lithography machinery suppliers and semiconductor firms are crucial in pioneering next-gen lithography solutions.
  • We proudly unveil ThinkMi, a cutting-edge AI product designed to transform how businesses interact with the Lithography Equipment Market.
  • "Dive into the Lithography Equipment Market Landscape: Explore 193 Pages of Insights, 588 Tables, and 26 Figures"

Intel Outlines Financial Framework for Foundry Business, Sets Path to Margin Expansion

Retrieved on: 
Tuesday, April 2, 2024
Professional Services, Semiconductor, Technology, Manufacturing, Finance, Other Manufacturing, Hardware, IDM, 8-K, PDT, Intel, EUV, Growth, NEX, Form, Webcast, CCG, News, AI, Software, Security (finance), Parity, GAAP, Direct connect

The company also shared a targeted path toward long-term growth and profitability of Intel Foundry, as well as clear goals for driving financial performance improvement and shareholder value creation.

Key Points: 
  • The company also shared a targeted path toward long-term growth and profitability of Intel Foundry, as well as clear goals for driving financial performance improvement and shareholder value creation.
  • Intel Foundry is a newly established operating segment that includes foundry technology development, foundry manufacturing and supply chain, and foundry services (formerly IFS).
  • Under this new structure, Intel Foundry will recognize revenues generated from both external foundry customers and Intel Products, as well as technology development and product manufacturing costs historically allocated to Intel Products.
  • As part of today’s news, Intel also announced the appointment of Lorenzo Flores as chief financial officer of Intel Foundry, effective April 8, 2024.

DNP Accelerates Development of Photomask Manufacturing Process for 2nm Generation EUV Lithography

Retrieved on: 
Wednesday, March 27, 2024
Semiconductor, Technology, Manufacturing, Nanotechnology, Other Manufacturing, Hardware, Dai, Eye, Multimedia, DNP, EUV, Miniaturization, Growth

Dai Nippon Printing Co., Ltd. (DNP, TOKYO: 7912) has begun development of a photomask manufacturing for 2-nanometer (10-9 meter) generation logic semiconductors that support Extreme Ultra-Violet (EUV) lithography, the cutting-edge process for semiconductor manufacturing.

Key Points: 
  • Dai Nippon Printing Co., Ltd. (DNP, TOKYO: 7912) has begun development of a photomask manufacturing for 2-nanometer (10-9 meter) generation logic semiconductors that support Extreme Ultra-Violet (EUV) lithography, the cutting-edge process for semiconductor manufacturing.
  • In 2023, we completed the development of a photomask manufacturing process for 3-nm generation EUV lithography , and commenced development of 2-nm generation technology.
  • DNP plans to bring online its second and third MBMW mask lithography systems in FY 2024, accelerating the development of photomasks for 2-nm generation EUV lithography.
  • By FY 2025, DNP will complete the development of a manufacturing process for photomasks for 2-nm generation logic semiconductors that support EUV lithography.

Silicon Motion Unveils 6nm UFS 4.0 Controller for AI Smartphones, Edge Computing and Automotive Applications

Retrieved on: 
Tuesday, March 12, 2024
ECC, MB, UFS, SRAM, EUV, QLC, SCSI, MIPI, Universal Flash Storage, SIMO, AI, TLC, LDPC, Data-rate units, JEDEC, Senior, UniPro, Silicon, Architecture, SAM, 2.0, TB, Marketing, Silicon Motion, UFS 3.1, IOT, Computer data storage

TAIPEI and MILPITAS, Calif., March 12, 2024 /PRNewswire/ -- Silicon Motion Technology Corporation (NasdaqGS: SIMO) ("Silicon Motion"), a global leader in designing and marketing NAND flash controllers for solid state storage devices, today introduced its UFS (Universal Flash Storage) 4.0 controller, the SM2756, as the flagship of the industry's broadest merchant portfolio of UFS controller solutions for the growing requirements of AI-powered smartphones as well as other high-performance applications including automotive and edge computing. The company also added a new, second generation SM2753 UFS3.1 controller to broaden its portfolio of controllers now supporting UFS4.0 to UFS2.2 standards.   Silicon Motion's UFS portfolio delivers high-performance and low power embedded storage for flagship to mainstream and value mobile and computing devices, supporting the broadest range of NAND flash, including next-generation high speed 3D TLC and QLC NAND.

Key Points: 
  • The company also added a new, second generation SM2753 UFS3.1 controller to broaden its portfolio of controllers now supporting UFS4.0 to UFS2.2 standards.
  • Silicon Motion's UFS portfolio delivers high-performance and low power embedded storage for flagship to mainstream and value mobile and computing devices, supporting the broadest range of NAND flash, including next-generation high speed 3D TLC and QLC NAND.
  • The new second generation SM2753 UFS 3.1 controller solution boasts a high-speed serial-link-based MIPI M-PHY HS-Gear4 x 2-lane, and SCSI architecture model (SAM) enabling unparalleled performance.
  • Silicon Motion's latest UFS controller solutions are equipped with advanced LDPC ECC technology and SRAM data error detection and correction.

Applied Materials Expands Patterning Solutions Portfolio for Angstrom Era Chipmaking

Retrieved on: 
Monday, February 26, 2024
Engineering, SAN, EUV, Intel, Research, Samsung Electronics, XP, CVD, Carbon, SPIE, Applied Materials, Pioneer, ALD, CMP, Memory, Photon, Process control, EBeam, Logic, Corporation, Printed circuit board

These yield-killing defects are becoming more prevalent as chipmakers implement angstrom era designs with narrower line and space patterns.

Key Points: 
  • These yield-killing defects are becoming more prevalent as chipmakers implement angstrom era designs with narrower line and space patterns.
  • In foundry-logic, Sym3 Y Magnum has already been adopted for critical etch applications at leading chipmakers and is now being deployed for EUV patterning in angstrom era nodes.
  • Since 2012, Applied Materials has made patterning a research and development priority, investing to deliver new products and solutions that help customers overcome their toughest patterning challenges, particularly in emerging EUV and High-NA EUV applications.
  • The company’s patterning product portfolio today includes CVD and ALD deposition; four types of materials removal (etch, selective materials removal, pattern shaping and CMP); thermal processes; and eBeam metrology.

LIS Technologies Inc. Welcomes Expert Talent to help Propel the Rebirth of the CRISLA Laser Enrichment Technology

Retrieved on: 
Wednesday, February 7, 2024
LIS, Isotope, Patent, AVLIS, DUV, Welding, Laboratory, Electronics, Laser, Uranium, CO2, LLNL, EUV, Technician, ASML, 3D printing

Kevin Duenow will take on the role of Senior Systems Engineer and Adam Duenow joins as a Laboratory Technician.

Key Points: 
  • Kevin Duenow will take on the role of Senior Systems Engineer and Adam Duenow joins as a Laboratory Technician.
  • These appointments are important to the Company's strategic initiative to reinvigorate CRISLA technologies with a clear and defined focus.
  • In the early 90’s he worked as a Laser and Electronics Engineer on the AVLIS laser enrichment program at LLNL.
  • This proprietary laser-based technique offers greater energy-efficiency and has the potential to be deployed with highly competitive capital and operational costs.

Toppan Photomask Signs Agreement with IBM for Joint R&D on Semiconductor EUV Photomasks

Retrieved on: 
Wednesday, February 7, 2024
IBM, Growth, Research, Mask, Toppan, Miniaturization, ARF, EUV, Semiconductor, Printing

TOKYO, Feb. 6, 2024 /PRNewswire/ -- Toppan Photomask, the world's premier semiconductor photomask provider, announced that it has entered into a joint research and development agreement with IBM related to the 2 nanometer (nm) logic semiconductor node, using extreme ultraviolet (EUV) lithography. This agreement also includes High-NA EUV photomask development capability on next-generation semiconductors.

Key Points: 
  • TOKYO, Feb. 6, 2024 /PRNewswire/ -- Toppan Photomask, the world's premier semiconductor photomask provider, announced that it has entered into a joint research and development agreement with IBM related to the 2 nanometer (nm) logic semiconductor node, using extreme ultraviolet (EUV) lithography.
  • Based on this agreement, for a period of five years starting 1Q 2024, IBM and Toppan Photomask plan to develop photomask capability at the Albany NanoTech Complex (Albany, NY, USA) and Toppan Photomask's Asaka Plant (Niiza, Japan).
  • The IBM and Toppan Photomask agreement brings these essential material and process control skills together to provide commercial solutions for 2nm node and beyond printing.
  • From 2005 to 2015, IBM and Toppan Photomask (then Toppan Printing) jointly developed photomasks for advanced semiconductors.