Design technology

Line & Circle Announces Its New Service: Reality Capture

Retrieved on: 
Wednesday, August 31, 2022
Design technology, Solution, Technology, BIM, 3D, Thought, Lines & Circles, Industry, Acquisition, Insurance, Architecture, Surveying

Phoenix, Arizona--(Newsfile Corp. - August 30, 2022) - Line & Circle announces new possibilities with their latest service, Reality Capture, which is also known as 3D scanning.

Key Points: 
  • Phoenix, Arizona--(Newsfile Corp. - August 30, 2022) - Line & Circle announces new possibilities with their latest service, Reality Capture, which is also known as 3D scanning.
  • Line & Circle provides Reality Capture, as well as drafting, building information modeling (BIM), and other technological design services across the United States.
  • Line & Circle prides themselves on excellence and building lasting relationships with their clients, delivering solutions to many areas of design technology and the AEC Community.
  • This is because Line & Circle works behind the scenes with these companies, replacing their pencil drawings and traditional blueprints with advanced laser scanning and 3D models called Reality Capture.

Samsung Begins Chip Production Using 3nm Process Technology with GAA Architecture

Retrieved on: 
Thursday, June 30, 2022
Semiconductor, Hardware, Electronic Design Automation, Nanotechnology, Technology, Efficiency, Will Power (performer), DTCO, Design technology, Architecture, Apple Inc. v. Samsung Electronics Co., Samsung, Samsung Electronics, Electronics, IC, Gate, FinFET, Technology, Environment, PPA, Metal gate, Time, Leadership, GAA, Ansys, Nanowire, Multimedia, EUV, Semiconductor, Mobile phone, Synopsys

Samsung Electronics Co., Ltd., the world leader in semiconductor technology, today announced that it has started initial production of its 3-nanometer (nm) process node applying Gate-All-Around (GAA) transistor architecture.

Key Points: 
  • Samsung Electronics Co., Ltd., the world leader in semiconductor technology, today announced that it has started initial production of its 3-nanometer (nm) process node applying Gate-All-Around (GAA) transistor architecture.
  • View the full release here: https://www.businesswire.com/news/home/20220629005894/en/
    Samsung Foundry's begins chip production with 3nm GAA architecture.
  • Samsungs proprietary technology utilizes nanosheets with wider channels, which allow higher performance and greater energy efficiency compared to GAA technologies using nanowires with narrower channels.
  • Utilizing the 3nm GAA technology, Samsung will be able to adjust the channel width of the nanosheet in order to optimize power usage and performance to meet various customer needs.

Vectorworks, Inc. Congratulates the 2022 Kennedy Center American College Theater Festival Regional Award Winners

Retrieved on: 
Thursday, May 19, 2022
Turn, University, Kennedy Center American College Theater Festival, DTM, BIM, Microsoft Windows, Mac, Lighting designer, Bare: A Pop Opera, Architecture, Design technology, Industry, Mississippi State University, University of Minnesota Duluth, Student, Freedom, Brigham Young University, Imagination, Auction, Medicine, Industrial design, Technology, Vectorworks

COLUMBIA, Md., May 19, 2022 /PRNewswire-PRWeb/ -- In its sixth year as a Kennedy Center American College Theater Festival (KCACTF) sponsor, global design and BIM software provider Vectorworks, Inc. is delighted to announce the winners of this year's regional awards. KCACTF is a national theater program involving 18,000 students from colleges and universities across the country.

Key Points: 
  • COLUMBIA, Md., May 19, 2022 /PRNewswire-PRWeb/ -- In its sixth year as a Kennedy Center American College Theater Festival (KCACTF) sponsor, global design and BIM software provider Vectorworks, Inc. is delighted to announce the winners of this year's regional awards.
  • KCACTF is a national theater program involving 18,000 students from colleges and universities across the country.
  • "The Kennedy Center American College Theater Festival celebrates accomplishments and achievements for theatrical works produced on university campuses," said Val Winkelman, KCACTF national chair of design, technology, and management.
  • "It's such an honor to receive this award for my region," said Region 7 award recipient Julianne Bodner.

Samsung Foundry Adopts Leading Voltage-Timing Signoff Solution from Synopsys and Ansys for Advanced-Node, Energy-Efficient Chips

Retrieved on: 
Thursday, March 31, 2022
EDA, Failure, HSPICE, SOC, Electronics, Samsung Electronics, Partnership, Fusion, PPA, Ansys, Silicon, Industry, VDD, Solution, Prime time, Design technology, Nasdaq, Time, DVD, VSS, Efficiency, SNPS, IP, Computer data storage, Risk management, Synopsys

MOUNTAIN VIEW, Calif., March 31, 2022 /PRNewswire/ --

Key Points: 
  • The offeringis built on golden-signoff products, including the Synopsys PrimeTime static timing analysis, Synopsys PrimeShield design robustness, Synopsys Tweaker ECO and Ansys RedHawk-SC digital power integrity signoff solutions, and delivers the industry's highest accuracy and throughput, savings weeks of time.
  • Samsung Foundry has reported high silicon correlation using the integrated solution.
  • "Dynamic voltage-drop and power integrity are significant challenges for energy efficient design," said Sangyun Kim, vice president of Design Technology at Samsung Foundry.
  • Samsung Foundry plans to deploy the solution on production designs at advanced nodes to prevent failures in silicon and maximize design energy efficiency."

EnSilica and Omni Design Collaborating on Multiple SoCs

Retrieved on: 
Tuesday, January 18, 2022
Telecommunications, Hardware, Electronic Design Automation, Automotive, Other Automotive, Technology, Semiconductor, Mobile, Wireless, Omni, RF, SOC, IP, High-pass filter, IOT, Health, Socs, Radar, ASIC, CEO, Solution, IC, Intellectual property, ICS, Design technology, Original equipment manufacturer, AI, Partnership, Lidar, Video game console, Mobile phone, Omni Design Technologies, EnSilica, OMNI DESIGN TECHNOLOGIES, ENSILICA

Engineers from Omni Design and EnSilica have been working in close collaboration on multiple customer projects to develop complex SoCs that are going to be deployed in production systems.

Key Points: 
  • Engineers from Omni Design and EnSilica have been working in close collaboration on multiple customer projects to develop complex SoCs that are going to be deployed in production systems.
  • "Omni Design is delivering high-performance data converters in advanced process nodes to enable the next generation of products in automotive, 5G, and AI markets, said Dr. Kush Gulati, president and CEO of Omni Design Technologies.
  • EnSilica has deep expertise in custom RF front-ends and mixed-signal design as well as the production of SoCs for automotive and advanced communication systems, said Ian Lankshear, CEO of EnSilica.
  • EnSilica is a leading fabless design house focused on custom ASIC design and supply for OEMs and system houses, as well as IC design services for companies with their own design teams.

Omni Design Announces Availability of LiDAR Receiver Subsystem

Retrieved on: 
Tuesday, October 26, 2021
Technology, Mobile, Wireless, Hardware, Semiconductor, Omni, SOC, LDOS, Socs, IP, ADC, PLL, TIA, CEO, Intellectual property, IOT, Solution, Design technology, Lidar, Cable television, Video game console

Omni Design Technologies , a leading provider of high-performance, ultra-low-power mixed-signal Intellectual Property (IP) solutions, today announced a LiDAR receiver subsystem that is available in FinFET to 28nm process nodes.

Key Points: 
  • Omni Design Technologies , a leading provider of high-performance, ultra-low-power mixed-signal Intellectual Property (IP) solutions, today announced a LiDAR receiver subsystem that is available in FinFET to 28nm process nodes.
  • This highly integrated multi-channel LiDAR subsystem combines multi-giga-sample analog-to-digital (ADC) converters, trans-impedance amplifiers (TIA), and other signal chain IP to process the return signal from the photodiode to the digital interface within a LiDAR SoC.
  • The subsystem includes a reconfigurable ultra-low power, low-noise analog receiver frontend (RxFE) that sits between the ADC and the off-chip photodiode.
  • Multiple market-leading customers have successfully integrated our LiDAR subsystem with their digital SoC to deliver better performing, lower power consuming LiDAR products at competitive price points.

MegaChips Deploys Omni Design’s Silicon-Validated Data Converters

Retrieved on: 
Tuesday, October 19, 2021
Mobile, Wireless, Technology, Semiconductor, Security, Software, Networks, Internet, Hardware, Electronic Design Automation, Data Management, Omni, IOT, Intellectual property, SOC, Technology, Automotive industry, ADC, Senior, Digital technology, DAC, Tokyo Stock Exchange, Megachip, IP, CEO, Control, Walther GSP, DACS, Solution, Design technology, TSE, Socs, Automation, Omni Design Technologies, MegaChips Corporation, OMNI DESIGN TECHNOLOGIES, MEGACHIPS CORPORATION

We adopted Omni Designs Lepton family of data converters to accelerate development of our SoCs targeted to the automotive and communications markets, said Hisashi Kondo, Senior General Manager, ASSP Business at MegaChips Corporation.

Key Points: 
  • We adopted Omni Designs Lepton family of data converters to accelerate development of our SoCs targeted to the automotive and communications markets, said Hisashi Kondo, Senior General Manager, ASSP Business at MegaChips Corporation.
  • MegaChips has a long history of partnering with Omni Design in ADCs and DACs.
  • "Omni Design has supplied high performance data converters to MegaChips in multiple process nodes, said Dr. Kush Gulati, President and CEO of Omni Design Technologies.
  • We are excited to see these silicon-validated ADC and DAC IP cores being deployed successfully by MegaChips in their automotive ethernet SoC."

Omni Design Announces Silicon Validated Data Converters on TSMC 16nm Process

Retrieved on: 
Tuesday, October 19, 2021
Technology, Mobile, Wireless, Hardware, Semiconductor, Omni, NSD, Lidar, Family, IOT, Intellectual property, TSMC, Technology, OIP, Hertz, ADC, DAC, SFDR, DDS, IP, IMD3, CEO, Radar, Control, Data converter, Walther GSP, AI, DACS, Solution, Design technology, Socs, Video game console

The Lepton family of high-performance ADCs and DACs on TSMC 16nm technology are delivered from Omni Designs Titanium platform.

Key Points: 
  • The Lepton family of high-performance ADCs and DACs on TSMC 16nm technology are delivered from Omni Designs Titanium platform.
  • Our collaboration with Omni Design enables our mutual customers to access a portfolio of data converter IP on TSMCs advanced process technologies, said Suk Lee, vice president of the Design Infrastructure Management Division at TSMC.
  • Omni Design is focused on providing high-performance, low-power data converter IP Cores in advanced process technologies, said Dr. Kush Gulati, President and CEO of Omni Design Technologies.
  • Omni Design will exhibit and present a paper, High-Speed Data Converters to Enable Automotive and 5G Applications at the TSMC 2021 Open Innovation Platform (OIP) Ecosystem Forum on October 26 & 27, 2021.

MG AEC Technology Partners Hosts Innovative 'Power of Where' Symposium

Retrieved on: 
Thursday, May 27, 2021
Computer-aided design, Data modeling, Architecture, Building engineering, Building information modeling, Construction, Design technology, Economic sectors, Articles

CHICAGO, May 27, 2021 /PRNewswire/ -- MG AEC Technology Partners , process innovation specialist to the architecture, engineering, and construction (AEC) industry for more than 70 years, will host an online "Power of Where" forum on June 15, 2021, at 11:00AM CDT.

Key Points: 
  • CHICAGO, May 27, 2021 /PRNewswire/ -- MG AEC Technology Partners , process innovation specialist to the architecture, engineering, and construction (AEC) industry for more than 70 years, will host an online "Power of Where" forum on June 15, 2021, at 11:00AM CDT.
  • The symposium offers an insightful exploration of the intersection between the building information modeling(BIM) and geographic information systems (GIS) movements.
  • "At MG AEC Technology Partners, we've been disrupting the status quo in design technology innovation for decades; it's our job," says CEO Scott Bailey.
  • The "Power of Where" symposium will be moderated by Stan Hennigh , Esri partnership manager at MG AEC Technology Partners, and Jennifer McGregor , director of strategic partnerships at MG AEC Technology Partners.