EUV

Correction: Advantest Unveils E5620 DR-SEM for Review and Classification of Ultra-Small Photomask Defects

Retrieved on: 
Saturday, December 3, 2022
SEM, EUV, TSE, Tokyo Big Sight, Artificial intelligence, Internet of things, Social responsibility, Semiconductor, Machine learning, IOT, HPC, Printed circuit board, Medical device, Advantest

With its high-accuracy, high-throughput defect review capability, the E5620 DR-SEM is expected to contribute appreciably to production quality improvements in next-generation photomasks and shorter mask manufacturing turnaround times.

Key Points: 
  • With its high-accuracy, high-throughput defect review capability, the E5620 DR-SEM is expected to contribute appreciably to production quality improvements in next-generation photomasks and shorter mask manufacturing turnaround times.
  • Like its predecessor, the E5620 implements Advantests highly stable image capture technology to easily import defect location data from mask inspection systems and automatically image the locations.
  • Advantest will share further details regarding its new E5620 DR-SEM during SEMICON Japan 2022, December 14-16, at Tokyo Big Sight.
  • All information supplied in this release is correct at the time of publication, but may be subject to change.

Advantest Unveils E5620 DR-SEM for Review and Classification of Ultra-Small Photomask Defects

Retrieved on: 
Thursday, December 1, 2022
Semiconductor, Internet of things, SEM, TSE, Machine learning, EUV, Artificial intelligence, IOT, HPC, Social responsibility, Tokyo Big Sight, Printed circuit board, Medical device, Advantest

With its high-accuracy, high-throughput defect review capability, the E5620 DR-SEM is expected to contribute appreciably to production quality improvements in next-generation photomasks and shorter mask manufacturing turnaround times.

Key Points: 
  • With its high-accuracy, high-throughput defect review capability, the E5620 DR-SEM is expected to contribute appreciably to production quality improvements in next-generation photomasks and shorter mask manufacturing turnaround times.
  • Like its predecessor, the E5620 implements Advantests highly stable image capture technology to easily import defect location data from mask inspection systems and automatically image the locations.
  • Advantest will share further details regarding its new E5620 DR-SEM during SEMICON Japan 2022, December 14-16, at Tokyo Big Sight.
  • All information supplied in this release is correct at the time of publication, but may be subject to change.

New EV entries nibbling away at Tesla EV share, according to S&P Global Mobility

Retrieved on: 
Tuesday, November 29, 2022
Odyssey, Civic, Bolt, MSRP, Lucid, Lexus RX, Editor's Note, Kia, Mach, Volkswagen, BMW, Tesla Model 3, Environment, Subaru Forester, Wrangler, Organization, Ford Mustang, ICE, Jeep, Big Three (automobile manufacturers), Toyota Prius, Nissan Leaf, Brinley, GMC Hummer EV, Sport utility vehicle, Honda Civic, EV6, Ford Motor Company, Chevrolet, RAV4, Mazda, S&P Global Ratings, Y, Growth, CR-V, Ford F-Series, Chevrolet Bolt, S, Tesla Model Y, GMC Sierra, S&P Global, Leaf, NYSE, GM, SPGI, Kia EV6, VW, Lexus, EVS, Roadster, Logic, EUV, SUV, CX-5, Mercedes-Benz, GMC, Model Y, Ford Mustang Mach-E, Mustang, F series, Silverado, Investment, Car dealership, Fireworks, Taxicab, Renewable energy, Lithium, Motor vehicle, Toy, EV, Toyota Camry, Audi, Polestar, Accord, Hyundai

SOUTHFIELD, Mich., Nov. 29, 2022 /PRNewswire/ -- Although U.S. electric vehicle registrations remain dominated by Tesla, the brand is showing the expected signs of shedding market share as more entrants arrive. Much of Tesla's share loss is to EVs available in a more accessible MSRP range – below $50,000, where Tesla does not yet truly compete.

Key Points: 
  • "The EV market in 2022 is a Tesla market, and it will continue to be, so long as its competitors are bound by production capacity."
  • Tesla has opened two new assembly plants in 2022 and is looking for the site of its next North American plant.
  • However, Mach-E registrations of about 27,800 units are about 8% of the volume Tesla has captured, according to S&P Global Mobility data.
  • Editor's Note: This report is from S&P Global Mobility, and not S&P Global Ratings, which is a separately managed division of S&P Global.

AlixLabs AB demonstrates pitch splitting in bulk silicon for leading edge semiconductor manufacturing

Retrieved on: 
Wednesday, November 2, 2022
APS, Lithography, DSA, CEO, ALE, 46, SADP, Immersion, Patent, Technology, Nanowire, Investment, Nanostructure, Gallium phosphide, EUV, IP, United States patent law, AFM, Printed circuit board, Silicon

LUND, Sweden, Nov. 2, 2022 /PRNewswire/ -- AlixLabs from Lund, Sweden, demonstrates pitch splitting in bulk silicon using their proprietary patterning technology for semiconductor device manufacturing.

Key Points: 
  • LUND, Sweden, Nov. 2, 2022 /PRNewswire/ -- AlixLabs from Lund, Sweden, demonstrates pitch splitting in bulk silicon using their proprietary patterning technology for semiconductor device manufacturing.
  • The company has developed a new, innovative method for manufacturing semiconductor components with a high degree of packing, eliminating several steps in the semiconductor manufacturing process - Atomic Layer Etch Pitch Splitting (APS)*.
  • The method also makes it possible to manufacture tiny semiconductor components accurately and efficiently with manageable wafer fab equipment investments.
  • Demonstrating pitch splitting in bulk silicon by creating sub-10 nm structures has been a major milestone for AlixLabs.

AlixLabs AB demonstrates pitch splitting in bulk silicon for leading edge semiconductor manufacturing

Retrieved on: 
Wednesday, November 2, 2022
APS, Lithography, DSA, CEO, ALE, 46, SADP, Immersion, Patent, Technology, Nanowire, Investment, Nanostructure, Gallium phosphide, EUV, IP, United States patent law, AFM, Printed circuit board, Silicon

LUND, Sweden, Nov. 2, 2022 /PRNewswire/ -- AlixLabs from Lund, Sweden, demonstrates pitch splitting in bulk silicon using their proprietary patterning technology for semiconductor device manufacturing.

Key Points: 
  • LUND, Sweden, Nov. 2, 2022 /PRNewswire/ -- AlixLabs from Lund, Sweden, demonstrates pitch splitting in bulk silicon using their proprietary patterning technology for semiconductor device manufacturing.
  • The company has developed a new, innovative method for manufacturing semiconductor components with a high degree of packing, eliminating several steps in the semiconductor manufacturing process - Atomic Layer Etch Pitch Splitting (APS)*.
  • The method also makes it possible to manufacture tiny semiconductor components accurately and efficiently with manageable wafer fab equipment investments.
  • Demonstrating pitch splitting in bulk silicon by creating sub-10 nm structures has been a major milestone for AlixLabs.

Park Systems Announces Park NX-Mask, a Photomask Repair for EUV and In-Line

Retrieved on: 
Monday, October 31, 2022
Park Systems, View, Multimedia, Chemistry, Product, Solution, Physics, Engineering, AFM, Korea Exchange, Method, EUV, KOSDAQ, Printed circuit board

SEOUL, South Korea, Oct. 31, 2022 /PRNewswire/ -- Park Systems, a world-leading manufacturer of Atomic Force Microscopes announced Park NX-Mask , the most effective, safe, and efficient new generation photomask repair equipment.

Key Points: 
  • SEOUL, South Korea, Oct. 31, 2022 /PRNewswire/ -- Park Systems, a world-leading manufacturer of Atomic Force Microscopes announced Park NX-Mask , the most effective, safe, and efficient new generation photomask repair equipment.
  • It provides all in one solutionfrom auto defect review to repair of defects and verification of the repairaccelerating the throughput at unprecedented repair efficacy.
  • "Park NX-Mask is the most advanced AFM based photomask repair system for high-end EUV semiconductor manufacturing as well as for R&D and mask shops.
  • Moreover, it is the most affordable system in the market," said Richard Lee, Head of Product Marketing Division of Park Systems.

ASML reports €5.8 billion net sales and €1.7 billion net income in Q3 2022

Retrieved on: 
Wednesday, October 19, 2022
U.S. Securities and Exchange Commission, Risk, Agriculture, ASML, ASML Holding, Immersion, ESG, Color, Annual report, NASDAQ, Share repurchase, GAAP, Program, Time in Europe, SG, Technology, KPI, Private Securities Litigation Reform Act, R, Software, Goal, Industry, Intellectual property, Forward-looking statement, EUV, DUV, COVID-19, FTE, Euronext Amsterdam, Q3, Semiconductor, Video game, Risk management, Cryptocurrency, Bank

A complete summary of US GAAP Consolidated Statements of Operations is published on www.asml.com

Key Points: 
  • A complete summary of US GAAP Consolidated Statements of Operations is published on www.asml.com
    "Our third-quarter net sales came in at 5.8 billion with a gross margin of 51.8% above our guidance.
  • This resulted in record bookings in the third quarter of around 8.9 billion of which 3.8 billion is EUV, including High-NA systems.
  • "ASML expects fourth-quarter net sales between 6.1 billion and 6.6 billion with a gross margin around 49%.
  • With this press release, ASML has published a video interview in which CFO Roger Dassen discusses the 2022 third-quarter results and outlook for 2022.

AlixLabs AB announce that the company will be granted their first European patent relating to Atomic Layer Etch Pitch Splitting (APS) for semiconductor manufacturing

Retrieved on: 
Friday, October 21, 2022
Gallium phosphide, United States patent law, Intention, DSA, European Patent Convention, Immersion, European Patent Office, APS, Investment, Technology, Lithography, 46, CEO, SADP, IP, Patent, Nanostructure, EPO, EUV, ALE, CTO, Tantalum nitride, Tablet, Printed circuit board, European, Silicon, EU

The method also makes it possible to manufacture tiny semiconductor components accurately and efficiently with manageable wafer fab equipment investments.

Key Points: 
  • The method also makes it possible to manufacture tiny semiconductor components accurately and efficiently with manageable wafer fab equipment investments.
  • The company is now pleased to announce that the European Patent Office (EPO) has issued a notice of Intention to Grant their first European Patent.
  • As previously reported (April 30, 2021), The US Patent Office has approved AlixLabs's patent application for nanofabrication by ALE Pitch Splitting (APS).
  • Jonas Sundqvist, CEO of AlixLabs, phone +46 767 63 94 67, email [email protected]
    The following files are available for download:

AlixLabs AB announce that the company will be granted their first European patent relating to Atomic Layer Etch Pitch Splitting (APS) for semiconductor manufacturing

Retrieved on: 
Friday, October 21, 2022
Gallium phosphide, United States patent law, Intention, DSA, European Patent Convention, Immersion, European Patent Office, APS, Investment, Technology, Lithography, 46, CEO, SADP, IP, Patent, Nanostructure, EPO, EUV, ALE, CTO, Tantalum nitride, Tablet, Printed circuit board, European, Silicon, EU

The method also makes it possible to manufacture tiny semiconductor components accurately and efficiently with manageable wafer fab equipment investments.

Key Points: 
  • The method also makes it possible to manufacture tiny semiconductor components accurately and efficiently with manageable wafer fab equipment investments.
  • The company is now pleased to announce that the European Patent Office (EPO) has issued a notice of Intention to Grant their first European Patent.
  • As previously reported (April 30, 2021), The US Patent Office has approved AlixLabs's patent application for nanofabrication by ALE Pitch Splitting (APS).
  • Jonas Sundqvist, CEO of AlixLabs, phone +46 767 63 94 67, email [email protected]
    The following files are available for download:

Inpria Files Patent Infringement Suit Against Lam Research

Retrieved on: 
Friday, October 14, 2022
Technology, Hardware, Semiconductor, District, Investment, Invention, Technology, Lam Research, District court, CEO, Patent, Corporation, EUV, 3D printing

Inpria Corporation today announced the filing of a patent infringement lawsuit against Lam Research Corporation in the United States District Court for the District of Delaware for their alleged unauthorized use of Inprias patented metal oxide photoresist technology for extreme ultraviolet (EUV) semiconductor processing.

Key Points: 
  • Inpria Corporation today announced the filing of a patent infringement lawsuit against Lam Research Corporation in the United States District Court for the District of Delaware for their alleged unauthorized use of Inprias patented metal oxide photoresist technology for extreme ultraviolet (EUV) semiconductor processing.
  • The complaint asserts three patents and seeks damages as well as an injunction to prevent Lam Research from manufacturing, selling, using, or distributing the infringing dry resist technology.
  • Inpria respects the legitimate intellectual property of others, and we expect others to honor our intellectual property as well, said Andrew Grenville, CEO at Inpria.
  • Inpria has made significant investments in the development of new materials and technologies, and we are confident that our patent rights will be upheld in this case.