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Imec and ASML sign Memorandum of Understanding (MOU) to support semiconductor research and sustainable innovation in Europe

Retrieved on:

Wednesday, June 28, 2023

This Memorandum of Understanding kickstarts the next phase of intensive collaboration between ASML and imec on High-NA EUV.

Key Points:

This Memorandum of Understanding kickstarts the next phase of intensive collaboration between ASML and imec on High-NA EUV.
Part of the collaboration between imec and ASML is therefore captured in an IPCEI proposal which is currently in review by the Dutch government.
“ASML is making a substantial commitment in imec's state-of-the-art pilot fab to support semiconductor research and sustainable innovation in Europe.
It is through these collective efforts that we can truly accelerate innovation and propel the semiconductor industry to new heights.”

Intel Agrees to Sell Minority Stake in IMS Nanofabrication Business to Bain Capital

Retrieved on:

Wednesday, June 21, 2023

Semiconductor, Engineering, Technology, Manufacturing, Nanotechnology, Hardware, Workforce, Partnership, Intel, Acquisition, IMS, Corporation, Sandro Platzgummer, EUV, Growth, Ecosystem, Corporate development, Bain Capital

Intel Corporation today announced that it has agreed to sell an approximately 20% stake in its IMS Nanofabrication GmbH (“IMS”) business to Bain Capital Special Situations (“Bain Capital”), in a transaction that values IMS at approximately $4.3 billion.

Key Points:

Intel Corporation today announced that it has agreed to sell an approximately 20% stake in its IMS Nanofabrication GmbH (“IMS”) business to Bain Capital Special Situations (“Bain Capital”), in a transaction that values IMS at approximately $4.3 billion.
IMS will operate as a standalone subsidiary and will continue to be led by CEO Dr. Elmar Platzgummer.
Intel initially invested in IMS in 2009 and ultimately acquired the business in 2015.
This investment will position IMS to capture the significant market opportunity for multi-beam mask writing tools by accelerating innovation and enabling deeper cross-industry collaboration.

Inprentus wins contract to provide a VLS grating for the diagnostic spectrometer at the Shanghai Soft X-ray Free-Electron Laser (SSXFEL)

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Monday, June 19, 2023

SSRF, Radiation damage, Shanghai Synchrotron Radiation Facility, Light, Carbon, Louisiana Tech University College of Engineering and Science, Science, Astigmatism, VLS, Water, Biology, EUV, FEL, R, Microscope, Telescopic sight

CHAMPAIGN , Ill., June 19, 2023 /PRNewswire-PRWeb/ -- Shanghai Tech University has chosen Inprentus to provide a diffraction grating for the Shanghai Soft X-ray Free-Electron Laser (SSXFEL), the first X-ray free-electron laser user facility in China. Inprentus was selected for its unique capability to manufacture a blazed diffraction grating with varied line spacing (VLS) on a cylindrical, concave substrate. The grating will be one of the core elements used in the diagnostic spectrometer to provide high spectral resolution photon diagnostics of the FEL-II beamline.

Key Points:

Shanghai Tech University has chosen Inprentus to provide a diffraction grating for the Shanghai Soft X-ray Free-Electron Laser (SSXFEL), the first X-ray free-electron laser user facility in China.
CHAMPAIGN , Ill., June 19, 2023 /PRNewswire-PRWeb/ -- Shanghai Tech University has chosen Inprentus to provide a diffraction grating for the Shanghai Soft X-ray Free-Electron Laser (SSXFEL), the first X-ray free-electron laser user facility in China.
Inprentus was selected for its unique capability to manufacture a blazed diffraction grating with varied line spacing (VLS) on a cylindrical, concave substrate.
The grating will be one of the core elements used in the diagnostic spectrometer to provide high spectral resolution photon diagnostics of the FEL-II beamline.

Fractilia Adds Overlay Metrology Capability to Stochastics Control Solutions to Further Improve EUV Patterning Control and Yields

Retrieved on:

Monday, June 12, 2023

NZO, Noise, Signal-to-noise ratio, LWR, FAME, LER, Optics, SEM, Data analysis, EUV, Mineral oil, Microscope

AUSTIN, Texas, June 12, 2023 /PRNewswire/ --Fractilia, the leader in stochastics metrology and control solutions for advanced semiconductor manufacturing, today introduced the Fractilia Overlay Package, an optional offering that adds critical new overlay measurement and analysis capabilities to Fractilia's MetroLER™ and FAME™ products. Fractilia's products, which combine the company's patented Fractilia Inverse Linescan Model (FILM™) technology with true computational metrology, are the only proven fab solutions that provide highly accurate and precise measurements of all major stochastic effects – the single largest source of patterning errors at advanced nodes. Fractilia is currently engaged with multiple leading chip manufacturers in analyzing their SEM-based overlay data with the new Fractilia Overlay Package.

Key Points:

Fractilia is currently engaged with multiple leading chip manufacturers in analyzing their SEM-based overlay data with the new Fractilia Overlay Package.
Optical-based metrology tools have traditionally been used by chip manufacturers to measure and control this pattern overlay, which is essential to producing high-yielding and high-performing semiconductor devices.
In addition, by combining SEM stochastics measurements with optical overlay measurements through our Fractilia Overlay Package, we believe that we not only can improve SEM overlay metrology accuracy, but also provide better lot dispositioning and correctables, which in turn can improve patterning control and reduce non-zero offset (NZO) or its variability."
With the new Fractilia Overlay Package, Fractilia adds highly accurate SEM-based overlay measurements, including their stochastic properties, on top of its existing measurement capabilities.

PowerVia Test Shows Industry-Leading Performance

Retrieved on:

Monday, June 5, 2023

Semiconductor, Hardware, Manufacturing, Technology, Engineering, 2 nm process, Intel, Multimedia, Research, VLSI, Multigate device, Fin field-effect transistor, Artificial intelligence, Architecture, EUV, Silicon, Credit, Renewable energy

The production test helps Intel refine Intel’s PowerVia backside power technology.

Key Points:

The production test helps Intel refine Intel’s PowerVia backside power technology.
PowerVia was tested on its own internal test node to debug and ensure good functionality of the technology before its integration with RibbonFET in Intel 20A.
After fabrication and testing on a silicon test chip, PowerVia was confirmed to bring a remarkably efficient use of chip resources with greater than 90% cell utilization and major transistor scaling, enabling chip designers to achieve performance and efficiency gains in their products.
Intel also achieved thermal characteristics in the PowerVia test chip in line with higher power densities expected from logic scaling.

ClassOne Equipment Delivers Advanced 300mm Takano Particle Detection System to EUV Tech

Retrieved on:

Monday, June 5, 2023

Classon Avenue station, EUV, R&D, OEM, Medical imaging, Cassette tape, Takano

ATLANTA, June 5, 2023 /PRNewswire/ -- ClassOne Equipment ( classoneequipment.com ), announced the delivery of its advanced new Takano WM-10 particle measurement system to EUV Tech, a global leader in metrology equipment for cutting-edge EUV chip manufacturing.

Key Points:

ATLANTA, June 5, 2023 /PRNewswire/ -- ClassOne Equipment ( classoneequipment.com ), announced the delivery of its advanced new Takano WM-10 particle measurement system to EUV Tech, a global leader in metrology equipment for cutting-edge EUV chip manufacturing.
The announcement was made by ClassOne Equipment Vice President, David Pawlak, and EUV Tech Vice President of R&D, Matt Hettermann.
Said Hettermann, "A key factor in our selecting the new 300mm Takano WM-10 system was its very high-sensitivity particle detection.
ClassOne Equipment is the exclusive source for sales, service and complete support of Takano-brand particle detection systems across North America and Europe.

Micron to Bring EUV Technology to Japan, Advancing Next-Generation Memory Manufacturing

Retrieved on:

Thursday, May 18, 2023

Workforce, Partnership, DRAM, Cell, Micrometre, Research, LPDDR5X, Automation, Commerce, Virtual reality, EUV, Micron Technology, AI, METI, Memory, Video game, Computer data storage

Micron will be the first semiconductor company to bring EUV technology to Japan for production, with its Hiroshima fab playing a critical role in the company’s development of the 1-gamma node.

Key Points:

Micron will be the first semiconductor company to bring EUV technology to Japan for production, with its Hiroshima fab playing a critical role in the company’s development of the 1-gamma node.
Micron continues to make progress on its EUV integration plans and expects to ramp EUV into production on the 1-gamma node in Taiwan and Japan from 2025 onwards.
“We are proud to be the first to use EUV in Japan and to be developing and manufacturing 1-gamma at our Hiroshima fab.
“We are pleased to see our collaboration with Micron take root in Hiroshima with state-of-the-art EUV to be introduced on Japanese soil.

Semiconductor Manufacturing Equipment Market worth $149.8 billion by 2028 - Exclusive Report by MarketsandMarkets™

Retrieved on:

Friday, May 5, 2023

Chemical control equipment is used widely for checking the flow and level of chemicals used in wafer fabrication, cleaning, and other processes.

Key Points:

Chemical control equipment is used widely for checking the flow and level of chemicals used in wafer fabrication, cleaning, and other processes.
Contamination control through chemical control equipment has a significant impact on yield and equipment efficiency, as these equipment provide repeated and reliable delivery of pure chemicals during the semiconductor manufacturing processes.
Thus, widespread adoption of chemical control equipment is being observed, and this trend is anticipated to continue in the coming years.
Due to this, the 2D ICs segment is expected to account for the largest size of the semiconductor manufacturing equipment market in 2023.

Semiconductor Manufacturing Equipment Market worth $149.8 billion by 2028 - Exclusive Report by MarketsandMarkets™

Retrieved on:

Friday, May 5, 2023

Chemical control equipment is used widely for checking the flow and level of chemicals used in wafer fabrication, cleaning, and other processes.

Key Points:

Chemical control equipment is used widely for checking the flow and level of chemicals used in wafer fabrication, cleaning, and other processes.
Contamination control through chemical control equipment has a significant impact on yield and equipment efficiency, as these equipment provide repeated and reliable delivery of pure chemicals during the semiconductor manufacturing processes.
Thus, widespread adoption of chemical control equipment is being observed, and this trend is anticipated to continue in the coming years.
Due to this, the 2D ICs segment is expected to account for the largest size of the semiconductor manufacturing equipment market in 2023.

Denton Vacuum Announces New Order for Second Infinity Biased Target Ion Beam Deposition System

Retrieved on:

Tuesday, May 2, 2023

TCR, EUV, Denton, Bias, Infinity, Marketing, Printed circuit board

MOORESTOWN, N.J., May 2, 2023 /PRNewswire/ -- Denton Vacuum LLC announces it has won a new system order for semiconductor laser facet coating from a leading laser manufacturer.

Key Points:

MOORESTOWN, N.J., May 2, 2023 /PRNewswire/ -- Denton Vacuum LLC announces it has won a new system order for semiconductor laser facet coating from a leading laser manufacturer.
This is the second laser manufacturer to switch to Denton's patented bias target sputtering for laser facet coating in the past year.
Frank Cumbo, President and CEO of Denton Vacuum, added, "We are pleased to see market penetration for bias target sputtering.
The Infinity Biased Target Ion Beam Deposition system boasts low operating pressure and low ion energy which makes the sputter module an ideal solution for next-generation high TCR focal plane arrays and laser bar facet coatings.