EUV

The Worldwide Next-Generation Lithography Materials Industry is Projected to Reach $1 Billion by 2031: Rising Proliferation of Feature Phones, and Tablets Drives Growth - ResearchAndMarkets.com

Retrieved on: 
Thursday, January 5, 2023
Technology, Photography, Mobile, Wireless, Nanotechnology, Chemicals, Plastics, Manufacturing, Wearables, Mobile Technology, Telecommunications, Software, Internet, Hardware, Other Manufacturing, Semiconductor, Consumer Electronics, Government, Ecosystem, NNI, Semiconductor, Research, ASML, Smartphone, International Data Group, NGL, Face, Radiation, National Nanotechnology Initiative, EUVL, Nanolithography, Investment, EUV, Tablet, Nanotechnology, Iron, Mobile phone, Renewable energy, Gum arabic

Smartphone players are implementing several technologies to reduce the weight and increase the features of smartphones to gain a strong foothold in the industry, creating a demand for next-generation lithography materials and technologies.

Key Points: 
  • Smartphone players are implementing several technologies to reduce the weight and increase the features of smartphones to gain a strong foothold in the industry, creating a demand for next-generation lithography materials and technologies.
  • Extreme ultraviolet lithography (EUVL), which uses a wavelength of 13.5 nm, is currently the most widely used next-generation lithography technique.
  • Other next-generation lithography techniques include electron beam lithography, nanoimprint lithography, focused ion beam lithography, x-ray lithography, and others.
  • However, with additional players entering the ecosystem in the coming years, the next-generation lithography materials industry is expected to expand significantly.

Samsung Electronics Develops Industry’s First 12nm-Class DDR5 DRAM

Retrieved on: 
Wednesday, December 21, 2022
Data Management, Semiconductor, Technology, Software, Networks, Artificial Intelligence, Hardware, Computing, UHD, Electronics, Samsung, Multimedia, DRAM, Data-rate units, AMD, DDR5, Samsung Electronics, EUV, Apple Inc. v. Samsung Electronics Co., Senior, Computer data storage

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced the development of its 16-gigabit (Gb) DDR5 DRAM built using the industry’s first 12-nanometer (nm)-class process technology, as well as the completion of product evaluation for compatibility with AMD.

Key Points: 
  • Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced the development of its 16-gigabit (Gb) DDR5 DRAM built using the industry’s first 12-nanometer (nm)-class process technology, as well as the completion of product evaluation for compatibility with AMD.
  • View the full release here: https://www.businesswire.com/news/home/20221221005193/en/
    Samsung's Industry’s First 12nm-Class DDR5 DRAM (Photo: Business Wire)
    “Our 12nm-range DRAM will be a key enabler in driving market-wide adoption of DDR5 DRAM,” said Jooyoung Lee, Executive Vice President of DRAM Product & Technology at Samsung Electronics.
  • Leveraging the latest DDR5 standard, Samsung’s 12nm-class DRAM will help unlock speeds of up to 7.2 gigabits per second (Gbps).
  • Consuming up to 23 percent less power than the previous DRAM, the 12nm-class DRAM will be an ideal solution for global IT companies pursuing more environment-friendly operations.

COTE Capital Announces 'IP Capital Fund' to Accelerate the Return of Advanced U.S. Manufacturing

Retrieved on: 
Thursday, January 5, 2023
Computer, Partnership, Semiconductor, Electronics, IP, Extreme ultraviolet, DRAM, Risk, Growth, Tablet, Electricity, NRAM, Investment, Silicon, EUV, Sunlight, Life, Management, Renewable energy

NEW YORK, Jan. 5, 2023 /PRNewswire/ -- COTE Capital announced the launch of its $250 million IP Capital Fund with an initial investment of $50 million in Boston-based Nano-C to supply the capital needed to scale manufacturing capacity and operations to meet fast growing demand for Nanocarbon and its end product applications in high growth markets. This capital influx and expansion will position Nano-C to exceed $300 million in revenues by 2027 and put the company on track to reach a multibillion-dollar enterprise valuation.

Key Points: 
  • This capital influx and expansion will position Nano-C to exceed $300 million in revenues by 2027 and put the company on track to reach a multibillion-dollar enterprise valuation.
  • "With Nano-C, we see how the application of Nanocarbon can revolutionize many Industries, drive greater efficiency, and, most importantly, play a pivotal role in reviving our manufacturing sector," said Robert Cote, Founder and CEO of COTE.
  • COTE's investment in Nano-C is part of a broader Mission at COTE that includes investments of IP Capital in many other companies with breakthrough innovations that will enable the return of domestic manufacturing and reverse the effects of offshoring and short-termism.
  • IP Capital is a simple, secure and cash flowing investment model, designed so that everyday investors can participate with COTE in changing the course of our nation.

The global next-generation lithography materials market is projected to reach $1,005.3 million by 2031 from $85.7 million in 2021, growing at a CAGR of 29.46% during the forecast period 2022-2031

Retrieved on: 
Tuesday, January 3, 2023
Benchmarking, Tablet, Telecommunication, ITRI, TSMC, Name, Partnership, EUV, Industrial Technology Research Institute, Face, JSR, Extreme ultraviolet, DuPont, Investment, Semiconductor, Research, Acquisition, Iron

View original content:https://www.prnewswire.com/news-releases/the-global-next-generation-lith...

Key Points: 
  • The global next-generation lithography materials market is estimated to be led by photoresist material.
  • This is expected to expand JSR Group’s business activities in the Chinese market relating to semiconductor materials.
  • Product/Innovation Strategy: The product segment helps the reader understand the technology used in manufacturing next-generation lithography materials, including photoresist and ancillary material.
  • The favored strategy for the companies has been expansion and collaboration to strengthen their position in the next-generation lithography materials market.

Samsung Electronics Develops Industry’s First 12nm-Class DDR5 DRAM

Retrieved on: 
Wednesday, December 21, 2022
Technology, Engineering, Manufacturing, Artificial Intelligence, Other Technology, Software, Networks, Internet, Hardware, Other Manufacturing, Electronic Design Automation, Semiconductor, Data Management, Consumer Electronics, UHD, Samsung Electronics, Computing, Samsung, Tablet, EUV, Electronics, Apple Inc. v. Samsung Electronics Co., Senior, Memory, News, Multimedia, AMD, LED, LSI, DRAM, Data-rate units, DDR5, Television, Mobile phone, Computer data storage

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced the development of its 16-gigabit (Gb) DDR5 DRAM built using the industry’s first 12-nanometer (nm)-class process technology, as well as the completion of product evaluation for compatibility with AMD.

Key Points: 
  • Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced the development of its 16-gigabit (Gb) DDR5 DRAM built using the industry’s first 12-nanometer (nm)-class process technology, as well as the completion of product evaluation for compatibility with AMD.
  • View the full release here: https://www.businesswire.com/news/home/20221219005650/en/
    Samsung 12nm-class DDR5 DRAM (Photo: Business Wire)
    “Our 12nm-range DRAM will be a key enabler in driving market-wide adoption of DDR5 DRAM,” said Jooyoung Lee, Executive Vice President of DRAM Product & Technology at Samsung Electronics.
  • Leveraging the latest DDR5 standard, Samsung’s 12nm-class DRAM will help unlock speeds of up to 7.2 gigabits per second (Gbps).
  • Consuming up to 23 percent less power than the previous DRAM, the 12nm-class DRAM will be an ideal solution for global IT companies pursuing more environment-friendly operations.

Applied Materials Breakthrough in Electron Beam Imaging Technology Accelerates Development of the World’s Most Advanced Computer Chips

Retrieved on: 
Wednesday, December 14, 2022
CFE, EUV, Applied Materials, Electron, 3D NAND, Temperature, TFE, Process control, Engineering, Gate, 3D, DRAM, Calendar, G10, 2D, AMAT, Vacuum, GAA, NAND, Television, Computer data storage, Oil, EBeam

Chipmakers use eBeam technology to identify and characterize defects that are too small to be seen with optical systems.

Key Points: 
  • Chipmakers use eBeam technology to identify and characterize defects that are too small to be seen with optical systems.
  • A breakthrough in eBeam imaging resolution and speed would enable chipmakers to accelerate chip development and make greater use of eBeam technology in high-volume manufacturing.
  • “The commercialization of CFE is the biggest advance in eBeam imaging technology in decades,” said Keith Wells, Group Vice President of Imaging and Process Control at Applied Materials.
  • Applied Materials, Inc. (Nasdaq: AMAT) is the leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world.

Energetiq Announces Business Unit Dedicated to EUV Light Sources

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Tuesday, December 13, 2022
R, EUV, McDaniel, Electrodeless lamp, Hamamatsu Photonics, Research, Hamamatsu, Growth, Multimedia, Engineering, Marketing, Management

WILMINGTON, Mass., Dec. 13, 2022 /PRNewswire/ -- Energetiq Technology, an innovative photonics manufacturer based in Wilmington, Massachusetts, announced today that it is creating a distinct business unit for its EUV light source products.

Key Points: 
  • WILMINGTON, Mass., Dec. 13, 2022 /PRNewswire/ -- Energetiq Technology, an innovative photonics manufacturer based in Wilmington, Massachusetts, announced today that it is creating a distinct business unit for its EUV light source products.
  • Energetiq's Electrodeless Z-Pinchextreme ultraviolet (EUV) light sources emit light in the key 13.5 nm region used in advanced node semiconductor metrology.
  • "Given the growth and importance of our EUV business to the semiconductor industry, we are pleased to develop an independent business unit to support our customers," said Debbie Gustafson, CEO of Energetiq.
  • The new EUV Business Unit will assemble all the core technology, engineering, marketing, field service, and operations personnel under the management of an EUV General Manager.

Vinnova supports AlixLabs AB for feasibility study within the new electronic components and systems program in areas of Swedish excellence

Retrieved on: 
Monday, December 12, 2022
DSA, DUV, Vinnova, United States patent law, Nanowire, Immersion, Feasibility study, R, EUV, Patent, IP, Electronic component, ALE, Research, Lithography, Vacuum, Investment, APS, Nanostructure, Growth, SADP, Gallium phosphide, Operations management, Area studies, Printed circuit board, Silicon

The method makes the components cheaper and less resource-intensive to manufacture and can open a new path for a more sustainable mass production of electronic products.

Key Points: 
  • The method makes the components cheaper and less resource-intensive to manufacture and can open a new path for a more sustainable mass production of electronic products.
  • The method also makes it possible to manufacture tiny semiconductor components accurately and efficiently with manageable wafer fab equipment investments.
  • The project was rewarded 500,000 SEK within the call for Electronic Components and Systems: Feasibility studies 2022.
  • This call was aimed at feasibility studies for major research and innovation projects that are expected to result in new electronic components and systems in areas of Swedish excellence.

Vinnova supports AlixLabs AB for feasibility study within the new electronic components and systems program in areas of Swedish excellence

Retrieved on: 
Monday, December 12, 2022
DSA, DUV, Vinnova, United States patent law, Nanowire, Immersion, Feasibility study, R, EUV, Patent, IP, Electronic component, ALE, Research, Lithography, Vacuum, Investment, APS, Nanostructure, Growth, SADP, Gallium phosphide, Operations management, Area studies, Printed circuit board, Silicon

The method makes the components cheaper and less resource-intensive to manufacture and can open a new path for a more sustainable mass production of electronic products.

Key Points: 
  • The method makes the components cheaper and less resource-intensive to manufacture and can open a new path for a more sustainable mass production of electronic products.
  • The method also makes it possible to manufacture tiny semiconductor components accurately and efficiently with manageable wafer fab equipment investments.
  • The project was rewarded 500,000 SEK within the call for Electronic Components and Systems: Feasibility studies 2022.
  • This call was aimed at feasibility studies for major research and innovation projects that are expected to result in new electronic components and systems in areas of Swedish excellence.

Fractilia Dares Chipmakers to Take the Fractilia Challenge for Up to 20X Better Scanning Electron Microscope Matching and Higher Throughput at No Obligation

Retrieved on: 
Tuesday, December 6, 2022
CD, SEM, LWR, FAME, EUV, Metrol, LER, Data analysis, Interest, BKM, SEMS, Microscope

AUSTIN, Texas, Dec. 6, 2022 /PRNewswire/ -- Fractilia, the leader in stochastics metrology and control solutions for advanced semiconductor manufacturing, today announced that it has launched a new program that offers chipmakers the opportunity to achieve a 5-20x improvement in SEM tool-to-tool matching and up to 30 percent increased SEM tool throughput using the company's Fractilia Automated Measurement Environment (FAME™) product at no obligation.

Key Points: 
  • Fractilia will then measure the SEM images using FAME and prepare a custom report detailing the SEM tool performance as well as potential tool matching and throughput improvements.
  • With existing customers, the Fractilia Challenge has enabled a 5-20x improvement in tool-to-tool matching while simultaneously increasing SEM throughput by greater than 30 percent.
  • Fractilia has a unique way to help them achieve better matching with results that they've never seen before.
  • Fractilia is headquartered in Austin, Texas, and has numerous issued patents and hundreds of trade secrets covering its FILM and related technologies.