DDR3

Etron@CES 2024: The Future of AI-Powered Intelligence, Autonomy, Connectivity & Confidentiality

Retrieved on: 
Wednesday, December 20, 2023
Confidentiality, VR, Long, GDPR, Central Hall, Consumer Electronics Show, Research, Robotics, Endoscopy, Electronics, USB, DDR3, Certification, Privacy, LAS, Data-rate units, Observation, LVCC, ISP, Diagnosis, CES, DRAM, Medical device

LAS VEGAS and TAIPEI, Dec. 20, 2023 /PRNewswire/ -- Etron Technology, Inc. (TPEx: 5351), the world's leading IC design company, is announcing its cutting-edge solutions that it will showcase at CES 2024 ‒ electronics with AI capabilities. With the parallel themes of Intelligence, Autonomy, Connectivity, and Confidentiality, the brand is demonstrating its relentless commitment to developing innovative products that enrich lives while advancing its vision of 'Shaping Tomorrow Today'. To experience Etron's demos and engage with in-house experts, visit CES Booth #15459, Central Hall at the LVCC, during January 9-12, CES 2024 period.

Key Points: 
  • With the parallel themes of Intelligence, Autonomy, Connectivity, and Confidentiality, the brand is demonstrating its relentless commitment to developing innovative products that enrich lives while advancing its vision of 'Shaping Tomorrow Today'.
  • DeCloak Intelligences, an Etron company, has been honored with the CES Innovation Awards for two consecutive years.
  • This year's recognition is attributed to its innovative privacy-centric facial recognition and monitoring solution - DeCloakVision.
  • Designed to operate on both cloud and edge computing platforms, it offers flexibility and scalability to meet diverse monitoring needs.

GOWIN Semiconductor Corporation Expands its Arora V FPGA Family with Advanced Features

Retrieved on: 
Wednesday, November 1, 2023
Single, SRAM, MIPI, FPGA, DDR3, SSPI, MSPI, Arora, Growth, SerDes, CPU, SEU, JTAG, IP, CDR, PCI Express, SAN, Mobile phone, Computer data storage

SAN JOSE, Calif. and GUANGZHOU, China, Nov. 01, 2023 (GLOBE NEWSWIRE) -- GOWIN Semiconductor Corporation, recognized as the world's fastest-growing FPGA company, is excited to announce an expansion of its Arora V high-performance FPGA family.

Key Points: 
  • SAN JOSE, Calif. and GUANGZHOU, China, Nov. 01, 2023 (GLOBE NEWSWIRE) -- GOWIN Semiconductor Corporation, recognized as the world's fastest-growing FPGA company, is excited to announce an expansion of its Arora V high-performance FPGA family.
  • The new Arora V family not only complements the previous Arora family but also offers a significant performance boost with lower power consumption.
  • Specifically, the Arora V devices exhibit 30% higher performance and a remarkable 60% reduction in power consumption compared to the Arora GW2A family.
  • The new Arora V family also incorporates an advanced I/O structure capable of recovering received serial data containing an embedded clock using built-in CDR technology at each differential I/O pair.

Dynamic Random Access Memory (DRAM) Market to grow by USD 163.03 billion from 2022 to 2027, Growth Driven by Growth of smart cities- Technavio

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Sunday, September 24, 2023
Dynamic random-access memory, Graphics processing unit, Micron Technology, Fujitsu, STT, SK, DRAM, ISO, Internet of things, DDR3, Infineon Technologies, Intel, Electronics, Magneto, Central processing unit, MRAM, Computer, DDR5, Certification, DDR2, Personal computer, ICT, Analysis, RAM, Growth, City, Field-programmable gate array, Robotics, Texas Instruments, Geography, Video game, Computer data storage, Application-specific integrated circuit, DDR4

The potential growth difference for the dram market from 2022 to 2027 is USD 163.03 billion.

Key Points: 
  • The potential growth difference for the dram market from 2022 to 2027 is USD 163.03 billion.
  • The growth of smart cities is one of the key drivers supporting the growth of the dynamic random access memory market.
  • Get deeper insights into the market size, current market scenario, future growth opportunities, major growth driving factors, the latest trends, and more.
  • Buy the full report here
    Various upcoming and improved technologies that offer price benefits are one of the significant challenges restricting market growth.

Alliance Memory Signs Rep Agreement With Electra Sales to Support Customers in Upstate New York

Retrieved on: 
Thursday, July 13, 2023
SPI, Partnership, LPDDR2, SDR, NOR, MSDR, DDR, DRAM, Upstate New York, DDR3, ICS, Micron Technology, MultiMediaCard, SRAM Corporation, DDR2, DDR3L, SRAM, CMOS, EOL, Memory, Computer data storage, Video game, LPDDR4, DDR4, LPDDR

Under the agreement, the company is now offering Alliance Memory’s entire lineup of SRAM, DRAM, embedded multi-media card (eMMC), and flash memory ICs to its customers throughout Upstate New York.

Key Points: 
  • Under the agreement, the company is now offering Alliance Memory’s entire lineup of SRAM, DRAM, embedded multi-media card (eMMC), and flash memory ICs to its customers throughout Upstate New York.
  • Electra Sales has been providing consultative sales services for the Upstate New York market since 1972, with a territory that consists of all counties north of, and including, Orange and Putnam.
  • "In the dynamic and demanding marketplace of Upstate New York, Electra Sales has been a reliable source of customer-centric service for more than four decades," said Tom Gargan, director of sales for Canada, the Eastern U.S., and Brazil at Alliance Memory.
  • "At Electra Sales, we take pride in partnering with industry-leading manufacturers, and Alliance Memory undoubtedly fits that mold," said Mark Rogers, president and technical sales engineer at Electra Sales.

Global Automotive Memory Chip Market to 2027: Chinese Storage Suppliers Accelerate Deployment in the Promising Automotive Storage Market

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Tuesday, March 28, 2023
Cloud, Communication, Counterpoint, DDR3, Original equipment manufacturer, L5, Temperature, Lidar, Continental, MMC, Memory, Flash memory, App, Powe, XPeng P7, Software, Integrated circuit, GigaDevice, GPS, QSPI, EEPROM, OBC, LPDDR5, Electronics, ISO, GDDR, TB, Ingenic Semiconductor, SK Hynix, PCI Express, MultiMediaCard, UFS, LPDDR, Car, Growth, Cloud computing, GB, Intellectual property, DDR, DRAM, LPDDR3, IVI, Micron Technology, SOC, WD, DDR2, VCU, Radar, CPU, GDDR6, RAM, L4, Samsung, Micrometre, Qualcomm, Flash, SSD, FOTA, SRAM, Reading, AI, EB, IDMS, Cryptocurrency, Electric battery, Computer data storage, Video game, Satellite navigation device, Lexar, L3, LPDDR4, ADAS

The global smart phone storage market size hit US$46 billion in 2021 when the global automotive storage market size reached about US$4.5 billion, which is only equivalent to 1/10 of the former.

Key Points: 
  • The global smart phone storage market size hit US$46 billion in 2021 when the global automotive storage market size reached about US$4.5 billion, which is only equivalent to 1/10 of the former.
  • By 2027, global automotive storage market size will exceed US$12.5 billion, with a CAGR of 18.6% from 2021 to 2027.
  • High-level autonomous vehicles have posed enormous demand for automotive memory capacity, density and bandwidth
    At present, main storage applications in automotive market include DRAM(DDR, LPDDR) and NAND (e.MMC and UFS, etc.).
  • 3.1 Memory Chip Application Scenario: Cockpit
    3.2 Memory Chip Application Scenario: Autonomous Driving
    3.3 Memory Chip Application Scenario: Driving Data Recording
    3.4 Memory Chip Application Scenarios: Cloud Computing and Storage

Global Automotive Memory Chip Industry Research Report 2022: Featuring Samsung, SK Hynix, Micron, Kioxia and Fujitsu Among Others - ResearchAndMarkets.com

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Friday, March 24, 2023
Technology, Hardware, Integrated circuit, Communication, QSPI, DDR, DRAM, LPDDR5, LPDDR3, Electronics, ISO, GDDR, Software, TB, DDR3, IVI, SK Hynix, PCI Express, Samsung, Micrometre, L5, Qualcomm, Micron Technology, SOC, Flash, Lidar, SSD, MultiMediaCard, UFS, DDR2, MMC, FOTA, LPDDR, GDDR6, Flash memory, RAM, Reading, Growth, L4, GB, Computer data storage, Video game, L3, LPDDR4, ADAS

High-level autonomous vehicles have posed enormous demand for automotive memory capacity, density and bandwidth

Key Points: 
  • High-level autonomous vehicles have posed enormous demand for automotive memory capacity, density and bandwidth
    At present, main storage applications in automotive market include DRAM(DDR, LPDDR) and NAND (e.MMC and UFS, etc.).
  • Low-power LPDDR and NAND will be main growth engines, and the demand for NOR Flash, used for chip startup, will continue to increase.
  • Overseas storage vendors such as Micron, Samsung, SK Hynix and Microchip still dominate the development of the automotive storage industry as monopolists.
  • In 2021, Micron launched its industry-leading automotive LPDDR5 certified by ISO 26262 ASIL-D, with the maximum capacity of 128GB.

Winbond and STMicroelectronics partner to combine high-performance memory with STM32 devices in smart industrial and consumer applications

Retrieved on: 
Wednesday, March 15, 2023
Cortex, STMicroelectronics, Electronics, Microprocessor, NYSE, Memory, MPU-401, MCU, Ecosystem, Partnership, RAM, DDR4, DRAM, Random-access memory, General-purpose, MPU, PCB, STM, Atari ST, SDR, DDR3, DDR, Family, STM32, Video game, Computer data storage, Winbond

The partnership formalizes collaboration between the two companies to optimize integration and performance and assure long-term availability of Winbond and ST devices, to meet the needs of customers serving industrial markets.

Key Points: 
  • The partnership formalizes collaboration between the two companies to optimize integration and performance and assure long-term availability of Winbond and ST devices, to meet the needs of customers serving industrial markets.
  • "This partnership means product developers can confidently integrate our memory with STM32 devices," said Tetsu Ho, Winbond DRAM Technology Manager.
  • The STM32 family is the market leader in MCUs and MPUs built on industry-standard Arm® Cortex 32-bit cores.
  • Winbond's DDR3 supports the MPU's memory buffer to enhance performance in applications such as industrial gateways, data concentrators, smart meters, barcode readers, smart-home devices, and numerous applications that require both high performance and state-of-the-art security.

Alliance Memory Expands Lineup of CMOS DDR4 SDRAMs With New 16Gb Device

Retrieved on: 
Tuesday, February 14, 2023
FBGA, DDR4, SDRAM, DDR3, Life, Temperature, Electronics, CMOS, BC4, HMI, Telecommunications, BL8, Tablet, Video game

KIRKLAND, Wash., Feb. 14, 2023 (GLOBE NEWSWIRE) -- Alliance Memory today announced that it has expanded its portfolio of CMOS DDR4 SDRAMs with a new 16Gb device in the 96-ball FBGA package.

Key Points: 
  • KIRKLAND, Wash., Feb. 14, 2023 (GLOBE NEWSWIRE) -- Alliance Memory today announced that it has expanded its portfolio of CMOS DDR4 SDRAMs with a new 16Gb device in the 96-ball FBGA package.
  • To increase battery life in portable electronics such as smartphones and tablets, the DDR4 SDRAM released today features a low operating voltage of +1.2V (±0.06V).
  • Built on an 8n-prefetch architecture, the device offers fast clock speeds up to 1600MHz and transfer rates up to 3200 MT/s.
  • Offered in the commercial (0°C to +95°C) temperature range, the device is ideal for the industrial, networking, telecommunications, gaming, and consumer markets.

InMotion Hosting Augments its Dedicated Servers with New Plans and Extensive Upgrades

Retrieved on: 
Wednesday, January 11, 2023
Information technology, DDR4, Aspire, DDR3, RAM, Web hosting service, InMotion, Internet service provider

VIRGINIA BEACH, Va., Jan. 11, 2023 /PRNewswire/ -- InMotion Hosting - an industry leader in premium web hosting and customer support - has upgraded its Dedicated Server fleet to include more robust specs at an affordable price. Dedicated Hosting customers may now choose from two new plans: the Aspire and CC-3000.

Key Points: 
  • InMotion Hosting delivers two new plans and extensive hardware upgrades to its Dedicated Server product line.
  • VIRGINIA BEACH, Va., Jan. 11, 2023 /PRNewswire/ -- InMotion Hosting - an industry leader in premium web hosting and customer support - has upgraded its Dedicated Server fleet to include more robust specs at an affordable price.
  • Dedicated Hosting customers may now choose from two new plans: the Aspire and CC-3000.
  • "We are excited to unveil the Aspire and CC-3000 plans, and numerous server upgrades, to our new dedicated hosting customers.

Get Noticed at CES 2023 with Eye-Catching Etron Booths!

Retrieved on: 
Thursday, January 5, 2023
Innovation, Communication, XINK, Health, CV, 3D, USB, SDR, WLCSP, CES, Artificial intelligence, DDR3, Computer security, DDR, DRAM, Privacy, Attention, AI, SPI, DDR2, RPC, SDRAM, ST, Machine learning, LPDDR4, LPDDR2, DDR3 SDRAM, NIR, Connector, Chicago Innovation Awards, Internet, Robotics, Facial recognition, Intelligence, Medical device, Video game console, Computer data storage, Etron, DDR4

STMicroelectronics and eYs3D Microelectronics to showcase collaboration on high-quality 3D stereo-vision camera for machine vision and robotics at CES 2023.

Key Points: 
  • STMicroelectronics and eYs3D Microelectronics to showcase collaboration on high-quality 3D stereo-vision camera for machine vision and robotics at CES 2023.
  • The CES demonstrations highlight two jointly developed reference designs, the Ref-B6 and Ref-B3 ASV (Active Stereo Vision) video and depth cameras.
  • Ushering in the era of inclusive application of IntelligenceN, Etron is actively advancing heterogeneous integration of products in product innovation.
  • As advanced DRAM products are needed for heterogeneous integration applications, Etron introduced a new platform for heterogeneous integration of AI and DRAM.