LDPC

KLEVV UNVEILS THE CRAS C925 GEN4 M.2 SSD PACKED WITH ADVANCED STORAGE TECHNOLOGY

Retrieved on: 
Tuesday, April 16, 2024
ECC, PS5, SLIM, SRAM, M.2 SSD, United, HMB, AES, PCI, Amazon, IOPS, SSD, Temperature, TB, Flash memory, Longevity, LDPC, IDEAL, Video game

HONG KONG, April 15, 2024 /PRNewswire/ -- KLEVV, the premier consumer memory and storage brand of Essencore, is thrilled to introduce the brand-new CRAS C925 Gen4 M.2 SSD, a superior storage solution for gaming and content creation.

Key Points: 
  • The CRAS C925 M.2 SSD leverages the cutting-edge PCI Express® Gen4 x4 interface and NVMe™ 1.4 protocol to deliver astonishing data transfer speeds, significantly reducing load times and enhancing the overall computing experience.
  • Featuring an optional add-on aluminum heatsink for free installation, the CRAS C925 offers up to 12% temperature reduction, providing optimal performance and longevity.
  • Available in 500GB, 1TB, and 2TB capacities, the CRAS C925 utilizes strictly-selected 3D NAND Flash, offering ample storage for all your games, applications, and media.
  • Advanced SLC caching and HMB technology enhance endurance and performance, making it a robust solution for extensive data storage needs.

KLEVV UNVEILS THE CRAS C925 GEN4 M.2 SSD PACKED WITH ADVANCED STORAGE TECHNOLOGY

Retrieved on: 
Tuesday, April 16, 2024
ECC, PS5, SLIM, SRAM, M.2 SSD, United, HMB, AES, PCI, Amazon, IOPS, SSD, Temperature, TB, Flash memory, Longevity, LDPC, IDEAL, Video game

HONG KONG, April 15, 2024 /PRNewswire/ -- KLEVV, the premier consumer memory and storage brand of Essencore, is thrilled to introduce the brand-new CRAS C925 Gen4 M.2 SSD, a superior storage solution for gaming and content creation.

Key Points: 
  • The CRAS C925 M.2 SSD leverages the cutting-edge PCI Express® Gen4 x4 interface and NVMe™ 1.4 protocol to deliver astonishing data transfer speeds, significantly reducing load times and enhancing the overall computing experience.
  • Featuring an optional add-on aluminum heatsink for free installation, the CRAS C925 offers up to 12% temperature reduction, providing optimal performance and longevity.
  • Available in 500GB, 1TB, and 2TB capacities, the CRAS C925 utilizes strictly-selected 3D NAND Flash, offering ample storage for all your games, applications, and media.
  • Advanced SLC caching and HMB technology enhance endurance and performance, making it a robust solution for extensive data storage needs.

Exascend Unveils Radiation-Hardened PR4 Series NVMe SSD at Embedded World 2024

Retrieved on: 
Wednesday, April 10, 2024
Neutron, SSD, PR4, LDPC, Embedded, Computer data storage

TAIPEI, April 10, 2024 /PRNewswire/ -- Exascend, a service-oriented provider of innovative storage and memory solutions, unveils its latest innovation at Embedded World 2024: the radiation-hardened PR4 Series NVMe SSD .

Key Points: 
  • TAIPEI, April 10, 2024 /PRNewswire/ -- Exascend, a service-oriented provider of innovative storage and memory solutions, unveils its latest innovation at Embedded World 2024: the radiation-hardened PR4 Series NVMe SSD .
  • The PR4 Series SSD, featuring Exascend's cutting-edge radiation-hardened technology, Neutron Shield 2.0 , boasts advanced features such as radiation-induced bit flip correction, LDPC enhanced mode, and dual-copy firmware protection, ensuring unparalleled operational stability.
  • "The PR4 Series is a true testament to Exascend's relentless pursuit of innovation," said Frank Chen, CEO at Exascend.
  • For more information about Exascend's PR4 Series NVMe SSD, visit the Exascend website .

Exascend Unveils Radiation-Hardened PR4 Series NVMe SSD at Embedded World 2024

Retrieved on: 
Wednesday, April 10, 2024
Neutron, SSD, PR4, LDPC, Embedded, Computer data storage

TAIPEI, April 10, 2024 /PRNewswire/ -- Exascend, a service-oriented provider of innovative storage and memory solutions, unveils its latest innovation at Embedded World 2024: the radiation-hardened PR4 Series NVMe SSD .

Key Points: 
  • TAIPEI, April 10, 2024 /PRNewswire/ -- Exascend, a service-oriented provider of innovative storage and memory solutions, unveils its latest innovation at Embedded World 2024: the radiation-hardened PR4 Series NVMe SSD .
  • The PR4 Series SSD, featuring Exascend's cutting-edge radiation-hardened technology, Neutron Shield 2.0 , boasts advanced features such as radiation-induced bit flip correction, LDPC enhanced mode, and dual-copy firmware protection, ensuring unparalleled operational stability.
  • "The PR4 Series is a true testament to Exascend's relentless pursuit of innovation," said Frank Chen, CEO at Exascend.
  • For more information about Exascend's PR4 Series NVMe SSD, visit the Exascend website .

Exascend Pushing Storage Beyond Boundaries At Embedded World 2024

Retrieved on: 
Wednesday, April 3, 2024
Micrometre, Temperature, Vibration, SSD, BGA, Shock, Embedded, Humidity, MultiMediaCard, LDPC, Booth, Payment card, CFexpress, Printed circuit board

TAIPEI, April 3, 2024 /PRNewswire/ -- Exascend, a service-oriented provider of innovative storage and memory solutions, is set to showcase its latest innovations at Embedded World 2024 in Nuremberg, Germany from April 9-11. Renowned for pushing the boundaries of storage technology, Exascend invites attendees to explore the possibilities of "Storage Beyond Boundaries" at Booth 1-422.

Key Points: 
  • TAIPEI, April 3, 2024 /PRNewswire/ -- Exascend , a service-oriented provider of innovative storage and memory solutions, is set to showcase its latest innovations at Embedded World 2024 in Nuremberg, Germany from April 9-11.
  • Renowned for pushing the boundaries of storage technology, Exascend invites attendees to explore the possibilities of "Storage Beyond Boundaries" at Booth 1-422.
  • In a testament to its collaboration with industry leaders in innovative storage solutions, Exascend will also feature a showcase area at Micron's booth, highlighting storage solutions tailored for cinematography, automotive, and mission-critical applications.
  • Additional Onsite Showcases at Exascend's Booth 1-422:
    Industrial removable storage solutions including CFexpress, CFast, SD, and microSD cards
    Don't miss the opportunity to explore Exascend's innovative storage solutions and advancements at Embedded World 2024.

Silicon Motion Unveils 6nm UFS 4.0 Controller for AI Smartphones, Edge Computing and Automotive Applications

Retrieved on: 
Tuesday, March 12, 2024
ECC, MB, UFS, SRAM, EUV, QLC, SCSI, MIPI, Universal Flash Storage, SIMO, AI, TLC, LDPC, Data-rate units, JEDEC, Senior, UniPro, Silicon, Architecture, SAM, 2.0, TB, Marketing, Silicon Motion, UFS 3.1, IOT, Computer data storage

TAIPEI and MILPITAS, Calif., March 12, 2024 /PRNewswire/ -- Silicon Motion Technology Corporation (NasdaqGS: SIMO) ("Silicon Motion"), a global leader in designing and marketing NAND flash controllers for solid state storage devices, today introduced its UFS (Universal Flash Storage) 4.0 controller, the SM2756, as the flagship of the industry's broadest merchant portfolio of UFS controller solutions for the growing requirements of AI-powered smartphones as well as other high-performance applications including automotive and edge computing. The company also added a new, second generation SM2753 UFS3.1 controller to broaden its portfolio of controllers now supporting UFS4.0 to UFS2.2 standards.   Silicon Motion's UFS portfolio delivers high-performance and low power embedded storage for flagship to mainstream and value mobile and computing devices, supporting the broadest range of NAND flash, including next-generation high speed 3D TLC and QLC NAND.

Key Points: 
  • The company also added a new, second generation SM2753 UFS3.1 controller to broaden its portfolio of controllers now supporting UFS4.0 to UFS2.2 standards.
  • Silicon Motion's UFS portfolio delivers high-performance and low power embedded storage for flagship to mainstream and value mobile and computing devices, supporting the broadest range of NAND flash, including next-generation high speed 3D TLC and QLC NAND.
  • The new second generation SM2753 UFS 3.1 controller solution boasts a high-speed serial-link-based MIPI M-PHY HS-Gear4 x 2-lane, and SCSI architecture model (SAM) enabling unparalleled performance.
  • Silicon Motion's latest UFS controller solutions are equipped with advanced LDPC ECC technology and SRAM data error detection and correction.

Phison Launches Full Range of UFS Storage Solutions for Unparalleled Mobile Storage Performance

Retrieved on: 
Tuesday, January 30, 2024
Hardware, Data Management, Consumer Electronics, Technology, Semiconductor, Mobile, Wireless, Other Technology, Security, ECC, Nature, Multimedia, MIPI, Blog, Knowledge, LDPC, History, Research, Flash memory, Universal Flash Storage, UFS, MultiMediaCard, SDA, Automotive industry, Electronics, SSD, USB, JEDEC, UFSA, Smartphone, ONFI, PCI-SIG, UFS 3.1, IP, IEEE-SA, Tablet, NVM Express, TB, Video game

Phison’s new UFS solutions support entry-level, middle, premium and flagship smartphone devices to achieve maximum performance in mobile storage and enhance user experiences.

Key Points: 
  • Phison’s new UFS solutions support entry-level, middle, premium and flagship smartphone devices to achieve maximum performance in mobile storage and enhance user experiences.
  • View the full release here: https://www.businesswire.com/news/home/20240130214428/en/
    Phison Launches Full Range of UFS Storage Solutions for Unparalleled Mobile Storage Performance (Image: Phison)
    As smartphone devices require higher performance, the storage devices of many entry-level 5G models have transitioned from eMMC to UFS 2.2 storage, and even flagship models of 4G phones have begun adopting the UFS 2.2 specification.
  • In response to the evolving storage requirements of smartphones, Phison has introduced the cost-effective UFS 2.2 controller PS8327 , offering the highest performance-to-cost ratio in history to meet the growing demand for high-speed mobile storage.
  • Phison’s comprehensive suite of UFS storage solutions provides many advantages, including cost-effectiveness, performance, and low power consumption for mobile devices.

ADATA Industrial Releases SATA 31D Series Industrial-grade SSDs

Retrieved on: 
Monday, December 11, 2023
ECC, POS, TB, ADATA, WDC, SLC, Risk, LDPC, TLC, System, SSD, Information privacy, MLC, SATA, Memory, Solid-state drive, Computer data storage

The SATA 31D series of industrial-grade SSDs utilize 112-layer 3D TLC flash memory developed by WDC, boasting a P/E Cycle of 3,000 which is comparable to MLC.

Key Points: 
  • The SATA 31D series of industrial-grade SSDs utilize 112-layer 3D TLC flash memory developed by WDC, boasting a P/E Cycle of 3,000 which is comparable to MLC.
  • The 31D series also offers a variety of ultra-thin and compact mainstream specifications such as SATA 2.5-inch, M.2 2280, M.2 2242, and various capacity options from 128GB to 2TB.
  • The company’s SATA 31D series industrial-grade SSDs only utilize high-quality components and highly integrated firmware to ensure that system stability is not affected by environmental factors.
  • At present, ADATA Industrial’s SATA 31D series industrial-grade SSDs have been put into mass production and have been successfully introduced into leading POS machines and by touch screen computer manufacturers at home and abroad.

Photonic Accelerating Quantum Computing’s Transformational Benefits with New Architecture

Retrieved on: 
Wednesday, November 8, 2023
Professional Services, Research, Engineering, Chemicals, Plastics, Science, Automotive Manufacturing, Utilities, Automotive, Oil, Gas, Semiconductor, Manufacturing, Security, Alternative Energy, General Health, Energy, University, Education, General Automotive, Nuclear, Telecommunications, Internet, Environment, Hardware, Technology, Health, Finance, Commercial Building & Real Estate, Banking, Construction & Property, Education minister, Photon, LDPC, Architecture, Data, Tier 2, Multimedia, Inc., Canadian Institute for Advanced Research, Ecosystem, Physics, Information science, Hand, IP, Memory, Silicon, Simon Fraser University, Microscope, Photonics

Photonic Inc., a company building one of the world’s first scalable, fault-tolerant, and unified quantum computing and networking platforms based on photonically linked silicon spin qubits, today introduced its quantum architecture.

Key Points: 
  • Photonic Inc., a company building one of the world’s first scalable, fault-tolerant, and unified quantum computing and networking platforms based on photonically linked silicon spin qubits, today introduced its quantum architecture.
  • Photonic has committed to silicon—the chemical element serving as the backbone of modern telecommunications and computation—as the dominant enabling design in quantum computing.
  • Photonic links in silicon deliver quantum entanglement not only between qubits on the same chip but also among multiple quantum chips.
  • Photonic's highly connected qubit architecture also enables use of efficient quantum error correction codes, such as quantum LDPC (Low Density Parity Check) codes.

Exascend Unveils Automotive Storage Solutions for Connected Vehicles

Retrieved on: 
Wednesday, November 8, 2023
ECC, Vibration, A2, Temperature, ADAS, LDPC, Humidity, FFU, Shock, IOPS, IATF, SLC, MMC, JEDEC, Navigation, FBGA, TLC, Computer data storage

TAIPEI, Nov. 8, 2023 /PRNewswire/ -- Exascend , a service-oriented provider of innovative storage and memory solutions, today announced its EM500 series e.MMC and microSD500 series memory cards to meet rising data storage demands of connected and autonomous vehicles.

Key Points: 
  • TAIPEI, Nov. 8, 2023 /PRNewswire/ -- Exascend , a service-oriented provider of innovative storage and memory solutions, today announced its EM500 series e.MMC and microSD500 series memory cards to meet rising data storage demands of connected and autonomous vehicles.
  • The Exascend EM500 offers capacities from 4GB to 256GB and delivers sequential read/write speeds up to 295 MB/s and 210 MB/s in HS400 data transfer mode.
  • For removable storage requirements, Exascend's microSD500 series comes in capacities from 8GB to 256GB with speed class V30/U3/C10 and performance class A2.
  • "As data from connected and autonomous vehicles grows exponentially, the next generation of these vehicles requires robust storage to enable cutting-edge applications," said Frank Chen, Exascend CEO.