UFS 3.1

Micron’s Full Suite of Automotive-Grade Solutions Qualified for Qualcomm Automotive Platforms to Power AI in Vehicles

Retrieved on: 
Wednesday, April 10, 2024
Ecosystem, Antirrhinum, SOC, Micrometre, Digital, ADAS, Artificial intelligence, Embedded, Intelligence, Qualcomm, Chassis, LPDDR5, LPDDR5X, UFS 3.1, Memory, SSD, UFS, Longevity, Socs, Computer data storage

This work between Micron and Qualcomm Technologies is aimed at helping the ecosystem build next-generation intelligent vehicles powered by sophisticated AI.

Key Points: 
  • This work between Micron and Qualcomm Technologies is aimed at helping the ecosystem build next-generation intelligent vehicles powered by sophisticated AI.
  • These automotive products are rigorously tested to provide the extreme stability, quality, thermal tolerances, reliability and longevity that the automotive market requires.
  • Micron’s automotive solutions will deliver powerful benefits for Qualcomm Technologies’ automotive customers and the broader ecosystem:
    Micron’s automotive LPDDR5X is the flagship memory solution for applications needing the fastest speeds and lowest power profile.
  • Together, these launches extend Micron’s automotive leadership and better empower the automotive ecosystem to usher vehicles into a new era of intelligence at the edge.

KIOXIA Sampling Latest Generation UFS Ver. 4.0 Embedded Flash Memory Devices

Retrieved on: 
Tuesday, April 23, 2024
Electronic Design Automation, Data Management, Semiconductor, Technology, Mobile, Wireless, 5G, Hardware, App Store (iOS/iPadOS), JEDEC, UFS 3.1, BICS, Multimedia, Data-rate units, UFS, TB, UFS 4.0, Engineered wood

KIOXIA America, Inc. today announced that it has begun sampling1 the latest generation of its Universal Flash Storage2 (UFS) Ver.

Key Points: 
  • KIOXIA America, Inc. today announced that it has begun sampling1 the latest generation of its Universal Flash Storage2 (UFS) Ver.
  • 4.0 embedded flash memory devices.
  • 4.0 devices integrate the company’s innovative BiCS FLASH™ 3D flash memory and a controller in a JEDEC standard package.
  • Maitry Dholakia, vice president, Memory Business Unit, for KIOXIA America, Inc. emphasized the company's ongoing leadership in UFS technology, stating, "The newest generation of our UFS 4.0 devices is a testament to our commitment to continually push performance boundaries – and make an improved user experience a reality."

Kioxia Sampling Latest Generation UFS Ver. 4.0 Embedded Flash Memory Devices

Retrieved on: 
Tuesday, April 23, 2024
Semiconductor, Technology, Manufacturing, Mobile, Wireless, Other Manufacturing, Hardware, Sale, MIPI M-PHY, Corporation, Personal computer, Universal Flash Storage, UniPro, Toshiba, MIPI, App Store (iOS/iPadOS), Solid-state drive, JEDEC, Memory, UFS 3.1, BICS, Multimedia, Data-rate units, UFS, TB, UFS 4.0, Computer data storage

Kioxia Corporation , a world leader in memory solutions, today announced that it has begun sampling(1) the latest generation of its Universal Flash Storage(2) (UFS) Ver.

Key Points: 
  • Kioxia Corporation , a world leader in memory solutions, today announced that it has begun sampling(1) the latest generation of its Universal Flash Storage(2) (UFS) Ver.
  • 4.0 embedded flash memory devices (Graphic: Business Wire)
    The enhanced performance of the new UFS products provides optimal utilization of 5G connectivity, resulting in accelerated downloads, minimized latency, and an enhanced user experience.
  • 4.0 devices integrate the company’s innovative BiCS FLASH™ 3D flash memory and a controller in a JEDEC-standard package.
  • (2) Universal Flash Storage (UFS) is a product category for a class of embedded memory products built to the JEDEC UFS standard specification.

Silicon Motion Unveils 6nm UFS 4.0 Controller for AI Smartphones, Edge Computing and Automotive Applications

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Tuesday, March 12, 2024
ECC, MB, UFS, SRAM, EUV, QLC, SCSI, MIPI, Universal Flash Storage, SIMO, AI, TLC, LDPC, Data-rate units, JEDEC, Senior, UniPro, Silicon, Architecture, SAM, 2.0, TB, Marketing, Silicon Motion, UFS 3.1, IOT, Computer data storage

TAIPEI and MILPITAS, Calif., March 12, 2024 /PRNewswire/ -- Silicon Motion Technology Corporation (NasdaqGS: SIMO) ("Silicon Motion"), a global leader in designing and marketing NAND flash controllers for solid state storage devices, today introduced its UFS (Universal Flash Storage) 4.0 controller, the SM2756, as the flagship of the industry's broadest merchant portfolio of UFS controller solutions for the growing requirements of AI-powered smartphones as well as other high-performance applications including automotive and edge computing. The company also added a new, second generation SM2753 UFS3.1 controller to broaden its portfolio of controllers now supporting UFS4.0 to UFS2.2 standards.   Silicon Motion's UFS portfolio delivers high-performance and low power embedded storage for flagship to mainstream and value mobile and computing devices, supporting the broadest range of NAND flash, including next-generation high speed 3D TLC and QLC NAND.

Key Points: 
  • The company also added a new, second generation SM2753 UFS3.1 controller to broaden its portfolio of controllers now supporting UFS4.0 to UFS2.2 standards.
  • Silicon Motion's UFS portfolio delivers high-performance and low power embedded storage for flagship to mainstream and value mobile and computing devices, supporting the broadest range of NAND flash, including next-generation high speed 3D TLC and QLC NAND.
  • The new second generation SM2753 UFS 3.1 controller solution boasts a high-speed serial-link-based MIPI M-PHY HS-Gear4 x 2-lane, and SCSI architecture model (SAM) enabling unparalleled performance.
  • Silicon Motion's latest UFS controller solutions are equipped with advanced LDPC ECC technology and SRAM data error detection and correction.

Phison Launches Full Range of UFS Storage Solutions for Unparalleled Mobile Storage Performance

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Tuesday, January 30, 2024
Hardware, Data Management, Consumer Electronics, Technology, Semiconductor, Mobile, Wireless, Other Technology, Security, ECC, Nature, Multimedia, MIPI, Blog, Knowledge, LDPC, History, Research, Flash memory, Universal Flash Storage, UFS, MultiMediaCard, SDA, Automotive industry, Electronics, SSD, USB, JEDEC, UFSA, Smartphone, ONFI, PCI-SIG, UFS 3.1, IP, IEEE-SA, Tablet, NVM Express, TB, Video game

Phison’s new UFS solutions support entry-level, middle, premium and flagship smartphone devices to achieve maximum performance in mobile storage and enhance user experiences.

Key Points: 
  • Phison’s new UFS solutions support entry-level, middle, premium and flagship smartphone devices to achieve maximum performance in mobile storage and enhance user experiences.
  • View the full release here: https://www.businesswire.com/news/home/20240130214428/en/
    Phison Launches Full Range of UFS Storage Solutions for Unparalleled Mobile Storage Performance (Image: Phison)
    As smartphone devices require higher performance, the storage devices of many entry-level 5G models have transitioned from eMMC to UFS 2.2 storage, and even flagship models of 4G phones have begun adopting the UFS 2.2 specification.
  • In response to the evolving storage requirements of smartphones, Phison has introduced the cost-effective UFS 2.2 controller PS8327 , offering the highest performance-to-cost ratio in history to meet the growing demand for high-speed mobile storage.
  • Phison’s comprehensive suite of UFS storage solutions provides many advantages, including cost-effectiveness, performance, and low power consumption for mobile devices.

KIOXIA Introduces Industry’s First UFS Ver. 4.0 Embedded Flash Memory Devices for Automotive Applications

Retrieved on: 
Monday, January 29, 2024
Vehicle Technology, Data Management, Consumer Electronics, Automotive, Technology, Software, Sequence, UFS 4.0, BICS, UniPro, UFS 3.1, Temperature, Multimedia, Memory, ADAS, MIPI M-PHY, JEDEC, MIPI, Internet of things

4.0 embedded flash memory devices3 designed for automotive applications.

Key Points: 
  • 4.0 embedded flash memory devices3 designed for automotive applications.
  • These new, higher performing devices deliver fast embedded storage transfer speeds in a small package size and are targeted to a variety of next-generation automotive applications, including telematics, infotainment systems and ADAS4.
  • 4.0 devices integrate the company’s innovative BiCS FLASH™ 3D flash memory and a controller in a JEDEC-standard package.
  • “KIOXIA continues to demonstrate its leadership in UFS memory with the introduction of the industry’s first UFS Ver.

Micron Low-Power Memory Solution Boosts Mixed and Virtual Reality Experiences on Snapdragon XR2 Gen 2

Retrieved on: 
Thursday, October 19, 2023
LPDDR5, VR, DRAM, Data-rate units, Meta, Life, MR, NAND, Micrometre, Universal Flash Storage, UFS 3.1, Qualcomm, Virtual reality, Ecosystem, Micron Technology, XR, LPDDR5X, JEDEC, AR, UFS, Memory, Antirrhinum, Video game

Micron’s LPDDR5X and UFS 3.1 deliver next-level speed, performance and low-power consumption in the smallest form factors needed to support untethered mixed reality (MR) and virtual reality (VR) devices.

Key Points: 
  • Micron’s LPDDR5X and UFS 3.1 deliver next-level speed, performance and low-power consumption in the smallest form factors needed to support untethered mixed reality (MR) and virtual reality (VR) devices.
  • Micron’s LPDDR5X is the company’s most advanced low-power memory, delivering power efficiency enabled by its innovative 1-alpha process node technology and JEDEC power advancements .
  • The Snapdragon XR2 Gen 2 Platform offers a single-chip architecture to unlock next-level immersive MR and VR experiences in thinner and more comfortable headsets that don’t require an external battery pack.
  • Micron’s 1-alpha node process technology, which underpins Micron’s LPDDR5X, provides higher bit density, performance and energy efficiency for XR devices.

Samsung Starts Mass Production of Automotive UFS 3.1 Memory Solution with Industry’s Lowest Power Consumption

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Thursday, July 13, 2023
Data Management, Automotive Manufacturing, EV, Electric Vehicles, Consumer Electronics, Automotive, Technology, Manufacturing, Semiconductor, Vehicle Technology, Alternative Energy, Energy, BIS, Samsung Electronics, IVI, Electronics, Samsung, Automotive industry, Multimedia, UFS 3.1, Certification, UFS, Universal Flash Storage, Memory, ESG, ADAS, GB, Computer data storage

Samsung Electronics Co. Ltd, a world leader in advanced semiconductor technology, today announced that it has initiated mass production of its new automotive Universal Flash Storage (UFS) 3.1 memory solution optimized for in-vehicle infotainment (IVI) systems.

Key Points: 
  • Samsung Electronics Co. Ltd, a world leader in advanced semiconductor technology, today announced that it has initiated mass production of its new automotive Universal Flash Storage (UFS) 3.1 memory solution optimized for in-vehicle infotainment (IVI) systems.
  • The new solution offers the industry’s lowest energy consumption, enabling car manufacturers to provide the best mobility experience for consumers.
  • View the full release here: https://www.businesswire.com/news/home/20230713942714/en/
    Samsung Starts Mass Production of Automotive UFS 3.1 Memory Solution with Industry’s Lowest Power Consumption (Graphic: Business Wire)
    The UFS 3.1 lineup will come in 128, 256 and 512-gigabyte (GB) variants to meet different needs of customers.
  • As Samsung continues to strengthen its automotive memory solution portfolio, the company received an ASPICE Level 2 certification from customers in April, 2023, with its ADAS-oriented UFS 3.1 product.

Kioxia Introduces Next-Generation UFS Ver. 4.0 Devices

Retrieved on: 
Wednesday, May 31, 2023
Semiconductor, Technology, Manufacturing, Mobile, Wireless, 5G, Other Manufacturing, Hardware, Sequence, Toshiba, Communication, MIPI, NAND, TB, Replay, MCQ, Multimedia, UFS 3.1, UFS 4.0, Sale, App Store (iOS/iPadOS), UFS, Personal computer, Name, MIPI M-PHY, Memory, Reading, UniPro, JEDEC, BICS, Solid-state drive, Video game, Engineered wood, Computer data storage, Kioxia

Continuing to move Universal Flash Storage[1] (UFS) technology forward, Kioxia Corporation , a world leader in memory solutions, today announced sampling[2] of new, higher performing UFS Ver.

Key Points: 
  • Continuing to move Universal Flash Storage[1] (UFS) technology forward, Kioxia Corporation , a world leader in memory solutions, today announced sampling[2] of new, higher performing UFS Ver.
  • 4.0 devices from Kioxia integrate the company’s innovative BiCS FLASH™ 3D flash memory and a controller in a JEDEC-standard package.
  • Due to its serial interface, UFS supports full duplexing, which enables both concurrent reading and writing between the host processor and UFS device.
  • *Read and write speeds are the best values obtained in a specific test environment at Kioxia Corporation and Kioxia Corporation warrant neither read nor write speeds in individual devices.

KIOXIA Introduces Next-Generation UFS Ver. 4.0 Devices

Retrieved on: 
Tuesday, May 30, 2023
Software, Mobile, Wireless, Networks, Internet, Hardware, Data Management, Consumer Electronics, Technology, Semiconductor, Security, 5G, Audio, Video, Other Technology, Sequence, MIPI, Replay, MCQ, Multimedia, UFS 3.1, UFS 4.0, App Store (iOS/iPadOS), UFS, MIPI M-PHY, UniPro, JEDEC, BICS, Video game, Engineered wood, Computer data storage

Continuing to move Universal Flash Storage1 (UFS) technology forward, KIOXIA America, Inc. today announced sampling2 of new, higher performing UFS Ver.

Key Points: 
  • Continuing to move Universal Flash Storage1 (UFS) technology forward, KIOXIA America, Inc. today announced sampling2 of new, higher performing UFS Ver.
  • The improved performance3 of UFS products from KIOXIA enables these applications to take advantage of 5G’s connectivity benefits, leading to faster downloads, reduced lag time and an improved user experience.
  • 4.0 devices from KIOXIA integrate the company’s innovative BiCS FLASH™ 3D flash memory and a controller in a JEDEC-standard package.
  • “Once again KIOXIA is maintaining its leadership in UFS, with our pipeline of newer, faster performing UFS devices,” noted Scott Beekman, vice president, Memory Business Unit, for KIOXIA America, Inc. “This is our second generation of UFS 4.0 devices, which were developed to keep pushing the performance boundaries from generation to generation.”
    Performance improvement over previous generation4: +18% sequential write, +30% random write and +13% random read.