FEOL

Cadence Quantus FS Solution, a 3D Field Solver, Achieves Certification for Samsung Foundry’s SF4, SF3E and SF3 Process Technologies

Retrieved on: 
Wednesday, January 25, 2023
Electronic Design Automation, Engineering, Semiconductor, Technology, Manufacturing, Software, Hardware, Samsung, FEOL, Sung-jae, GAA, AMS, Gate, SF4, Certification, SOC, BEOL, Cadence Design Systems, FS, IP, Kunyu Wanguo Quantu, Central processing unit, Digital, CDNS, Samsung Electronics, SF3, Mobile phone, Cadence

Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that Samsung Foundry has certified the Cadence® Quantus™ FS solution for its SF4, SF3E and SF3 process technologies.

Key Points: 
  • Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that Samsung Foundry has certified the Cadence® Quantus™ FS solution for its SF4, SF3E and SF3 process technologies.
  • During the Samsung Foundry certification process, the Quantus FS solution successfully demonstrated improved accuracy (tighter mean and standard deviation) versus foundry criteria, ensuring customers can achieve optimal design accuracy and performance.
  • The built-in 3D capacitance field solver is cloud-ready and production-proven, offering a flexible, scalable modeling platform that enables faster implementation of the Samsung Foundry’s advanced process technologies such as SF4, SF3E and SF3.
  • The successful completion of the certification process is a win-win for Samsung Foundry and Cadence as well as for our mutual customers.”

Renesas Develops Circuit Technologies for 22-nm Embedded STT-MRAM with Faster Read and Write Performance for MCUs in IoT Applications

Retrieved on: 
Thursday, June 16, 2022
Electronic Design Automation, Data Management, Semiconductor, IOT (Internet of Things), Technology, Nanotechnology, Hardware, CMOS, Reading, Hertz, Memory, Data-rate units, Technology, ReMarkable, Temperature, Samsung Galaxy Note (original), MCU, VLSI Technology, Efficiency, IOT, STT-MRAM, LinkedIn, Symposia on VLSI Technology and Circuits, TSE, CPU, YouTube, Megabit, MTJ, Renesas Electronics, OTA, Twitter, Lightwave Electronics Corporation, Multimedia, AI, Computer data storage, Electronic component, Printed circuit board, BEOL, MRAM, FEOL, Facebook, Instagram

However, MRAM has a smaller read margin than flash memory, which degrades read speed.

Key Points: 
  • However, MRAM has a smaller read margin than flash memory, which degrades read speed.
  • MRAM can also achieve shorter write time than flash memory because it requires no erase operation before write operation.
  • To address these challenges and respond to market demand for higher MCU performance, Renesas has developed the following new circuit technologies to achieve faster read and write operation in MRAM.
  • Renesas is committed to further increasing capacity, speed, and power efficiency for MCUs to accommodate a range of new applications.

IBM Research and Nova Jointly Awarded the "Best Metrology Paper" at SPIE Advanced Lithography Conference

Retrieved on: 
Tuesday, April 26, 2022
Cloud, U.S. Securities and Exchange Commission, Security (finance), Memory, Research, Annual report, Information technology, Private Securities Litigation Reform Act, Risk, IBM Research, Boron nitride nanosheet, Failure, Technology, Raman, FEOL, TASE, Solution, IBM, Forward-looking statement, Safety, Industry, Risk management, COVID-19, Nasdaq

REHOVOT, Israel, April 26, 2022 /PRNewswire/ -- Nova (Nasdaq: NVMI) today announced that its co-authored paper with IBM Research on "In-Line Raman Spectroscopy for Stacked Nanosheet Device Manufacturing" has been selected as the winner of the Diana Nyyssonen award for "best paper at SPIE's 2021 Advanced Lithography Symposia." The award was granted to Nova and IBM on the opening day of the 2022 conference. The paper is a result of a continuous collaboration between the companies that drove numerous innovative joint development programs to enhance advanced chip manufacturing. The paper demonstrates the novel technologies Nova promotes in advanced process control by utilizing its unique and differentiated solutions. As part of the collaboration with IBM Research, Nova installed its most advanced portfolio at IBM Research's lab in Albany, New York.  

Key Points: 
  • The award was granted to Nova and IBM on the opening day of the 2022 conference.
  • The paper demonstrates the novel technologies Nova promotes in advanced process control by utilizing its unique and differentiated solutions.
  • As part of the collaboration with IBM Research, Nova installed its most advanced portfolio at IBM Research's lab in Albany, New York.
  • Nova is a leading innovator and key provider of material, optical and chemical metrology solutions for advanced process control in semiconductor manufacturing.

ACM Research Receives Multiple Purchase Orders for Ultra C wb Wet Bench Tools

Retrieved on: 
Sunday, February 13, 2022
NASDAQ, Silicon, FEOL, ULD, DHF, CEO, Research, DIO3, Electroplating, Ownership, IPA, ACM, SC1, Ultra, Technology, NAND, WLP, 3D NAND, Temperature, RCA, CMP, Multiple chemical sensitivity, SC2, BEOL, GLOBE, MRC, Fine chemical, Printed circuit board, DIW

FREMONT, Calif., Feb. 13, 2022 (GLOBE NEWSWIRE) -- ACM Research, Inc. (ACM) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) applications, today announced volume purchase orders for 29 Ultra C wb wet bench tools for 300 mm wafer applications. The orders are from multiple China-based customers, and include repeat orders for 16 tools from an emerging foundry customer to support its ongoing fab expansion. Shipments are scheduled in two phases, beginning in the first half of 2022.

Key Points: 
  • Largest purchase order for wet bench systems in ACMs history;
    FREMONT, Calif., Feb. 13, 2022 (GLOBE NEWSWIRE) -- ACM Research, Inc. (ACM) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) applications, today announced volume purchase orders for 29 Ultra C wb wet bench tools for 300 mm wafer applications.
  • The orders are from multiple China-based customers, and include repeat orders for 16 tools from an emerging foundry customer to support its ongoing fab expansion.
  • can be supplied in programmed sequences, ACMs Ultra C wb wet bench tool delivers high cleaning performance and eliminates cross-contamination at a lower cost of ownership.
  • The Ultra C wb wet bench tool efficiently uses chemistries and deionized water (DIW), making it environmentally friendly.

Weebit and SkyWater Announce Agreement to take ReRAM Technology to Volume Production

Retrieved on: 
Thursday, September 9, 2021
Software, Networks, Technology, Automotive Manufacturing, Aerospace, Semiconductor, Manufacturing, Security

Weebit Nano Limited (ASX: WBT), a leading developer of next-generation memory technologies for the global semiconductor industry, and SkyWater Technology (NASDAQ: SKYT), the trusted technology realization partner, announced an agreement to take Weebits innovative Resistive RAM (ReRAM) technology to volume production.

Key Points: 
  • Weebit Nano Limited (ASX: WBT), a leading developer of next-generation memory technologies for the global semiconductor industry, and SkyWater Technology (NASDAQ: SKYT), the trusted technology realization partner, announced an agreement to take Weebits innovative Resistive RAM (ReRAM) technology to volume production.
  • Under the terms of the agreement, SkyWater and Weebit will collaborate to transfer the Weebit ReRAM technology to SkyWaters production fab and qualify it for volume manufacturing.
  • Commercialization of ReRAM technology will provide enhancements to a range of new electronics in industries such as automotive which require high-temperature performance.
  • Coby Hanoch, CEO of Weebit Nano, said, We are delighted to announce Weebits first commercial agreement to take our groundbreaking ReRAM to volume production.