4GB Music Festival

GigaDevice's Industry-Leading Automotive Flash Memory Achieves 100 Million Units Shipment Milestone

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Friday, April 14, 2023
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BEIJING, April 14, 2023 (GLOBE NEWSWIRE) -- GigaDevice (SSE: 603986), a semiconductor industry leader in flash memory, 32-bit microcontrollers (MCUs), sensors, and analog technology, proudly announces the milestone of shipping 100 million units of its leading automotive-grade (AEC-Q100) GD25/55 SPI NOR and GD5F SPI NAND flash series.

Key Points: 
  • BEIJING, April 14, 2023 (GLOBE NEWSWIRE) -- GigaDevice (SSE: 603986), a semiconductor industry leader in flash memory, 32-bit microcontrollers (MCUs), sensors, and analog technology, proudly announces the milestone of shipping 100 million units of its leading automotive-grade (AEC-Q100) GD25/55 SPI NOR and GD5F SPI NAND flash series.
  • GigaDevice is committed to delivering highly reliable and secure automotive flash memories to its customers in a full range of voltages and densities.
  • Automotive designers require memory solutions providing high reliability, security, high density, and fast response in code storage.
  • After nearly a decade of technological innovation and quality management improvement, the 100 million units shipment milestone represents GigaDevice's unwavering commitment to the automotive memory market.

GigaDevice's Industry-Leading Automotive Flash Memory Achieves 100 Million Units Shipment Milestone

Retrieved on: 
Friday, April 14, 2023
ECC, Certification, GigaDevice, MCU, ADAS, SSE, R, RPMC, CRC, 4GB Music Festival, 2MBS Fine Music Sydney, Computer data storage

BEIJING, April 14, 2023 (GLOBE NEWSWIRE) -- GigaDevice (SSE: 603986), a semiconductor industry leader in flash memory, 32-bit microcontrollers (MCUs), sensors, and analog technology, proudly announces the milestone of shipping 100 million units of its leading automotive-grade (AEC-Q100) GD25/55 SPI NOR and GD5F SPI NAND flash series.

Key Points: 
  • BEIJING, April 14, 2023 (GLOBE NEWSWIRE) -- GigaDevice (SSE: 603986), a semiconductor industry leader in flash memory, 32-bit microcontrollers (MCUs), sensors, and analog technology, proudly announces the milestone of shipping 100 million units of its leading automotive-grade (AEC-Q100) GD25/55 SPI NOR and GD5F SPI NAND flash series.
  • GigaDevice is committed to delivering highly reliable and secure automotive flash memories to its customers in a full range of voltages and densities.
  • Automotive designers require memory solutions providing high reliability, security, high density, and fast response in code storage.
  • After nearly a decade of technological innovation and quality management improvement, the 100 million units shipment milestone represents GigaDevice's unwavering commitment.

Alliance Memory to Highlight Latest SRAM, DRAM, eMMC, and Flash Memory ICs at electronica 2022

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Monday, November 7, 2022
GLOBE, 2GB, Flash, Micron Technology, DDR4 SDRAM, Temperature, DDR3L, NAND, Technology, Ghana Trade Fair Center, FTL, SOP, IOT, DRAM, SRAM, FBGA, DDR3, Solution, Telecommunication, JEDEC, DDR4, MultiMediaCard, WSON, ICS, Gigabyte, CEO, SDRAM, 4GB Music Festival, Computer data storage, Video game console

Its hard to believe its been four years since electronica was last held, said David Bagby, president and CEO of Alliance Memory.

Key Points: 
  • Its hard to believe its been four years since electronica was last held, said David Bagby, president and CEO of Alliance Memory.
  • At electronica 2022, Alliance Memory will showcase eMMC solutions that integrate NAND flash memory with an eMMC controller and flash transition layer (FTL) management software in a single package for solid-state storage in consumer, industrial, and networking applications.
  • Alliance Memory will highlight 3V and 1.8V multiple input/output serial NOR Flash memory products, which are designed to provide supply continuity to Micron Technology customers utilizing discontinued devices.
  • Alliance Memory is a worldwide provider of critical and hard-to-find memory ICs for the communications, computing, consumer electronics, medical, automotive, and industrial markets.

Winbond's LPDDR4/4X 100BGA achieves JEDEC standard for improved energy conservation and carbon reduction in a smaller package size

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Wednesday, July 27, 2022
Carbon, R, Flash, JEDEC, Winbond, Electronics, 4GB Music Festival, DDR4, DDP, SDP, News, LPDDR4, CTSP, Company, PCB, IOT, Communication, Central Taiwan Science Park, Specialty, Video game console

TAICHUNG, Taiwan, July 27, 2022 /PRNewswire/ -- Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions,today announced that its new package 100BGA LPDDR4/4X had achieved the JEDEC JED209-4 standard to ensure energy conservation and carbon reduction.

Key Points: 
  • TAICHUNG, Taiwan, July 27, 2022 /PRNewswire/ -- Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions,today announced that its new package 100BGA LPDDR4/4X had achieved the JEDEC JED209-4 standard to ensure energy conservation and carbon reduction.
  • The LPDDR4/4X is now available in a space-saving 100BGA package measuring only 7.5X10mm2.
  • The deviceis ideal for IoT applications requiring higher throughput in a small package to allow designers to reduce the PCB size for more compact IoT designs.
  • Winbond's LPDDR4/4X memory is available in density of 1Gb and 2Gb, supporting speeds of up to 4267Mbps.

Winbond Keeps Expanding DDR3 SDRAM Production

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Wednesday, April 20, 2022
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TAICHUNG, Taiwan, April 20, 2022 /PRNewswire/ -- Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced key enhancements to its DDR3 product on the ultra-high-speed performance.

Key Points: 
  • Now, Winbond DDR3 shipments is 30% of total DRAM revenue and is projected to increase to 50% in 2024.
  • "Winbond has been delivering competitive DDR3 products for 10 years and will keep delivering DDR3 in coming 10+ years with superior customer support and product quality," says Winbond.
  • "Today, our customers continue to require DDR3 SDRAM products and our goal is to continue that proven legacy to ensure we can meet customer longevity demand," Winbond added.
  • Based on Taichung and new Kaohsiung 12-inch fabs in Taiwan, Winbond keeps pace to develop in-house technologies to provide high-quality memory IC products.

Alliance Memory Cuts Lead Times for DRAMs and Micron NOR Flash Memory Products With Automotive Temperature Ratings

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Thursday, December 2, 2021
CMOS, DDR2, Micron Technology, Temperature, LPDDR4X, AEC, 4MBS, SDRAM, ICS, Micrometre, DDR1, SRAM, NOR, GLOBE, Parallel, SDR, ADAS, 4GB Music Festival, DRAM, 2GB, Dram, Carputer, Computer data storage, Engineered wood

KIRKLAND, Wash., Dec. 02, 2021 (GLOBE NEWSWIRE) -- Alliance Memory today announced that it has greatly reduced lead times for its DRAMs and Micron Technology NOR Flash memory devices with automotive temperature ratings.

Key Points: 
  • KIRKLAND, Wash., Dec. 02, 2021 (GLOBE NEWSWIRE) -- Alliance Memory today announced that it has greatly reduced lead times for its DRAMs and Micron Technology NOR Flash memory devices with automotive temperature ratings.
  • Responding to customer demand, the company now holds 70 parts in finished goods stock and can provide lead times of just six weeks for its most popular automotive temperature range products.
  • Alliance Memory offers a complete lineup of CMOS SDRAMs including DDR1, DDR2, DDR3/L, LPDDR4, and LPDDR4X devices with automotive temperature ratings of -40C to +105C.
  • Alliance Memory is a worldwide provider of critical and hard-to-find memory ICs for the communications, computing, consumer electronics, medical, automotive, and industrial markets.

ISSI’s 4Gb DDR3 with On-chip ECC is now ASIL-B Certified

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Thursday, November 4, 2021
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MILPITAS, Calif., Nov. 04, 2021 (GLOBE NEWSWIRE) -- ISSIs 4Gb DDR3 with on-chip ECC has been ASIL-B certified by SGS corporation.

Key Points: 
  • MILPITAS, Calif., Nov. 04, 2021 (GLOBE NEWSWIRE) -- ISSIs 4Gb DDR3 with on-chip ECC has been ASIL-B certified by SGS corporation.
  • The 4Gb DDR3 with on-chip ECC is now in mass production.
  • ISSI offers 4Gb DDR3 with on-chip ECC in x8 and x16 data widths.
  • This is where ISSI's 4Gb DDR3 with on-chip ECC comes in.

Avalanche Technology Announces Space Grade STT-MRAM For Space-IoT™ Applications

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Monday, November 1, 2021
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"Avalanche's high density MRAM devices are a key enabling technology for high-performance space computing applications.

Key Points: 
  • "Avalanche's high density MRAM devices are a key enabling technology for high-performance space computing applications.
  • Ibeos plans to incorporate this technology into our next-generation payload processor devices" said John Bevilacqua, CTO and Founder at Ibeos.
  • All density options in Avalanche's Parallel x32 Space Grade series will be available to customers participating in the early access program.
  • With a state-of-the-art manufacturing and testing facility, including vacuum and thermal chambers in Reston, Virginia, Ibeos offers quick-turn prototypes and flight articles for space.

Avalanche Technology Announces Family of STT-MRAM for Space-IoT™ Applications

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Wednesday, October 13, 2021
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With densities from 64Mb to 4Gb in the smallest footprint available, we plan to utilize them in our next generation AI-SBCs.

Key Points: 
  • With densities from 64Mb to 4Gb in the smallest footprint available, we plan to utilize them in our next generation AI-SBCs.
  • This will further enable realization of our AI Accelerators in the rapidly growing space processing ecosystem.
  • The new monolithic 64Mb and stacked 256Mb P-SRAM devices enable customers to design unified memory architecture systems for high reliability space applications, in extremely small form factors."
  • said Danny Sabour, VP of Sales and Marketing at Avalanche Technology.