DDR2

Alliance Memory Cuts Lead Times for DRAMs and Micron NOR Flash Memory Products With Automotive Temperature Ratings

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Thursday, December 2, 2021
CMOS, DDR2, Micron Technology, Temperature, LPDDR4X, AEC, 4MBS, SDRAM, ICS, Micrometre, DDR1, SRAM, NOR, GLOBE, Parallel, SDR, ADAS, 4GB Music Festival, DRAM, 2GB, Dram, Carputer, Computer data storage, Engineered wood

KIRKLAND, Wash., Dec. 02, 2021 (GLOBE NEWSWIRE) -- Alliance Memory today announced that it has greatly reduced lead times for its DRAMs and Micron Technology NOR Flash memory devices with automotive temperature ratings.

Key Points: 
  • KIRKLAND, Wash., Dec. 02, 2021 (GLOBE NEWSWIRE) -- Alliance Memory today announced that it has greatly reduced lead times for its DRAMs and Micron Technology NOR Flash memory devices with automotive temperature ratings.
  • Responding to customer demand, the company now holds 70 parts in finished goods stock and can provide lead times of just six weeks for its most popular automotive temperature range products.
  • Alliance Memory offers a complete lineup of CMOS SDRAMs including DDR1, DDR2, DDR3/L, LPDDR4, and LPDDR4X devices with automotive temperature ratings of -40C to +105C.
  • Alliance Memory is a worldwide provider of critical and hard-to-find memory ICs for the communications, computing, consumer electronics, medical, automotive, and industrial markets.

ISSI’s 4Gb DDR3 with On-chip ECC is now ASIL-B Certified

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Thursday, November 4, 2021
ECC, SRAM, 1T-SRAM, 4GB Music Festival, Safety, LPDDR, SOC, DDR3 SDRAM, NOR, DDR3, ISO 26262, 2GB, Flash memory, SDR, DDR2, KGD, ISO, Program, ISSI, JEDEC, Dram, GLOBE, Solution, LPDDR2, SGS, SPI, Certification, Automotive industry, MultiMediaCard, MPU, DRAM, Computer data storage

MILPITAS, Calif., Nov. 04, 2021 (GLOBE NEWSWIRE) -- ISSIs 4Gb DDR3 with on-chip ECC has been ASIL-B certified by SGS corporation.

Key Points: 
  • MILPITAS, Calif., Nov. 04, 2021 (GLOBE NEWSWIRE) -- ISSIs 4Gb DDR3 with on-chip ECC has been ASIL-B certified by SGS corporation.
  • The 4Gb DDR3 with on-chip ECC is now in mass production.
  • ISSI offers 4Gb DDR3 with on-chip ECC in x8 and x16 data widths.
  • This is where ISSI's 4Gb DDR3 with on-chip ECC comes in.

JEDEC Board Selects Samsung Memory Business President as Recipient of its 2022 Distinguished Executive Leadership Award

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Wednesday, November 3, 2021
Technology, Hardware, Data Management, JEDEC, Master of Science, Technology, Volunteering, Industry, GDDR, LPDDR, DDR3, DDR, DDR2, Engineering, Samsung Electronics, DRAM, Samsung, JB, Seoul National University, National university, Growth, Electronic engineering, Bachelor of Science, Publication, CXL, Management, Computer data storage, Mobile phone

The JEDEC Board of Directors passed a resolution yesterday at its November board meeting naming Jung-Bae Lee, Ph.D. and president of the Memory Business at Samsung Electronics, as the recipient of its Distinguished Executive Leadership Award for 2022.

Key Points: 
  • The JEDEC Board of Directors passed a resolution yesterday at its November board meeting naming Jung-Bae Lee, Ph.D. and president of the Memory Business at Samsung Electronics, as the recipient of its Distinguished Executive Leadership Award for 2022.
  • Jung-Bae Lee is one of the brightest minds in the semiconductor industry, said Desi Rhoden, Executive Vice President at Montage Technology and JEDEC Memory Committee Chair.
  • Dr. Lee is the ultimate example of the type of leader for which the JEDEC Distinguished Executive Leadership Award was created to honor and recognize.
  • As Samsungs memory business chief, Lee is now responsible for all of the companys memory products and technologies, worldwide.

Upgrading FORESEE nMCP (NAND-based MCP) to Promote Construction of the Global 5G Market

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Sunday, October 31, 2021
PCB, Research, Quality of life, JEDEC, LPDDR2, Industry, LPDDR, POS, Memory, DDR2, MIFI, Ageing, HTOL, NAND, IOT, MCP, Flash memory, Temperature, Miniaturization, BOM, Video game console

With this in mind, storage enterprises are increasingly tasking themselves with vigorous research and development of Multi-Chip Packaging (MCP) storage products.

Key Points: 
  • With this in mind, storage enterprises are increasingly tasking themselves with vigorous research and development of Multi-Chip Packaging (MCP) storage products.
  • In order to put the minds of industry customers at ease, he FORESEE R&D team has conducted rigorous standard testing on nMCP series products.
  • The FORESEE nMCP has passed strict reliability tests (such as HTOL and HTSL for three lots) in accordance with the JEDEC standard.
  • FORESEE will continue to provide industry customers with highly reliable storage products with diversified storage capacities.

Montage Technology Announces Mass Production of 1st-Gen DDR5 Product Family

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Friday, October 29, 2021
SPD, Efficiency, JEDEC, Technology, Ecosystem, Intel, I3C, DDR5, DDR3, DDR2, Montage, DRAM, LRDIMM, Information technology, VP, RDIMM, UDIMM, TS, PMIC, Multimedia, DDR4, Client, Business, VDD, SODIMM, GM, VP/MS, DB, Power management, Cloud computing, RCD, Video game console, Computer data storage, Online shopping

SHANGHAI, Oct. 29, 2021 /PRNewswire/ -- Montage Technology, a leading data processing and interconnect IC design company, today announced the mass production of the first-generation DDR5 memory interface product family, which includes Registering Clock Driver (RCD), Data Buffer (DB), SPD EEPROM with Hub (SPD Hub), Temperature Sensor (TS) and Power Management IC (PMIC).

Key Points: 
  • SHANGHAI, Oct. 29, 2021 /PRNewswire/ -- Montage Technology, a leading data processing and interconnect IC design company, today announced the mass production of the first-generation DDR5 memory interface product family, which includes Registering Clock Driver (RCD), Data Buffer (DB), SPD EEPROM with Hub (SPD Hub), Temperature Sensor (TS) and Power Management IC (PMIC).
  • These chips are designed for DDR5 memory modules, such as RDIMM, LRDIMM, UDIMM and SODIMM, to advance the memory performance for next-generation servers, desktops and laptops.
  • With the rapid development of information technology, the memory technology has now evolved into the new era of DDR5.
  • As an industry-leading memory interface vendor and an active contributor to the JEDEC memory standards, Montage Technology has been dedicated to continuous innovation of memory interface technology to meet the ever-changing needs.

Micron and ATP to Collaborate on DDR2 Continuity Program

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Monday, October 1, 2018
Computing, Micron Technology, SO-DIMM, DIMM, Restriction of Hazardous Substances Directive, DDR2, Europe, Data

ATP, a leading manufacturer of high-performance industrial memory and storage solutions, will collaborate with global semiconductor leader Micron Technology, Inc. to continue manufacturing Micron DDR2 SO-DIMMs, UDIMMs and RDIMMs after Micron announced end-of-life (EOL) notices for these modules.

Key Points: 
  • ATP, a leading manufacturer of high-performance industrial memory and storage solutions, will collaborate with global semiconductor leader Micron Technology, Inc. to continue manufacturing Micron DDR2 SO-DIMMs, UDIMMs and RDIMMs after Micron announced end-of-life (EOL) notices for these modules.
  • With DDR2 still widely deployed in the US, Japan and Europe, ATP and Micron expect these markets to benefit significantly from the consistent supply of DDR2 memory for industrial/embedded systems installed in high-reliability and mission-critical environments.
  • The DDR2 Continuity Program will be implemented on a staggered basis within three manufacturing phases.
  • ATP is a certified Eco/Green partner of tier one OEMs and all ATP products are fully RoHS and China RoHS compliant.