HKSTP Partners Global Accelerator Plug and Play in Calling Startups for EPiC 2023 Elevator Pitch Competition in Hong Kong
Hong Kong Science and Technology Parks Corporation (HKSTP) has partnered with world-leading innovation platform, Plug and Play , to call on ambitious startups and entrepreneurs around the world to join the seventh Elevator Pitch Competition 2023 (EPiC 2023), one of the biggest pitch events in Hong Kong.
- Hong Kong Science and Technology Parks Corporation (HKSTP) has partnered with world-leading innovation platform, Plug and Play , to call on ambitious startups and entrepreneurs around the world to join the seventh Elevator Pitch Competition 2023 (EPiC 2023), one of the biggest pitch events in Hong Kong.
- View the full release here: https://www.businesswire.com/news/home/20230113005179/en/
HKSTP CEO, Albert Wong, joins Plug and Play CEO, Saeed Amidi, to promote HKSTP’s EPiC 2023, calling all startups in the world to come to Hong Kong for a scale-up opportunity of a lifetime. - (Photo: Business Wire)
This offers local and global startups the chance to join the combined HKSTP and Plug and Play eco-systems to launch their potential innovations onto the global stage. - Startups joining EPiC 2023 can fully leverage the largest I&T ecosystem in Hong Kong and HKSTP’s direct connections to over 1,000 investors and more than 300 corporate partners.