DSP

Tungsten510 SMARC® System-On-Module from Ezurio Combines Superior Edge Processing with Wi-Fi 6 and Bluetooth 5.3 Connectivity

Retrieved on: 
Thursday, March 28, 2024
Cortex, POS, DSP, MediaTek, Memory, Partnership, Internet of things, Physics, Tablet, HDR, Radio, USB, SMARC, SBC, Hertz, SOM, Projection, Android, ARM Cortex-A55, AVP, Mobile phone

AKRON, Ohio, March 28, 2024 /PRNewswire/ -- Ezurio, a global leader in connectivity, today announces the upcoming Tungsten510 system-on-modules (SOM), in a smart mobility architecture (SMARC) form factor, developed in partnership with MediaTek.

Key Points: 
  • The Tungsten510 SMARC is powered by the MediaTek Genio 510 processor and Ezurio's upcoming Sona™ MT320 Wi-Fi 6/Bluetooth 5.3 module, based on the MediaTek Filogic 320 Wi-Fi/Bluetooth combo radio.
  • Together these solutions provide a comprehensive compute and connectivity platform.
  • This high-performance SOM, when used with the SMARC carrier , also serves as a single board computer (SBC) that can significantly speed customer products to market.
  • The Tungsten510 conforms to the SMARC 2.1.1 standard form factor (82mm x 50mm), with a SMARC edge connector, on board ethernet PHYs, and a USB hub controller.

SEMIFIVE Starts Mass Production of its 14nm AI Inference SoC Platform based Product

Retrieved on: 
Thursday, March 28, 2024
Cloud, Fin field-effect transistor, Head, SOC, DSP, Growth, ARIES, LPDDR4, Application-specific integrated circuit, Samsung Electronics, AI, Robotics, USB On-The-Go, Semiconductor, NPU, Ecosystem, Cloud computing, CPU, IPS, Silicon, Video game

SEOUL, South Korea , March 27, 2024 /PRNewswire/ -- SEMIFIVE, a leading design solution provider and pioneer of platform-based custom silicon solutions, has announced the mass production of its 14nm AI Inference SoC Platform in collaboration with its lead partner Mobilint, an AI hardware and software solution startup based in South Korea. This marks SEMIFIVE's third commercialization of its SoC Platform solutions built on Samsung Foundry's mass production proven FinFET process technologies.

Key Points: 
  • SEOUL, South Korea , March 27, 2024 /PRNewswire/ -- SEMIFIVE, a leading design solution provider and pioneer of platform-based custom silicon solutions, has announced the mass production of its 14nm AI Inference SoC Platform in collaboration with its lead partner Mobilint, an AI hardware and software solution startup based in South Korea.
  • This marks SEMIFIVE's third commercialization of its SoC Platform solutions built on Samsung Foundry's mass production proven FinFET process technologies.
  • Pre-verified and integrated, SEMIFIVE's 14nm AI Inference SoC Platform includes a quad-core high performance 64-bit CPU, 8 lanes of PCIe Gen4 and 4-channel LPDDR4 interfaces.
  • "We are proud to have collaborated with Mobilint, contributing to the rapid commercialization of AI semiconductors—a testament to the value of our AI SoC Platform.

Marvell Launches Products, Technology and Partnerships at OFC 2024 to Scale Optical Technology for Accelerated Infrastructure

Retrieved on: 
Tuesday, March 26, 2024
Cloud, Constellation, Momentum, DWDM, Optics, GM, DSP, Growth, EVP, Spica, Marvell Technology, British Rail Class 397, AI, PCS, TRO, Coherence, DSPS, Orion, TROS, IP, Cloud computing, Telecommunications, Coherent Corp., Marketing, Silicon photonics, PAM4, Data-rate units, MRVL, Silicon, Video game

SANTA CLARA, Calif., March 26, 2024 /PRNewswire/ -- Marvell Technology, Inc. (NASDAQ: MRVL), a leader in data infrastructure semiconductor solutions, will outline its broad-ranging strategy to optimize optical technology to meet the rising performance and power requirements of AI and cloud data centers at OFC 2024, taking place this week in San Diego, California.

Key Points: 
  • 200 Gbps per lane I/O is a defining feature of next-generation data center architectures.
  • Nova, a 1.6T optical DSP featuring 100G per lane electrical I/O and 200G per lane optical interfaces, is now generally available.
  • Marvell 3D Silicon Photonics Engine: The Marvell 3D SiPho Engine combines hundreds of components needed for optical communications into a single device.
  • "The industry is now entering a new chapter and Marvell is looking forward to collaborating with its partners in extending the horizons of this far-reaching technology."

Spectra7 to Demonstrate 800Gbps Active Copper Interconnects with Arista, Cisco and Other Leading Ethernet Alliance Members at OFC

Retrieved on: 
Tuesday, March 26, 2024
Ethernet Alliance, Communication, OSFP, Conference, The Company, DSP, Wire, Digital signal processing, Broadcom Inc., SAN, Cisco, Arista, AOCS, San Diego Convention Center, ACC, Digital signal

SAN DIEGO, March 26, 2024 /PRNewswire/ -- (TSXV: SEV) (OTCQB: SPVNF) Spectra7 Microsystems Inc. ("Spectra7" or the "Company"), a leading provider of high-performance analog semiconductor products for broadband connectivity markets, announced that it will be demonstrating 800Gbps Active Copper Cable (ACC) interconnects connecting with Arista, Cisco and other leading equipment makers at the 2024 Optical Fiber Communication Conference and Exhibition (OFC). The demonstration will be in the Ethernet Alliance booth #1415. The premier global communications and networking expo will be held at the San Diego Convention Center, Calif., March 26-28, 2024.

Key Points: 
  • The demonstration will be in the Ethernet Alliance booth #1415.
  • The premier global communications and networking expo will be held at the San Diego Convention Center, Calif., March 26-28, 2024.
  • Spectra7 will be demonstrating 800Gbps OSFP ACC interconnects with Arista's TH5/X93160 Ethernet switch based on Broadcom's newest Tomahawk 5 switch chip as well as 800G QSFP-DD ACC interconnects with Cisco's 64 port switch based on their own SiliconOne switch chip.
  • In total Spectra7 will have six 800Gbps ACC interconnects in the demo connecting a wide range of switches, routers and test equipment.

NewPhotonics Introduces Transmitter-on-Chip PIC with Integrated Equalizer for LPO and LRO Data Center Connectivity

Retrieved on: 
Monday, March 25, 2024
Element, DSP, LRO, SAN, LPO, SVP, PSM, AI, Data-rate units, OEM, PAM4, Silicon, Computer data storage

SAN DIEGO, Calif. , March 25, 2024 /PRNewswire/ -- NewPhotonics Ltd today introduced its NPG102 second generation photonic integrated circuit with integrated optical equalizer delivering reduced complexity and enhanced link performance for high-throughput optical interconnect. The enhanced transmitter-optimized chip offers breakthrough minimal latency and power performance at 800 GBps and 1.6 TBps for linear receive optics (LRO) and linear drive pluggable optics (LPO) applications in the data center.

Key Points: 
  • The enhanced transmitter-optimized chip offers breakthrough minimal latency and power performance at 800 GBps and 1.6 TBps for linear receive optics (LRO) and linear drive pluggable optics (LPO) applications in the data center.
  • The NewPhotonics NPG102 PIC is an octal and quad parallel single mode (PSM) transmitter for 8x and 4x 200G PAM4 transceivers.
  • The optical equalizer located closest to TP2 facilitates signal dispersion compensation that enables consistent optical link performance and interoperability.
  • "AI continues to drive data center processing needs of large language models (LLMs) ramping requirements for low power and low latency fiber connectivity," said Doron Tal, SVP and GM Optical Connectivity at NewPhotonics.

Pilot Photonics secures large european funding win to develop key technologies for CPO scaling

Retrieved on: 
Monday, March 25, 2024
Transition, CPO, European Innovation Council, SAN, San Diego Convention Center, DSP, Pressure, Algorithm, EIC, Communication

The explosion in data processing due to the adoption of AI/ML is putting further pressure on datacentre networks and in large computing arenas.

Key Points: 
  • The explosion in data processing due to the adoption of AI/ML is putting further pressure on datacentre networks and in large computing arenas.
  • New architectures are emerging to tackle this problem but already scaling challenges are appearing and new innovations will be needed to overcome them.
  • Supported by this EIC funding Pilot Photonics will mature a number of its patented technologies including comb lasers, ring resonator IQ modulators and comb-enhanced DSP algorithms.
  • These innovations are relevant to both pluggable and CPO architectures today and can help unlock coherent communication inside the datacentre.

Pilot Photonics secures large european funding win to develop key technologies for CPO scaling

Retrieved on: 
Monday, March 25, 2024
Transition, CPO, European Innovation Council, SAN, San Diego Convention Center, DSP, Pressure, Algorithm, EIC, Communication

The explosion in data processing due to the adoption of AI/ML is putting further pressure on datacentre networks and in large computing arenas.

Key Points: 
  • The explosion in data processing due to the adoption of AI/ML is putting further pressure on datacentre networks and in large computing arenas.
  • New architectures are emerging to tackle this problem but already scaling challenges are appearing and new innovations will be needed to overcome them.
  • Supported by this EIC funding Pilot Photonics will mature a number of its patented technologies including comb lasers, ring resonator IQ modulators and comb-enhanced DSP algorithms.
  • These innovations are relevant to both pluggable and CPO architectures today and can help unlock coherent communication inside the datacentre.

Marvell Doubles Reach of 800 Gbps ZR/ZR+ Pluggable Modules with PCS, Expands Ecosystem for COLORZ® 800

Retrieved on: 
Monday, March 25, 2024
Cloud, Optics, DSP, Associate, Arista Networks, Marvell Technology, AI, Noisy-channel coding theorem, PCS, DCI, Silicon, Marketing, Data-rate units, Ecosystem, LightWave 3D, MRVL, Mobile phone

The demonstration, which takes place in the Marvell booth (#2225) at OFC 2024, consists of a network featuring a Marvell® Teralynx® 10 switch and Marvell 800 Gbps ZR/ZR+ modules.

Key Points: 
  • The demonstration, which takes place in the Marvell booth (#2225) at OFC 2024, consists of a network featuring a Marvell® Teralynx® 10 switch and Marvell 800 Gbps ZR/ZR+ modules.
  • With PCS enabled, the reach of a Marvell COLORZ 800 module at full bandwidth doubles from 500km to 1000km.
  • COLORZ 800 is powered by the Marvell® Orion® 800 Gbps coherent DSP which enables the widest ecosystem of interoperable 800 Gbps coherent modules on the market.
  • Marvell COLORZ 800 modules are the industry's first 800G ZR/ZR+ modules for data center interconnects (DCIs).

Marvell Announces Industry's First 5nm Transmit-Only 800G PAM4 Optical DSP for AI and Cloud Interconnects

Retrieved on: 
Monday, March 25, 2024
DSP, Tias, Spica, Marvell Technology, Perseus, AI, TRO, IEEE, DSPS, Architecture, PAM4, Data-rate units, MRVL

SANTA CLARA, Calif., March 25, 2024 /PRNewswire/ -- Marvell Technology, Inc. (NASDAQ: MRVL), a leader in data infrastructure semiconductor solutions, today announced Spica Gen2-T, the industry's first 5nm 800 Gbps transmit-only PAM4 optical DSP.

Key Points: 
  • SANTA CLARA, Calif., March 25, 2024 /PRNewswire/ -- Marvell Technology, Inc. (NASDAQ: MRVL), a leader in data infrastructure semiconductor solutions, today announced Spica Gen2-T, the industry's first 5nm 800 Gbps transmit-only PAM4 optical DSP.
  • To enable cloud service providers to optimize their infrastructure, Marvell has reduced power per bit and cost per bit with every generation of optical DSPs.
  • Spica Gen2-T is the latest member of the Marvell family of 800 Gbps optical DSPs, the most widely deployed optical DSP in cloud data centers and AI clusters2.
  • Spica, Spica Gen2, Spica Gen2-T, and Perseus are all based on the Marvell industry-leading PAM4 optical DSP architecture .

Marvell Extends 1.6T Connectivity Leadership With Industry's First PAM4 Optical DSP Integrating 200 Gbps Electrical and Optical Interfaces

Retrieved on: 
Monday, March 25, 2024
DSP, Noise, Marvell Technology, British Rail Class 397, AI, DSPS, Investment, NIC, Ethernet, TBPS, PAM4, Data-rate units, MRVL, Video game

SANTA CLARA, Calif., March 25, 2024 /PRNewswire/ -- Marvell Technology, Inc. (NASDAQ: MRVL), a leader in data infrastructure semiconductor solutions, today announced Marvell® Nova 2, the industry's first 1.6 Tbps PAM4 optical DSP featuring 200 Gbps electrical and optical interfaces to meet the escalating performance demands of accelerated infrastructure, generative AI, and high-performance computing.

Key Points: 
  • Marvell also announced that the flagship Nova optical DSP, a 1.6 Tbps device with 100 Gbps electrical and 200 Gbps optical interfaces announced last year, is now generally available.
  • The Nova family leverages four generations of proven industry leading PAM4 optical DSP technology from Marvell.
  • Key features of the Nova 2 electro-optics platform include:
    200 Gbps per lane line-side receiver with companion Marvell TIAs, providing best-in-class linearity and low noise
    The Marvell 1.6T Nova 2 optical DSP with 200 Gbps electrical and optical interfaces is sampling in the second quarter of 2024 to select customers.
  • The Marvell 1.6T Nova optical DSP with 100 Gbps electrical and 200 Gbps optical interfaces is generally available.