Associated tags: Korea Exchange, Dynamic random-access memory, SK, DRAM, Computer data storage, SK Hynix
Locations: GB, READING, NEW YEAR, SOUTH KOREA, SK, SEOUL, INDIANA
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Medical device Performance degradation over time improved, while lifetime increased by 40%
Key Points:
- Performance degradation over time improved, while lifetime increased by 40%
SEOUL, South Korea, May 8, 2024 /PRNewswire/ -- SK hynix Inc. (or "the company", www.skhynix.com ) announced today that it has developed the Zoned UFS, or ZUFS* 4.0, a mobile NAND solution product for on-device** AI applications.
- SK hynix said that the ZUFS 4.0, optimized for on-device AI from mobile devices such as smartphones, is the industry's best of its kind.
- Following provision of the prototypes of ZUFS, SK hynix and the customer jointly developed the 4.0 product that qualifies the specifications by the Joint Electron Device Engineering Council, or JEDEC.
- SK hynix will commence mass production of the ZUFS 4.0 in the third quarter with an aim to provide to various on-device AI smartphones by global companies.
SK hynix forecasts the overall memory market to be on a steady growth path in coming months as demand for AI memory continues to rise, while the market for the conventional DRAM also starts to recover from the second half.
Key Points:
- SK hynix forecasts the overall memory market to be on a steady growth path in coming months as demand for AI memory continues to rise, while the market for the conventional DRAM also starts to recover from the second half.
- For the NAND business, SK hynix will seek product optimization to sustain the trend of earnings recovery.
- SK hynix will aggressively increase the sales of both high-performance 16-channel eSSD, an area where the company has a technological edge, and QLC-based high-capacity eSSD by its U.S. subsidiary Solidigm.
- "We will continue to work towards improving our financial results by providing the industry's best performing products at a right time and maintaining the profitability-first commitment."
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TSV SK hynix said the collaboration between the global leader in the AI memory space and TSMC, a top global logic foundry, will lead to more innovations in HBM technology.
Key Points:
- SK hynix said the collaboration between the global leader in the AI memory space and TSMC, a top global logic foundry, will lead to more innovations in HBM technology.
- That also helps SK hynix produce customized HBM that meets a wide range of customer demand for performance and power efficiency.
- SK hynix and TSMC also agreed to collaborate to optimize the integration of SK hynix's HBM and TSMC's CoWoS®** technology, while cooperating in responding to common customers' requests related to HBM.
- "TSMC and SK hynix have already established a strong partnership over the years.
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Policy WEST LAFAYETTE, Ind., April 03, 2024 (GLOBE NEWSWIRE) -- SK hynix Inc. announced Wednesday (April 3) that it plans to invest close to $4 billion to build an advanced packaging fabrication and R&D facility for AI products in the Purdue Research Park.
Key Points:
- WEST LAFAYETTE, Ind., April 03, 2024 (GLOBE NEWSWIRE) -- SK hynix Inc. announced Wednesday (April 3) that it plans to invest close to $4 billion to build an advanced packaging fabrication and R&D facility for AI products in the Purdue Research Park.
- “We are excited to build a state-of-the-art advanced packaging facility in Indiana,” said SK hynix CEO Kwak Noh-Jung.
- “SK hynix is the global pioneer and dominant market leader in memory chips for AI,” Purdue President Mung Chiang said.
- This historic announcement is the next step in Purdue University’s persistent pursuit of semiconductor excellence as part of the Purdue Computes initiative.
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Renewable energy The facility will also develop future generations of chips and house an advanced packaging R&D line.
Key Points:
- The facility will also develop future generations of chips and house an advanced packaging R&D line.
- “We are excited to build a state-of-the-art advanced packaging facility in Indiana,” said SK hynix CEO Kwak Noh-Jung.
- “We believe this project will lay the foundation for a new Silicon Heartland; a semiconductor ecosystem centered in the Midwest Triangle.
- The IEDC also committed up to $45 million through the Industrial Development Grant Fund to support infrastructure improvements surrounding the new plant.
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Dynamic random-access memory "I'm so proud to officially welcome SK hynix to Indiana, and we're confident this new partnership will enhance the Lafayette-West Lafayette region, Purdue University and the state of Indiana for the long term.
Key Points:
- "I'm so proud to officially welcome SK hynix to Indiana, and we're confident this new partnership will enhance the Lafayette-West Lafayette region, Purdue University and the state of Indiana for the long term.
- Senator Todd Young, a key advocate for the project, said, "SK hynix will soon be a household name in Indiana.
- "SK hynix is the global pioneer and dominant market leader in memory chips for AI," Purdue University President Mung Chiang said.
- It is also a monumental moment for completing the supply chain of digital economy in our country through chips advanced packaging.
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Video game The company expects a successful volume production of HBM3E, along with its experiences also as the industry's first provider of HBM3, to help cement its leadership in the AI memory space.
Key Points:
- The company expects a successful volume production of HBM3E, along with its experiences also as the industry's first provider of HBM3, to help cement its leadership in the AI memory space.
- Global big tech companies have been increasingly requiring stronger performance of AI semiconductor and SK hynix expects its HBM3E to be their optimal choice that meets such growing expectations.
- SK hynix's HBM3E also comes with a 10% improvement in heat-dissipation performance, compared with the previous generation, following application of the advanced MR-MUF** process.
- Sungsoo Ryu, Head of HBM Business at SK hynix, said that mass production of HBM3E has completed the company's lineup of industry-leading AI memory products.
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Thursday, February 29, 2024
SEOUL, South Korea, Feb. 29, 2024 /PRNewswire/ -- SK hynix Inc. (or "the company", www.skhynix.com) and Gauss Labs announced today that they participated in the SPIE AL* 2024, an international conference held in San Jose, California, and presented two papers based on the latest technology for AI-based metrology.
Key Points:
- In the paper "Model Aggregation for Virtual Metrology for High-Volume Manufacturing," Gauss Labs introduces "aggregated AOM*", an algorithm that increases the prediction accuracy of its AI-based virtual metrology solution, Panoptes VM (Virtual Metrology).
- In its second paper, "Universal Denoiser to Improve Metrology Throughput," Gauss Labs introduces a "universal denoiser", which removes random variations (noise) from CD-SEM* images.
- Through a series of extensive tests with SK hynix, Gauss Labs observed image acquisition time reduced to as much as ¼, compared to conventional technology.
- Gauss Labs states that this technology is expected to improve the productivity of metrology equipment by 42%.
Retrieved on:
Tuesday, February 6, 2024
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Sale *Recycled Materials: Materials extracted, recovered and reprocessed from pre-consumer waste generated in the manufacturing process before arrival at end users or from post-consumer waste disposed of after use.
Key Points:
- *Recycled Materials: Materials extracted, recovered and reprocessed from pre-consumer waste generated in the manufacturing process before arrival at end users or from post-consumer waste disposed of after use.
- Through this roadmap, SK hynix aims to raise the proportion of recycled materials used in the products currently manufactured by the company to 25% by 2025 and more than 30% (based on weight) by 2030.
- As part of the plan, SK hynix will start with essential metals for semiconductor production, such as copper, tin, and gold, and replace them with recycled materials.
- "These materials are not an offer for sale of the securities of SK hynix Inc. in the United States.
Retrieved on:
Wednesday, January 24, 2024
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Computer data storage SEOUL, South Korea, Jan. 24, 2024 /PRNewswire/ -- SK hynix Inc. (or "the company", www.skhynix.com) announced today that it recorded an operating profit of 346 billion won in the fourth quarter of last year amid a recovery of the memory chip market, marking the first quarter of profit following four straight quarters of losses.
Key Points:
- (Based on K-IFRS)
SK hynix said that the overall memory market conditions improved in the last quarter of 2023 with demand for AI server and mobile applications increasing and average selling price (ASP) rising.
- "We recorded the first quarterly profit in a year following efforts to focus on profitability," it said.
- For the year of 2024, SK hynix will focus on improving profitability and efficiency through sales of value-added products, while minimizing an increase in capital expenditure for a stable operation of the business.
- "We achieved a remarkable turnaround, marking the first operating profit in the fourth quarter following a protracted downturn, thanks to our technological leadership in the AI memory space," said Kim Woohyun, Vice President and Chief Financial Officer (CFO) at SK hynix.
